The Elmet Group Co., Portland, Maine, has agreed to acquire ams OSRAM’s tungsten and molybdenum operations in Schwabmünchen, Germany, establishing its first EU production footprint for refractory metal components.
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SMART Photonics has partnered with GlobalFoundries to offer a new open access foundry service combining GlobalFoundries’ silicon platform with SMART Photonics’ indium phosphide photonic integrated circuits.
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Rigaku Corporation, Japan, a global solutions partner in X-ray analytical systems, launched the CT Lab HR160, a high-resolution X-ray computed tomography system for battery, semiconductor devices, electronic components, and advanced materials analysis.
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PerkinElmer, Shelton, Conn., and Covalent, Sunnyvale, Calif., announced a strategic collaboration to advance failure analysis and materials characterization for semiconductor, electronics, and battery industries.
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Japan’s Shimadzu Corporation fully acquired Czech electron microscopy pioneer Tescan, marking an important milestone in Tescan’s continued growth and evolution.
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Researchers at the University of Tokyo, Japan, have synthesized highly uniform semiconducting nanotubes just 1 nanometer wide by growing molybdenum disulfide inside protective boron nitride tubes, validating decades-old theoretical predictions and offering a new path for miniaturized electronic devices.
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Bruker Corporation, Billerica, Mass., announced accelerated development of its photothermal AFM-IR spectroscopy capabilities to address research challenges facing the semiconductor industry as device architectures continue to shrink and systems become increasingly more complex.
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Camtek Ltd., Israel, a leading developer and manufacturer of inspection and metrology equipment for the semiconductor industry, has signed a definitive agreement to acquire Visual Layer, a Tel Aviv-based AI company specializing in visual analytics.
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Researchers at The University of Osaka, Japan, have developed an outdoor wireless EEG transmission system using energy harvested from the temperature difference between the human body and surrounding air, even under hot summer conditions.
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QuantumDiamonds GmbH, Germany, deployed its QDm.1 quantum sensing system at Integrated Service Technology (iST) in Taiwan, marking its first installation in Asia and a step toward adoption in high-volume semiconductor failure analysis.
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Applied Materials, Santa Clara, Calif., has introduced two new deposition systems—the Precision Selective Nitride PECVD and the Trillium ALD—designed to provide the atomic-level precision necessary for manufacturing the complex 3D Gate-All-Around transistors required for next-generation 2nm logic chips and AI infrastructure.
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Advanced microscopy research at the US Department of Energy μ-ATOMS Energy Frontier Research Center reveals motifs of trace atoms in semiconductors, paving the way for new microelectronics designed atom by atom.
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MIT engineers have developed a soft, flexible gel that dramatically changes its conductivity upon the application of light, a development that could impact human-machine interfaces, biocompatible devices, soft robotics, and more.
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CVD Equipment Corporation, Central Islip, entered into a definitive agreement under which the Company’s Stainless Design Concepts (“SDC”) business division will become part of Atlas Copco Group, Sweden.
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Applied Materials, Inc., Santa Clara, Calif., introduced a new defect review system to help semiconductor manufacturers continue pushing the limits of chip scaling combining the industry’s most sensitive electron beam technology with advanced AI image recognition to enable better and faster analysis of buried nanoscale defects.
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Backblaze, Inc., San Mateo, Calif., published its 2025 Year-End Drive Stats report that analyzes the performance of 344,196 hard drives across 30 models and found the annual failure rate drops to 1.36% across 344,000+ drives and high-capacity models are on the rise as first 26TB drives enter service.
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Optotherm, Inc., Warrandale, Pa., a designer and manufacturer of infrared imaging components and systems, released the MW640-15, a high-sensitivity MWIR thermal imaging camera designed for front and backside IC failure analysis, lock-in thermography, and microscopic temperature measurement.
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New research from the Department of Energy’s Oak Ridge National Laboratory found that applying an electric field to a ceramic material removes barriers to phonon transport, conducting heat almost three times more efficiently along the field direction, challenging conventional understanding about controlling heat flow in solid materials.
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Researchers at Brookhaven National Laboratory have developed a new X-ray tomography method called the perception fused iterative tomography reconstruction engine (PFITRE), a novel approach that combines the physics of X-rays with the power of artificial intelligence (AI).
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Rising power densities in AI data centers are forcing a shift to liquid cooling and service-based models, sparking debate over outsourcing versus addressing core infrastructure and maintenance.
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Researchers at several Chinese institutions, led by the Chinese Academy of Sciences, have developed a 3D electrical imaging technique that enables direct observation of how charge moves through perovskite films.
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Governor Greg Abbott announced that a Texas Semiconductor Innovation Fund grant of $4,162,550 has been extended to Arm Inc. for an expansion of their Austin campus to include a new semiconductor lab with failure analysis capabilities.
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Synopsys, in collaboration with AMD, has been selected for the World Economic Forum’s MINDS (Meaningful, Intelligent, Novel, Deployable Solutions) AI program for their joint work in transforming chip design through AI-powered workflows.
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Advantest Corporation, Japan, and Tokyo Seimitsu Co., Ltd. announce plans to co-develop a new die-level prober, designed for the testing of high-performance computing devices.
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A joint research team at the Korea Advanced Institute of Science and Technology and IBM T. J. Watson Research Center, Yorktown Heights, N.Y., has developed a new analysis method that can detect “hidden defects” in semiconductors, electronic traps that interfere with electrical flow, with approximately 1,000 times higher sensitivity than existing techniques.
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Researchers from the Institute of Metal Research of the Chinese Academy of Sciences have developed an innovative flexible sensor that can simultaneously detect strain, strain rate, and temperature using a single active material layer, representing a significant advance in multimodal sensing technology.
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Imina Technologies SA, Switzerland, released a new Nanoprobing High-Voltage Platform designed to safely apply voltages up to 1 kV through both nanoprobing tips and the backside of the sample, addressing the growing need for reliable electrical characterization of wide-bandgap and high-power semiconductor devices such as SiC- and GaN-based MOSFETs, IGBTs, and other devices.
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Researchers at Oak Ridge National Laboratory, Oak Ridge, Tenn., modified a commercial atomic force microscope with artificial intelligence to assemble and detect patterns in bismuth ferrite and analyze defects at the materials’ surface, advancing the understanding of these materials and enabling innovative data storage and computation methods.
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A research team from Tokyo University of Science, Japan, has developed an automated artificial intelligence-based approach for analyzing X-ray absorption spectroscopy data to establish a clear and objective link between a material’s spectral data and its underlying material properties.
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New technology and foundry partnership between GlobalFoundries, Malta, NY., and Navitas Semiconductor, Torrance, Calif., expands U.S. capacity for advanced GaN technology, design, and at-scale manufacturing to support a wide range of power management applications.
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