Scientists at Lawrence Berkeley National Laboratory, Berkeley, Calif., developed microcapacitors with ultrahigh energy and power density, paving the way for on-chip energy storage in electronic devices.
Continue readingSamsung develops industry’s fastest 10.7Gbps LPDDR5X DRAM, optimized for AI applications
Samsung Electronics, South Korea, a world leader in advanced memory technology, developed the industry’s first LPDDR5X DRAM supporting the industry’s highest performance of up to 10.7 gigabits-per-second.
Continue readingSkyWater and Lumotive announce qualification and production start for world’s first commercially available optical beamforming chip
SkyWater Technology, Bloomington, Minn., the trusted technology realization partner, and Lumotive, Redmond, Wash., a pioneer in optical semiconductor technology for 3D sensing, announced a collaboration on the production implementation of Lumotive’s groundbreaking solid-state optical beamforming technology in SkyWater’s manufacturing environment.
Continue readingLam Research introduces breakthrough deposition technique to enable next-generation MEMS for 5G and beyond
Lam Research Corp., Fremont, Calif., introduced the world’s first production-oriented pulsed laser deposition tool to enable next-generation MEMS-based microphones and radio frequency filters.
Continue readingSynopsys to acquire Ansys, creating a leader in silicon to systems design solutions
Synopsys, Sunnyvale, Calif., and Ansys, Canonsburg¸Pa., announced that they have entered into a definitive agreement under which Synopsys will acquire Ansys.
Continue readingTSMC and Synopsys bring breakthrough NVIDIA computational lithography platform to production
NVIDIA, Santa Clara, Calif., announced that TSMC, Taiwan, and Synopsys, Sunnyvale, Calif., are going into production with NVIDIA’s computational lithography platform to accelerate manufacturing and push the limits of physics for the next generation of advanced semiconductor chips.
Continue readingTime-resolved emission microscopy for circuit evaluation and failure analysis
The National Institute of Standards and Technology ongoing project will improve time-resolved-emission microscopy by tailoring its’ single-photon detectors and scaling up these sensors to the megapixel level.
Continue readingSigray releases XADA-200 first commercial x-ray system for debugging backside power delivery circuits
Sigray, Concord, Calif., released the first commercial x-ray assisted device alteration tool that enables circuit debugging of emerging backside power delivery architectures.
Continue readingIntel Core Ultra ushers in the Age of the AI PC
Intel, Santa Clara, Calif., launched its Intel Core Ultra mobile processors that deliver reimagined power efficiency, world-class compute and graphics performance and the best AI PC experience to mobile platforms and out to the edge.
Continue readingBruker acquires electron microscopy company Nion
Bruker recently announced that it has acquired Nion, a privately-held company that develops and manufactures innovative high-end scanning transmission electron microscopes (STEM). Nion was the first company to introduce aberration correction for STEM instruments with ultra-high stability for highest resolution images, and Nion is the world leader in ultra-high energy and spatial resolution electron energy-loss spectroscopy (EELS). This acquisition enhances Bruker’s product offerings and technology portfolio in materials science research and provides the technology base for applications in electron diffraction crystallography. In 2023, Nion had approximately $8 million in revenue. Financial details of the transaction were not disclosed.
Located in Kirkland, WA, Nion was founded in 1997 by Dr. Ondrej Krivanek and Dr. Niklas Dellby. Under their leadership, Nion developed into a premier provider for high-end STEMs for researchers in materials science research worldwide.
“We are excited to add the high-end STEM products, the electron microscopy technology, and this new expertise of Nion to Bruker,” said Dr. Frank Burgaezy, the Bruker AXS division president. “Nion has unique products for the most demanding research applications in materials science electron microscopy, and Bruker will offer Nion global market reach as well as collaborations on new developments to enter new applications in electron diffraction crystallography based on Nion electron microscope and Bruker crystallography technologies.”
“With the introduction of aberration correction and ultra-high energy resolution EELS, Nion has revolutionized STEM technology. With our products we have established an excellent reputation among leading scientists around the globe as a provider of high-end STEM products,” added Dr. Ondrej Krivanek, co-founder of Nion. “Our work has given us unique insights into what researchers need. We are very gratified to join Bruker, an internationally esteemed instrumentation company, whose philosophy, culture, and reputation align very closely with our company culture and our research-oriented goals.”
For more information: Bruker
TSMC, Bosch, Infineon, and NXP establish joint venture to bring advanced semiconductor manufacturing to Europe
TSMC, Robert Bosch GmbH, Infineon Technologies AG, and NXP Semiconductors N.V. announced a plan to jointly invest in European Semiconductor Manufacturing Company GmbH, in Dresden, Germany to construct a fab there and provide advanced semiconductor manufacturing services.
Continue readingWith PowerVia, Intel achieves a chipmaking breakthrough
Intel Corporation, Santa Clara, Calif., devised a process to manufacture, test, and demonstrate positive performance results with its new backside power solution called PowerVia, enabling chipmaking to go two-sided for the first time.
Continue readingStretching metals allows researchers to create materials for quantum, electronic, and spintronic applications
A University of Minnesota-led team has developed a first-of-its-kind, breakthrough method that makes it easier to create high-quality metal oxide thin films out of “stubborn” metals that have historically been difficult to synthesize in an atomically precise manner.
Continue readingNew material offers more durable, sustainable multi-level non-volatile phase change memory
Scientists have achieved a breakthrough in the development of non-volatile phase change memory.
Continue readingMidwest Microelectronics Consortium selected as Microelectronics Innovation Hub
The Midwest Microelectronics Consortium, a multi-state, regional initiative led by Ohio and dedicated to advancing the research and production of crucial microelectronics for the defense industry, was awarded regional hub designation and $24.3 million for FY 23 through the prestigious Microelectronics Commons program.
Continue readingU.S. government awards GlobalFoundries new $3.1 Billion, 10-year contract for secure chip manufacturing
The U.S. Department of Defense has awarded GlobalFoundries, Malta, New York, a new 10-year contract for a supply of securely manufactured, U.S.-made semiconductors for use across a wide range of critical aerospace and defense applications.
Continue readingPlumbing the depths of thermoelectrics in search of novel materials
In the search for thermoelectric materials with the best possible properties, a research team at the Vienna University of Technology (TU Wien) investigated various metallic alloys.
Continue readingTuning a fundamental material property with an electronic coating
Researchers at the University of Southern California have developed a bilayer coating of an insulator and graphene on top of a semiconductor that can tune the energy required to eject electrons out of the material, potentially making electrochemical devices more efficient.
Continue readingMA-tek follows big clients as it expands
Materials Analysis Technology Inc., Taiwan, is setting up new laboratories in Kumamoto, Japan, and the US state of Arizona to support its “big clients,” and is eyeing more locations in the future amid the changing IC supply chain landscape.
Continue readingAccelerating sustainable semiconductors with ‘multielement ink’
Developed by researchers from Lawrence Berkeley National Laboratory (Berkeley Lab) and UC Berkeley, a new semiconducting material called “multielement ink” is the first “high-entropy” semiconductor that can be processed at low or room temperature, making the semiconductor purification and development process significantly less heat-intensive and more sustainable.
Continue readingNSF and partners invest $45 million in the future of semiconductors
The U.S. National Science Foundation announced 24 research and education projects to 47 institutions with a total investment of $45.6 million — including funding from the “CHIPS and Science Act of 2022” — to enable rapid progress in new semiconductor technologies and manufacturing as well as workforce development.
Continue readingNext generation semiconductors: diamond device shows highest breakdown voltage
Researchers at the University of Illinois Urbana-Champaign have developed a semiconductor device made using diamond, that has the highest breakdown voltage and lowest leakage current compared to previously reported diamond devices.
Continue readingWeebit Nano’s ReRAM IP Achieves high temperature qualification in SkyWater Technology’s S130 Process
Weebit Nano Limited, Israel, a leading developer of advanced memory technologies for the global semiconductor industry, and SkyWater Technology, Bloomington, Minn., the trusted technology realization partner, announced that Weebit’s Resistive Random-Access Memory IP module has been fully qualified in SkyWater’s 130nm CMOS process at temperatures of up to 125 degrees Celsius – the temperature specified for Grade-1 automotive applications.
Continue reading450-million-year-old organism finds new life in softbotics
Researchers from Carnegie Mellon University’s Department of Mechanical Engineering, along with paleontologists from Spain and Poland, have utilized fossil records to create a soft robotic model of Pleurocystitid. This marine organism, which lived about 450 million years ago, is thought to be among the earliest echinoderms that could move using a muscular stem.
The research seeks to broaden the modern perspective of animal design and movement by introducing a new field of study – Paleobionics – aimed at using Softbotics, robotics with flexible electronics and soft materials, to understand the biomechanical factors that drove evolution using extinct organisms.
“Softbotics is another approach to inform science using soft materials to construct flexible robot limbs and appendages. Many fundamental principles of biology and nature can only fully be explained if we look back at the evolutionary timeline of how animals evolved. We are building robot analogs to study how locomotion has changed,” said Carmel Majidi, lead author and Professor of Mechanical Engineering at Carnegie Mellon University.
With humans’ time on earth representing only 0.007% of the planet’s history, the modern-day animal kingdom that influences the understanding of evolution and inspires today’s mechanical systems is only a fraction of all creatures that have existed through history.
Using fossil evidence to guide their design and a combination of 3D printed elements and polymers to mimic the flexible columnar structure of the moving appendage, the team demonstrated that pleurocystitids were likely able to move over the sea bottom by means of a muscular stem that pushed the animal forward.
Despite the absence of a current-day analog (echinoderms have since evolved to include modern-day starfish and sea urchins), pleurocystitids have been of interest to paleontologists due to their pivotal role in echinoderm evolution.
The team determined that wide sweeping movements were likely the most effective motion and that increasing the length of the stem significantly increased the animals’ speed without forcing it to exert more energy.
“Researchers in the bio-inspired robotics community need to pick and choose important features worth adopting from organisms,” explained Richard Desatnik, PhD candidate and co-first author.
“Essentially, we have to decide on good locomotion strategies to get our robots moving. For example, would a starfish robot really need to use 5 limbs for locomotion or can we find a better strategy?” added Zach Patterson, CMU alumnus and co-first author.
Now that the team has demonstrated that they can use Softbotics to engineer extinct organisms, they hope to explore other animals, like the first organism that could travel from sea to land – something that can’t be studied in the same way using conventional robot hardware.
“Bringing a new life to something that existed nearly 500 million years ago is exciting in and of itself, but what really excites us about this breakthrough is how much we will be able to learn from it,” said Phil LeDuc, co-author, and Professor of Mechanical Engineering at Carnegie Mellon University. “We aren’t just looking at fossils in the ground, we are trying to better understand life through working with amazing paleontologists.”
For more information: Proceedings of the National Academy of Sciences
Image: A pleurocystitid fossil and pleurocystitid robot replica. Credit: Carnegie Mellon University College of Engineering.
ELES and proteanTecs partner to enhance reliability testing with deep data analytics
ProteanTecs, Israel, a global leader of deep data analytics for advanced electronics, and ELES, Italy, a worldwide provider of semiconductor device reliability testing solutions, announced their partnership for safety and mission-critical applications.
Continue readingResearchers develop approach that can enable inexpensive mass manufacturing of micro-LED displays
Researchers at the University of Strathclyde, Scotland, demonstrated a continuous roller printing process that can pick up and transfer over 75,000 micrometer-scale semiconductor devices in a single roll with very high accuracy, paving the way to creating large-scale arrays of optical components that could be used to rapidly manufacture micro-LED displays.
Continue readingArizona State University and Applied Materials to create ‘materials-to-fab’ center
Arizona State University, Tempe, AZ, and Applied Materials, Inc., Santa Clara, CA, announced an alliance, aided by the Arizona Commerce Authority, that brings more than $270 million to create a world-class shared research, development and prototyping facility, the Materials-to-Fab Center, in the university’s MacroTechnology Works building at ASU Research Park.
Continue readingArtificial neurons based on semiconductor technology
Artificial neural networks are a key technology in the domain of AI and machine learning. Many applications need the rapid parallel processing of vast amounts of data—with correspondingly high energy demand. A new project in which physicist Dr. Andreas Tittl plays an important role, is seeking to develop an energy-saving alternative through a specially tailored combination of materials science and photonics.
Continue readingEngineers use nanotechnology to harvest electricity ‘from thin air’
Engineers at the University of Massachusetts Amherst have developed a technique for harvesting electricity from air humidity, dubbed the “generic Air-gen effect.” According to research published in Advanced Materials, any material with nanopores less than 100 nanometers in diameter can be utilized to continuously generate electricity.
Continue readingUSI develops advanced failure analysis technology to meet high-level demands of SiP miniaturization products
Universal Scientific Industrial (Shanghai) Co., Ltd., China, developed an advanced electronic component failure analysis technology to meet the increasingly complex and diverse needs of system-in-package miniaturized products.
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