Suss MicroTec, Germany, has launched the fourth generation of its semi-automated Mask and Bond Aligners, including a new platform system and major improvements in alignment accuracy, ergonomic design, and further reduced cost of ownership.
The two platform types are configured differently, and consist of the MA/BA Gen4 for standard processes, and the MA/BA Gen4 Pro series for advanced high-end processes. By moving to this new platform concept, Suss MicroTec further optimizes the Mask Aligner product portfolio to better align with customer requirements.
The main application of the MA/BA Gen4 series is full-field lithography in academia, MEMS, 3D integration, and the compound semiconductor market. It handles processes such as bond alignment, fusion bonding, and SMILE imprint.
In addition to standard wafer processing, the MA/BA Gen4 series reliably processes delicate substrates, such as fragile, warped, or uneven surfaced wafers.
“Our new manual Mask Aligner series sets a high benchmark regarding cost efficiency, user friendliness, and leading edge process results,” says Dr. Per-Ove Hansson, CEO. “With this new platform concept, we further align with different customer requirements – the MA/BA Gen4 for standard lithography processes, or the leading edge MA/BA Gen4 Pro for small-series production and more-demanding solutions, e.g., our Soft Conformal Imprint Lithography (SCIL) solution.”
