Scientists at Tianjin University, China, have developed a pioneering nondestructive testing technology for micro-LED wafers, offering a much-needed solution to a long-standing industry challenge through a novel “soft-touch” approach.
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Siemens, Germany, is equipping its EDA tools with secure, advanced generative and agentic AI—including integration with NVIDIA NIM microservices and Nemotron models—to boost productivity, accelerate chip and PCB design innovation, and transform development workflows from concept to verification.
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SkyWater Technology, Blooington, Minn., completed its acquisition of Infineon Technologies AG’s 200 mm semiconductor fab in Austin, Texas (“Fab 25”), adding approximately 400,000 wafer starts per year in foundry capacity, to enhance its advanced technology services.
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Scientists worldwide are striving to scale quantum technologies, which hinges on reliably generating qubits—the basic units of quantum information. One promising material for this is hexagonal boron nitride (h-BN), a two-dimensional substance known for hosting solid-state single-photon emitters (SPEs). These atomic structures can emit individual photons, making them strong candidates for building scalable quantum systems.
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Applied Materials, Inc., Santa Clara, Calif., and CEA-Leti, France, announced the next phase of their longstanding collaboration to accelerate innovation in specialty semiconductors, expanding their joint lab and developing materials engineering solutions to address emerging infrastructure challenges in AI data centers.
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Scientists at the U.S. Department of Energy found two competing mechanisms that contribute to the deformation of nanosheet materials used in cutting-edge computer components.
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Andes Technology Corporation, Taiwan, and proteanTecs, Israel, have partnered to integrate proteanTecs’ on-chip monitoring IP into Andes’ RISC-V processor cores, enabling customers to enhance performance and reliability monitoring in advanced electronics.
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Keysight Technologies, Inc., Santa Rosa, Calif., has enhanced its double-pulse test portfolio enabling customers to benefit from accurate and easy measurement of the dynamic characteristics of wide-bandgap power semiconductor bare chips.
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Intel unveiled the new Intel Core Ultra (Series 2) processors, designed to revolutionize mobile computing featuring cutting-edge AI enhancements, increased efficiency, and performance improvements.
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The Department of Energy has announced funding $179 million for three Microelectronics Science Research Centers that bring together multi-institutional, multidisciplinary projects in partnership with industry organized around making microelectronics more energy efficient and able to operate better in extreme environments.
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Imina Technologies, Switzerland, is now the exclusive supplier of Electrical Failure Analysis solutions from point electronic GmbH, Germany.
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Researchers from North Carolina State University have developed a new technique for creating simple electronic device components that proved effective in recent tests, indicating that self-assembly for more complex electronics, such as 3D computer chips, could be possible.
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Synopsys, Inc., Sunnyvale, Calif., announced the industry’s first Ultra Ethernet IP and UALink IP solutions, including controllers, PHYs, and verification IP, to meet the demand for standards-based, high-bandwidth, and low-latency HPC and AI accelerator interconnects.
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Researchers at the Massachusetts Institute of Technology have developed a technique to create a multilayered chip with alternating layers of high-quality semiconducting material grown directly on top of one another.
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TESCAN Group, a.s, Czech Republic, a leading global manufacturer of electron microscopes and advanced scientific instruments, has acquired EXpressLO LLC, Lehigh Acres, Fla., a provider of innovative FIB lift-out solutions for specimen preparation in STEM and other analytical techniques.
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In order to overcome a fundamental limit of silicon semiconductor technology that prevents transistors from operating below a certain voltage, Massachusetts Institute of Technology researchers fabricated a different type of three-dimensional transistor using a unique set of ultrathin semiconductor materials.
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HORIBA STEC, Co., Ltd., Japan, released the fully automated thin film inspection system, Xtrology, that combines spectroscopic ellipsometry, Raman spectroscopy, and photoluminescence sensors making it possible to perform important inspections, such as film thickness measurement, defect analysis, and composition analysis of various wafers with a single instrument.
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A team of academic and enterprise researchers at Penn State has developed a synthesis process to produce a “rust-resistant” coating with additional properties ideal for creating faster, more durable electronics.
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Cornell University researchers, Ithaca, N.Y., in collaboration with a team at the Polish Academy of Sciences, have developed the first dual-sided – or “dualtronic” – chip that combines photonic and electronic functions simultaneously, an innovation that could shrink the size of functional devices, make them more energy efficient and reduce manufacturing costs.
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Nearly $5 million has been awarded to 17 small businesses across nine states under the Small Business Innovation Research Program to fund projects exploring innovative metrology, measurement services, tools, and instrumentation, marking the first award for the CHIPS Research and Development Office in support of the U.S. semiconductor ecosystem.
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Researchers on a team led by University of Michigan unveiled that phase separation, alongside oxygen diffusion, crucially supports the long-term retention of information in memristors, specifically in resistive random access memory.
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For the first time, researchers at Sandia National Laboratories, Albuquerque, N. M., have used silicon photonic microchip components to perform a quantum sensing technique called atom interferometry, an ultra-precise way of measuring acceleration and the latest milestone toward developing a kind of quantum compass for navigation when GPS signals are unavailable.
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Engineers at the University of Pennsylvania, Philadelphia, developed a new chip that uses light waves rather than electricity to perform the complex math essential to training AI.
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Amkor Technology Inc., Tempe, Ariz., signed a preliminary agreement with the U.S. Department of Commerce for up to $400 million in funding under the CHIPS and Science Act to create a new $2 billion semiconductor packaging facility in Peoria, Arizona, the largest outsourced advanced packaging and test facility in the United States, generating approximately 2,000 jobs.
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Oxford Instruments plc, United Kingdom, a leading provider of high technology products and services to industry and scientific research communities, completed the acquisition of FemtoTools AG, Switzerland. The acquisition was first announced on 11 June 2024, and has been completed following the satisfactory conclusion of closing conditions.
FemtoTools specializes in measuring and imaging the properties (primarily the hardness and stiffness) of materials for research and semiconductor applications at very high resolution via a technique called nanoindentation. It joins Oxford Instruments’ Imaging & Analysis division, where its products will be sold in conjunction with the Group’s existing range of materials analysis tools, including electron microscope micro-analyzers and Raman microscopes.
Richard Tyson, chief executive officer, Oxford Instruments plc, said: “We are delighted to have completed the acquisition of FemtoTools. We welcome our new colleagues and look forward to working with them to integrate nanoindentation – a new technique to Oxford Instruments – into our extensive portfolio of materials analysis capabilities.”
Christian Lang, managing director, Materials Analysis, Oxford Instruments plc, said: “We’re so pleased that the FemtoTools team have chosen to join Oxford Instruments. We’ve had a number of very positive meetings since the announcement and are already making plans for our future together.
“I’m looking forward to integrating FemtoTools’ brilliant technology into our wider product range, and to working with this talented group of people.”
Felix Beyeler, co-founder of FemtoTools, said: “The team and I are very excited for the journey ahead as part of Oxford Instruments. Working together will enable us to extend the reach of our technology and provide even richer analysis to our combined customer base. We’re also looking forward to learning from the hugely experienced Oxford Instruments team.”
For more information:
Oxford Instruments plc
https://www.oxinst.com
Kyocera Corporation, Japan, launched a new Peltier (thermoelectric) module that boasts a maximum heat absorption rate 21% higher than its conventional products, significantly enhancing cooling performance for applications such as automotive battery and seat temperature control.
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The U.S. Department of Energy’s Argonne National Laboratory joined with Purdue University, West Lafayette, Ind., to identify collaborative areas in technology and research as a springboard for new joint microelectronics projects, taking a multidisciplinary approach to studying everything from materials and devices to software and manufacturing techniques.
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TESCAN GROUP, a.s., Czech Republic, completed its acquisition of TESCAN KOREA, Ltd. and Daeil Microanalysis Laboratory, after two decades of successful collaboration consolidating efforts to better serve the Korean customers and market, particularly in the semiconductor domain.
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To reduce unsustainably high levels of e-waste, an expert in green chemistry at Swedish research institute Research Institutes of Sweden has switched his focus from pulp to wood in a bid to make consumer electronic devices that have no carbon footprint and are easier to recycle.
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Researchers at University of Pennsylvania demonstrated memory technology capable of enduring temperatures as high as 600° Celsius—more than twice the tolerance of any commercial drives on the market—and these characteristics were maintained for more than 60 hours, indicating exceptional stability and reliability.
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