FEI Co., Hillsboro, Ore., offers the Helios PFIB, said to be the world’s most advanced DualBeam Plasma FIB platform for large area deprocessing to enable electrical fault isolation of advanced process ICs and advanced failure analysis of 3D packages.
The Helios PFIB system combines the innovative Helios Elstar with UC technology electron column for high-resolution, high-contrast imaging. Its high-performance Vion Xenon plasma ion column provides fast and precise large area sample cross-sectioning and deprocessing. Combined with FEI’s proprietary Si Trenching, Dx and DE chemistries offer a unique Deprocess/Delayering solution for Electrical Fault Isolation of latest process technology devices. The Helios PFIB also offers optional Navigation and Inspection capabilities, such as infrared/visible light microscope and analytical capabilities such as EBSD and EDX.
The Helios PFIB DualBeam features FEI’s most recent advances in Plasma Focused Ion Beam and field emission SEM (FESEM) technologies and their combined use. FEI’s first plasma-based DualBeam is designed for high-throughput, large-volume processing, combined with extreme high-resolution imaging in both 2D and 3D. For large-scale cross-sectioning, large-volume 3D data collection, or large-scale patterning, the Helios Plasma FIB DualBeam provides the highest quality of data in the shortest time.
