Semiconductor test equipment supplier Advantest Corporation, Japan, announced the T5801 Ultra-High-Speed DRAM Test System to support the latest advancements in high-speed memory technologies —including GDDR7, LPDDR6, and DDR6— critical to meeting the growing demands of artificial intelligence, high-performance computing, and edge applications.
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Imec, Belgium, a world-leading research and innovation hub in nanoelectronics and digital technologies, has announced a significant milestone in silicon photonics with the successful demonstration of electrically-driven GaAs-based multi-quantum-well nano-ridge laser diodes fully, monolithically fabricated on 300 mm silicon wafers in its CMOS pilot prototyping line.
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Nikon Corporation, Japan, launched the NEXIV VMF-K Series, a next-generation video measuring system designed to meet the increasing demands of semiconductor and electronic component inspection while significantly improving measurement throughput.
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Intel unveiled the new Intel Core Ultra (Series 2) processors, designed to revolutionize mobile computing featuring cutting-edge AI enhancements, increased efficiency, and performance improvements.
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Imina Technologies, Switzerland, is now the exclusive supplier of Electrical Failure Analysis solutions from point electronic GmbH, Germany.
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Synopsys, Inc., Sunnyvale, Calif., announced the industry’s first Ultra Ethernet IP and UALink IP solutions, including controllers, PHYs, and verification IP, to meet the demand for standards-based, high-bandwidth, and low-latency HPC and AI accelerator interconnects.
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Researchers at the Massachusetts Institute of Technology have developed a technique to create a multilayered chip with alternating layers of high-quality semiconducting material grown directly on top of one another.
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Ironwood Electronics, Eagan, Minn., is now producing elastomer sockets which include a protective “P” layer that allows for more insertions by protecting the elastomer from erosion and debris build up, extending the life of the elastomers to 200,000 plus insertions.
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TESCAN Group, a.s, Czech Republic, a leading global manufacturer of electron microscopes and advanced scientific instruments, has acquired EXpressLO LLC, Lehigh Acres, Fla., a provider of innovative FIB lift-out solutions for specimen preparation in STEM and other analytical techniques.
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In order to overcome a fundamental limit of silicon semiconductor technology that prevents transistors from operating below a certain voltage, Massachusetts Institute of Technology researchers fabricated a different type of three-dimensional transistor using a unique set of ultrathin semiconductor materials.
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Researchers at the University of Minnesota have achieved a new artificially designed material that allows electrons to move faster while remaining transparent to both visible and ultraviolet light, breaking the previous record and being pivotal in making the next generation of high-power electronics faster, transparent and more efficient.
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Faraday Technology Corporation, Pittsburgh, Pa., a leading application specific integrated circuits (ASIC) design service and IP provider, is expanding its use of Ansys technology to enhance its capabilities in developing advanced designs for multi-die 2.5D/3D-ICs — critical for artificial intelligence (AI), IoT, and 5G applications. With support from Ansys, Faraday will empower its customers to explore more robust design options for more innovative products.
Faraday recently announced a 2.5D/3D-IC advanced package service to address exploding demand for multi-die designs that target products with better performance and lower power consumption. To meet this demand, engineers need the right multiphysics analysis tools to verify that chip designs include reliable signal and structural integrity and reliable power distribution before it goes to fabrication. This challenge is compounded by the trend toward developing denser chips that are more vulnerable to EM issues.
Adding RaptorX into the design flow will enable Faraday to increase precision and efficiency in its development process. Moreover, it enables predictively accurate EM modeling and analysis for advanced 3D-IC products, ensuring data transfer meets stringent modern standards. This will improve the design’s fidelity, enhance performance and reliability, and accelerate time-to-market.
“Our extensive silicon IP allows our customers to start designing from a solid foundation, enabling them to focus solely on innovation and differentiating themselves in the market,” said C.H. Chien, vice president of R&D at Faraday. “Fabrication is exceptionally expensive and there is no room for error. So, keeping the overall project cost low is paramount, and it starts with the initial design. With the addition of RaptorX in this phase, we can offer customers an efficient workflow that includes design verification and signoff as well as access to top-tier test and fabrication services, removing doubts about the chip’s performance and longevity.”
“Ansys’ focus on multiphysics platforms enables innovators like Faraday to address key challenges for 3D-IC and accelerate their time-to-market,” said John Lee, vice president and general manager of the semiconductor, electronics, and optics business unit at Ansys. “Our industry-leading tools facilitate meticulous modeling and analysis of electromagnetic phenomena, helping our customers remain at the forefront of technological advancements in 5G, AI, and IoT.”
Image – EMag extraction of an interposer lane, including 48 signals in the presence of their respective VDD/VSS network and indicative simulation results, and S-Parameter analysis and transient (eye diagram) analysis of a signal line.
For more information:
Ansys
Faraday Technology Corporation
Cornell University researchers, Ithaca, N.Y., in collaboration with a team at the Polish Academy of Sciences, have developed the first dual-sided – or “dualtronic” – chip that combines photonic and electronic functions simultaneously, an innovation that could shrink the size of functional devices, make them more energy efficient and reduce manufacturing costs.
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Researchers at the University of Illinois Urbana-Champaign discovered that ordered defect pairs in solution-deposited semiconductors lead to record-high transistor performance, challenging conventional wisdom in semiconductor manufacturing.
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Engineers at the University of Pennsylvania, Philadelphia, developed a new chip that uses light waves rather than electricity to perform the complex math essential to training AI.
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Amkor Technology Inc., Tempe, Ariz., signed a preliminary agreement with the U.S. Department of Commerce for up to $400 million in funding under the CHIPS and Science Act to create a new $2 billion semiconductor packaging facility in Peoria, Arizona, the largest outsourced advanced packaging and test facility in the United States, generating approximately 2,000 jobs.
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Oxford Instruments plc, United Kingdom, a leading provider of high technology products and services to industry and scientific research communities, completed the acquisition of FemtoTools AG, Switzerland. The acquisition was first announced on 11 June 2024, and has been completed following the satisfactory conclusion of closing conditions.
FemtoTools specializes in measuring and imaging the properties (primarily the hardness and stiffness) of materials for research and semiconductor applications at very high resolution via a technique called nanoindentation. It joins Oxford Instruments’ Imaging & Analysis division, where its products will be sold in conjunction with the Group’s existing range of materials analysis tools, including electron microscope micro-analyzers and Raman microscopes.
Richard Tyson, chief executive officer, Oxford Instruments plc, said: “We are delighted to have completed the acquisition of FemtoTools. We welcome our new colleagues and look forward to working with them to integrate nanoindentation – a new technique to Oxford Instruments – into our extensive portfolio of materials analysis capabilities.”
Christian Lang, managing director, Materials Analysis, Oxford Instruments plc, said: “We’re so pleased that the FemtoTools team have chosen to join Oxford Instruments. We’ve had a number of very positive meetings since the announcement and are already making plans for our future together.
“I’m looking forward to integrating FemtoTools’ brilliant technology into our wider product range, and to working with this talented group of people.”
Felix Beyeler, co-founder of FemtoTools, said: “The team and I are very excited for the journey ahead as part of Oxford Instruments. Working together will enable us to extend the reach of our technology and provide even richer analysis to our combined customer base. We’re also looking forward to learning from the hugely experienced Oxford Instruments team.”
For more information:
Oxford Instruments plc
https://www.oxinst.com
The U.S. Department of Energy’s Argonne National Laboratory joined with Purdue University, West Lafayette, Ind., to identify collaborative areas in technology and research as a springboard for new joint microelectronics projects, taking a multidisciplinary approach to studying everything from materials and devices to software and manufacturing techniques.
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Nano Dimension Ltd., Waltham, Mass., and Desktop Metal, Inc., Burlington, Mass., announced that they have entered into a definitive agreement under which Nano Dimension will acquire all outstanding shares of Desktop Metal.
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Federal agencies would be prohibited from using certain products if they were purchased from an entity other than the original manufacturer or an authorized reseller under a new bipartisan Senate bill.
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New research at the University of Kansas partially explains the exceptional performance of a new class of organic semiconductors called non-fullerene acceptors.
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TESCAN GROUP, a.s., Czech Republic, completed its acquisition of TESCAN KOREA, Ltd. and Daeil Microanalysis Laboratory, after two decades of successful collaboration consolidating efforts to better serve the Korean customers and market, particularly in the semiconductor domain.
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ElevATE Semiconductor, San Diego, Calif., and GlobalFoundries (GF) announced a manufacturing partnership for high-voltage chips produced at GF’s facility in Essex Junction, Vermont.
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Scientists at Los Alamos National Laboratory, N. M., and Tel Aviv University, Israel, have achieved a breakthrough in material science with the creation of “Chaco,” a revolutionary metamaterial named after the historical site Chaco Canyon in New Mexico.
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Researchers at Pohang University of Science and Technology, South Korea, have significantly enhanced the data storage capacity of ferroelectric memory devices using hafnia-based ferroelectric materials and an innovative device structure.
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To reduce unsustainably high levels of e-waste, an expert in green chemistry at Swedish research institute Research Institutes of Sweden has switched his focus from pulp to wood in a bid to make consumer electronic devices that have no carbon footprint and are easier to recycle.
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Samsung Electronics, South Korea, a world leader in advanced memory technology, developed the industry’s first LPDDR5X DRAM supporting the industry’s highest performance of up to 10.7 gigabits-per-second.
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Researchers at Kobe University, Japan, in partnership with National Chung Hsing University, Taiwan, developed a new electrical power converter design that provides considerably better efficiency at reduced cost and maintenance than before.
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Henkel, Germany, released a semiconductor capillary underfill encapsulant to address the unique requirements of the market’s most demanding advanced packages, like those used in artificial intelligence (AI) and high-performance computing (HPC) applications.
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Researchers at the University of Vermont developed microchips with a feature that combines anti-counterfeit with a function that causes them to self-destruct if an attempt is made to compromise them.
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