Techcet CA LLC, San Diego, predicts that global revenues for semiconductor manufacturing and packaging materials will grow 5.7% year-over-year in 2020 to $49.5B, of which 65% represents semiconductor fab materials. The memory chip downturn in 2019 reduced total materials market revenues by 2.8% to $46.8B in 2019. However, the compound annual growth rate through 2023 is forecast at 3.5%, as detailed in the latest “Techcet Critical Materials Reports.”
At the 2019 Critical Materials Council (CMC) Seminar — held last October in Taiwan — representatives of 14 global chip-makers (including GlobalFoundries, Intel, Micron, Samsung, and TSMC) discussed ways to ensure electronic materials supply-chain robustness in an era of protectionist tariffs.
The public 2020 CMC Conference (April 23-24 in Hillsboro, Oregon) will follow private CMC meetings hosted by Intel that week. The keynote address on “Critical Materials Pushing the Limits for Semiconductor Manufacturing,” will be provided by Bruce Tufts, Vice President of Technology and Director of Fab Materials Organization at Intel. A new fourth Session on advanced packaging will highlight materials for chiplets in system-in-package (SiP) devices.
