Synopsys, in collaboration with AMD, has been selected for the World Economic Forum’s MINDS (Meaningful, Intelligent, Novel, Deployable Solutions) AI program for their joint work in transforming chip design through AI-powered workflows.
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An E190 airliner had a slat failure on approach to Launceston, Tasmania, Australia after a torque tube was incorrectly installed during recent maintenance, an ATSB investigation report details.
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Advantest Corporation, Japan, and Tokyo Seimitsu Co., Ltd. announce plans to co-develop a new die-level prober, designed for the testing of high-performance computing devices.
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A joint research team at the Korea Advanced Institute of Science and Technology and IBM T. J. Watson Research Center, Yorktown Heights, N.Y., has developed a new analysis method that can detect “hidden defects” in semiconductors, electronic traps that interfere with electrical flow, with approximately 1,000 times higher sensitivity than existing techniques.
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Imina Technologies SA, Switzerland, released a new Nanoprobing High-Voltage Platform designed to safely apply voltages up to 1 kV through both nanoprobing tips and the backside of the sample, addressing the growing need for reliable electrical characterization of wide-bandgap and high-power semiconductor devices such as SiC- and GaN-based MOSFETs, IGBTs, and other devices.
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Oxford Instruments, UK, has been awarded a prestigious Institute of Physics Business Innovation Award for the development of BEX, a breakthrough analytical technique in scanning electron microscopes, enabling new capabilities and accelerating time to results by at least an order of magnitude.
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A research team led by National Institute for Materials Science, Japan, has, for the first time, produced nanoscale images of two key features in an ultra-thin material: twist domains (areas where one atomic layer is slightly rotated relative to another) and polarities (differences in atomic orientation) by combining scanning transmission electron microscopy with artificial intelligence.
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By studying the theoretical limits of how light can be used to perform computation, Cornell researchers have uncovered new insights and strategies for designing energy-efficient optical computing systems.
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Velo3D, Inc., Fremont, Calif., a leading additive manufacturing company for mission-critical metal parts, and Linde AMT, Speedway, Ind., (formerly known as Praxair Surface Technologies), a global leader in metal powders and coatings, have signed an agreement to supply domestically produced CuNi (70-30 Copper-Nickel) powder in support of the U.S. Navy and the Maritime Industrial Base Program.
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Industrial Info Resources, Sugar Land, Texas, reports that several technology providers for high-capacity power-generation projects, including those catering to the growing data-center market, are reporting a dramatic growth in U.S. gas-turbine orders.
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ATL Turbine Services, Scotland, has expanded its technological capabilities by investing in the Surface Two thermal spray system from Oerlikon, Switzerland.
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Chromalloy, Palm Beach Gardens, Fla., a global leader in the aerospace engine aftermarket, has received Federal Aviation Administration parts manufacturer approval for its CFM56-5B/7B high pressure turbine blade.
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Tescan Group, Czech Republic, acquired FemtoInnovations, a leading innovator in ultrafast laser technologies, and created a new dedicated Laser Technology Business Unit headquartered at the University of Connecticut Tech Park that expands Tescan’s correlative and multimodal portfolio for semiconductor, biomedical device manufacturing, and advanced research markets.
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New technology and foundry partnership between GlobalFoundries, Malta, NY., and Navitas Semiconductor, Torrance, Calif., expands U.S. capacity for advanced GaN technology, design, and at-scale manufacturing to support a wide range of power management applications.
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Researchers at the FAMU-FSU College of Engineering and Florida State University’s Center for Advanced Power Systems and the National High Magnetic Field Laboratory developed a cable design that uses multiple strands of superconducting tape, minimizing the chance of failure from defective spots within a wire.
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Shimadzu Corporation, Japan, launched the inspeXio 7000 microfocus X-ray CT system, a high-end industrial model that builds on the high-resolution, high-contrast imaging capabilities of its predecessor while offering improved image quality through new scanning modes and a larger maximum sample capacity.
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A team led by Lawrence Berkeley National Laboratory and George Washington University have confirmed that atoms in semiconductors will arrange themselves in distinctive localized patterns that change the material’s electronic behavior.
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The U.S. National Science Foundation has selected Purdue Engineering-led Chipshub, West Lafayettes, Ind., as its Chip Design Hub by providing a $7 million grant over five years.
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A University of Nebraska-Lincoln engineering team, led by Eric Markvicka and graduate students Ethan Krings and Patrick McManigal, has advanced the development of soft robotics and wearable systems that mimic the self-healing properties of human and plant skin.
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Researchers from Boston University, UC Berkeley, and Northwestern University have developed the first chip that integrates electronic, photonic, and quantum components, fabricated using a standard 45-nanometer semiconductor process.
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Scientists at Tianjin University, China, have developed a pioneering nondestructive testing technology for micro-LED wafers, offering a much-needed solution to a long-standing industry challenge through a novel “soft-touch” approach.
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Siemens, Germany, is equipping its EDA tools with secure, advanced generative and agentic AI—including integration with NVIDIA NIM microservices and Nemotron models—to boost productivity, accelerate chip and PCB design innovation, and transform development workflows from concept to verification.
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SkyWater Technology, Blooington, Minn., completed its acquisition of Infineon Technologies AG’s 200 mm semiconductor fab in Austin, Texas (“Fab 25”), adding approximately 400,000 wafer starts per year in foundry capacity, to enhance its advanced technology services.
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Johnson Matthey, London, England announced that the platinum market will remain in deficit in 2025 while palladium moves back into balance, according to its 2025 PGM Market Report released ahead of London Platinum & Palladium Market week. The company forecasts a 3% decline in primary platinum output due to operational restructuring, extreme weather and maintenance in South Africa, with secondary supplies subdued globally except in China, where a renewed trade-in incentive scheme is boosting scrap returns. Industrial platinum demand is expected to grow modestly, driven by capacity expansions in chemicals, fibreglass, biofuels and synthetic fuels, even as automotive use declines 5% amid the shift to battery electric powertrains.
Palladium, which faced structural deficits from 2012 to 2024, should reach equilibrium in 2025 as stronger recycling in China offsets reduced primary output from South Africa and the U.S., despite weaker scrap flows elsewhere, and a 5% drop in automotive palladium use.
The rhodium market is forecast to stay in deficit after South African supply falls and auto consumption dips, while industrial demand rebounds with normalized glass-industry purchasing. Ruthenium demand is set to climb 2% on data-centre expansions and robust chemical catalyst use, likely resulting in a significant shortfall without further inventory drawdowns. A slight rise in iridium production should help balance that market, as lower chemical usage is offset by increased crucible demand.
Rupen Raithatha, market research director, noted that uncertainty over U.S. import tariffs could weaken vehicle output and scrap volumes, posing downside risks. Margery Ryan, advocacy and market development manager, added that increased defence spending may drive additional PGM demand given their vital role in military and aerospace technologies.
Thermoelectric materials like germanium telluride (GeTe) can convert waste heat into electricity, offering a promising energy solution. To better harness this potential, researchers used a novel “neutron camera” technique to study GeTe’s structure. They found that while GeTe maintains its overall crystalline form—essential for conducting electricity—it also exhibits dynamic disorder, where parts of the structure move and slow heat conduction. This unique combination enhances thermoelectric efficiency, making GeTe a strong candidate for advanced solid-state devices like heat pumps and generators. The study also resolved previous inconsistencies in structural measurements.
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Scientists worldwide are striving to scale quantum technologies, which hinges on reliably generating qubits—the basic units of quantum information. One promising material for this is hexagonal boron nitride (h-BN), a two-dimensional substance known for hosting solid-state single-photon emitters (SPEs). These atomic structures can emit individual photons, making them strong candidates for building scalable quantum systems.
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Applied Materials, Inc., Santa Clara, Calif., and CEA-Leti, France, announced the next phase of their longstanding collaboration to accelerate innovation in specialty semiconductors, expanding their joint lab and developing materials engineering solutions to address emerging infrastructure challenges in AI data centers.
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Scientists at the U.S. Department of Energy found two competing mechanisms that contribute to the deformation of nanosheet materials used in cutting-edge computer components.
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University of Michigan engineers developed a modified manufacturing process for electric vehicle batteries—using a stabilizing electrode coating and microscale channels—that could enable high ranges and fast charging in cold weather, solving problems that are turning potential EV buyers away.
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Andes Technology Corporation, Taiwan, and proteanTecs, Israel, have partnered to integrate proteanTecs’ on-chip monitoring IP into Andes’ RISC-V processor cores, enabling customers to enhance performance and reliability monitoring in advanced electronics.
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