Shimadzu Corporation, Japan, launched the inspeXio 7000 microfocus X-ray CT system, a high-end industrial model that builds on the high-resolution, high-contrast imaging capabilities of its predecessor while offering improved image quality through new scanning modes and a larger maximum sample capacity.
Continue readingScientists create world’s first chip that combines 2D materials with conventional silicon circuitry
For the first time, scientists have created a fully functional memory chip only a few atoms thick and integrated it into conventional chips, an advance from Fudan University in China that could pave the way for more powerful and energy-efficient electronic devices.
Continue readingOxford Instruments launched witec360 Raman microscope with Hexalight spectrometer
Oxford Instruments’ Raman imaging team in England announced a refreshed core microscope line and a groundbreaking new spectrometer, Hexalight, which together with the witec360 microscope constitute the most advanced confocal Raman imaging system yet devised.
Continue readingSiemens unveils groundbreaking Tessent Analogtest software for automated analog circuit test generation
Siemens Digital Industries Software, Plano, Texas, introduced Tessent AnalogTest software – an innovative solution that reduces pattern generation time for analog circuit tests from months to days, enabling testing of analog circuitry in integrated circuits up to 100 times faster than traditional manual methods.
Continue readingTektronix introduces 7 Series DPO, setting a new benchmark in ultra-high-performance test and measurement
Tektronix, Beaverton, Ore., announced the 7 Series DPO oscilloscope, the first in a new generation of ultra-high-performance instruments, purpose-built for engineering teams and researchers pushing the boundaries of high-speed communications, high-energy physics, AI, and quantum computing.
Continue readingA prototype LED as thin as wallpaper that glows like the sun
Chinese researchers at Hefei University of Technology have created a paper-thin LED that gives off a warm, sun-like glow and could light up the next generation of phone and computer screens and other light sources.
Continue readingLam Research introduces VECTOR TEOS 3D to address critical advanced packaging challenges in chipmaking
The new inter-die gapfill tool from Lam Research Corp., Fremont, Calif., expands industry-leading portfolio of solutions for 3D integration and chiplet technologies; paves way for new, AI-accelerating architectures.
Continue readingThe world’s fastest microscope makes its debut
Researchers at the University of Arizona in Tucson have developed a laser-based microscope that snaps images at attosecond — or a billionth of a billionth of a second — speed.
Continue readingThe “soft side” of chips: NIST advances polymer science for semiconductor packaging
A new perspective article from NIST and collaborators highlights a critical but often underrated piece of the semiconductor revolution: the “soft” polymer-based packaging materials that hold advanced chips together that are emerging as important factors for reliability, performance, and cost.
Continue readingExosens expands technology portfolio
Exosens, France, extends its technology portfolio by signing an agreement to acquire Phasics, France, leader in high performance cameras based solutions for optical metrology.
Continue readingWorld’s first hybrid chip combines electronics, photonics, and quantum power
Researchers from Boston University, UC Berkeley, and Northwestern University have developed the first chip that integrates electronic, photonic, and quantum components, fabricated using a standard 45-nanometer semiconductor process.
Continue readingTexas Tech to earn $14M for advanced semiconductor power devices program
Texas Tech University’s Edward E. Whitacre Jr. College of Engineering, Lubbock, Texas, will earn $14 million from the U.S. Department of Defense Army Research Laboratory for an Advanced Semiconductor Power Devices Program that will develop reliable, high-performance and power electronic devices with wide and ultrawide bandgap semiconductors.
Continue readingGatan launches the EDAX Orbis II Micro-XRF system
Gatan, Inc., Pleasanton, Calif., launched the EDAX Orbis II System, designed to support a wide range of non-destructive elemental analysis that use micro x-ray fluorescence.
Continue readingCounterfeit electronics reports reach nine-year high amid expanding target base
A sharp uptick in reported counterfeit and nonconforming electronic components in 2024 has underscored a widening threat to component authenticity, according to the latest ERAI Annual Report.
Continue readingUnlocking SPAD technology for advanced imaging applications in microscopy and beyond
Carl Zeiss Microscopy GmbH, Germany, has acquired all equity shares of the Swiss company Pi Imaging Technology SA, developer of single-photon avalanche diode arrays and image sensors.
Continue readingSiemens turbocharges semiconductor and PCB design portfolio with generative and agentic AI
Siemens, Germany, is equipping its EDA tools with secure, advanced generative and agentic AI—including integration with NVIDIA NIM microservices and Nemotron models—to boost productivity, accelerate chip and PCB design innovation, and transform development workflows from concept to verification.
Continue readingSkyWater completes acquisition of Fab 25, expanding U.S. pure-play foundry capacity for critical semiconductor technologies
SkyWater Technology, Blooington, Minn., completed its acquisition of Infineon Technologies AG’s 200 mm semiconductor fab in Austin, Texas (“Fab 25”), adding approximately 400,000 wafer starts per year in foundry capacity, to enhance its advanced technology services.
Continue readingData transfer speeds increase significantly through new optical chip design
A team from the Center for Optics, Photonics and Lasers at Laval University, Quebec, Canada, has come up with an optical chip that can transfer massive amounts of data at ultra-high speed, offering unrivaled energy efficiency.
Continue readingApplied Materials and CEA-Leti expand joint lab to drive innovation in specialty chips
Applied Materials, Inc., Santa Clara, Calif., and CEA-Leti, France, announced the next phase of their longstanding collaboration to accelerate innovation in specialty semiconductors, expanding their joint lab and developing materials engineering solutions to address emerging infrastructure challenges in AI data centers.
Continue readingiST launches Global Smart Reliability Center to accelerate front-end validation for AI and EV applications
Integrated Service Technology Inc., Taiwan, a leading provider of electronic product verification and analysis services, launched its Global Smart Reliability Center, developed in response to the growing demand for early-stage reliability testing in AI, high-performance computing, and electric vehicle applications.
Continue readingFujitsu and RIKEN develop world-leading 256-qubit superconducting quantum computer
Fujitsu Limited and RIKEN have developed a cutting-edge 256-qubit superconducting quantum computer at the RIKEN RQC-FUJITSU Collaboration Center, building on the 64-qubit version launched in October 2023 with support from Japan’s Ministry of Education, Culture, Sports, Science and Technology (MEXT). This advancement incorporates high-density implementation techniques, marking a significant step toward practical applications of superconducting quantum computers to address complex global issues. Starting in the first quarter of fiscal 2025, the 256-qubit quantum computer will be integrated into a hybrid quantum computing platform and offered to companies and research institutions worldwide, enabling more complex analyses and sophisticated error correction algorithms.
Moving forward, both organizations will further enhance the platform’s usability by working to enable seamless collaboration between quantum and classical computers, enabling the efficient execution of hybrid quantum-classical algorithms.
Fujitsu and RIKEN’s 256-qubit superconducting quantum computer overcomes some key technical challenges, including appropriate cooling within the dilution refrigerator which is achieved through the incorporation of high-density implementation and cutting-edge thermal design. Other key features include:
1. Scalable 3D connection structure
- Enables efficient scaling of qubit count without requiring complex redesigns by arranging 4-qubit unit cells in a 3D configuration
- The 256-qubit machine utilizes the same unit cell design established in its 64-qubit predecessor, effectively demonstrating the scalability of this architectural approach
2. Quadrupled implementation density within dilution refrigerator
- Quadrupled implementation density achieved within the dilution refrigerator, allowing the 256-qubit machine to operate within the same cooling unit as the 64-qubit system
- Highly optimized design that carefully balances heat generation from control circuits with the cooling capacity of the refrigerator, while maintaining the necessary ultra-high vacuum and extremely low temperatures
Fujitsu is committed to accelerating the practical application of quantum computers from both hardware and software perspectives. Through its platform for hybrid quantum computing, Fujitsu will provide larger-scale quantum computers to global companies and research institutions conducting joint research in various fields, including finance and drug discovery.
Fujitsu and RIKEN will continue R&D efforts toward the launch of a 1,000-qubit computer, which is scheduled to be installed in a new building at Fujitsu Technology Park in 2026. In addition, the two organizations will extend the installation period of their Collaboration Center from March 2025 to March 2029, and will continue to work on the long-term R&D of technologies that will enable the realization of even larger superconducting quantum computers.
For more information: Fujitsu
Image: Newly developed 256-qubit superconducting quantum computer
Celera samples the first ever Analog IC completely designed by software
Celera, Alameda, Calif., the leader in fully automated, AI-enhanced analog design, is now sampling the first ever analog IC completely designed by an autonomous software platform.
Using Celera’s ChipHUB platform, the company improved engineering productivity by 10x, allowing the design of a high-performance buck (DC-to-DC) converter from specification to manufacturing release in a matter of days.
“This is a major milestone for Celera and an important breakthrough for our customers,” said Pat Brockett, Celera’s CEO. “Celera has demonstrated that end-to-end automated design of high-performance analog ICs can be done.”
“Using our patented digital twin Nesto technology, we enable our customers to achieve full custom analog IC design in days, at a fraction of the of the cost of current design methods,” said Alberto Viviani, Celera’s COO. “It’s very important to note that the resultant product designs are more than competitive with regard to die size (cost) and performance.”
Ramesh Giri, the head of product definition and applications at Celera highlighted a critical benefit to business managers – “Our design flow integrates an auto-generated behavioral model at the front-end that is tuned to actual silicon behavior. This allows system designers to do a comprehensive virtual bench road test, helping to reliably identify real-world system level issues at the front-end of the design process. This eliminates post-silicon fixes and enables faster time to market.”
“This first customer product is a state-of-the-art high voltage step down converter for industrial and automotive applications,” said Calum MacRae, CTO and founder at Celera. “Our Nesto technology simplifies analog IC design, enabling even non-IC designers to generate custom silicon. A huge benefit of our Nesto technology is that the same algorithm can be used to quickly produce whole families of buck converters in hours.”
Calum added, “Our IP is all in digital form. This allows us to train machine learning (ML) models, producing AI agents for analog design, layout, and modeling. The ability to generate large amounts of synthetic data positions Celera as the only company able to apply ML to analog design.”
“Celera’s patented technology will revolutionize the analog IC industry by making analog custom design available to all,” said Pat Brockett. “We are already engaged with major customers designing products for consumer, data center, wireless, industrial, solar and automotive applications. This is a real example where AI is changing a hundred-billion-dollar industry and we are proud to say Celera is leading that change.”
For more information:
Celera
https://www.celeratechnologies.com
Siemens opens $190M Fort Worth manufacturing hub to support AI infrastructure boom
Siemens, Germany, opened its $190 million electrical equipment manufacturing facility in Fort Worth, Texas. A part of the company’s Smart Infrastructure business, the site is responsible for creating reliable and efficient electrical equipment such as low-voltage switchboards necessary to meet the demand from the booming data center market and America’s AI growth.
The 500,000-square-foot facility has already introduced 480 new jobs and is on track to add a total of 800 roles by 2026. Tapping talent from the education sector to develop the critical manufacturing workforce of tomorrow, previous schoolteachers and principals are critical to Fort Worth facility’s employee training team. Their unique skillset has helped create curriculum that better serves different learning styles with innovative methods for both in and outside the classroom – resulting in quicker turnaround time of new employees from the classroom to the shop floor. Siemens brings new employees from the classroom through to a physical-learning lab before placing them on the production floor.
“Texas is the epicenter of innovation, where businesses and entrepreneurs can cast a vision and know they live in a state where they can achieve it,” said Governor Greg Abbott. “Siemens’ $190 million investment in an electrical equipment manufacturing facility in Fort Worth will create jobs for 800 Texans and help build critical infrastructure to meet Texas’ growing data center demand. Siemens will also provide critical job training to prepare Texans for these in-demand, good-paying jobs. By working together with companies like Siemens, Texas will continue to lead the world in manufacturing and innovation as we build a stronger, more prosperous state.”
Meeting Siemens’ goal to maintain assets that are net-zero carbon in operation by 2030, the Fort Worth facility is carbon-neutral and is setting the standard for sustainable manufacturing. Featuring an all-electrical powder-coat paint line, electric forklifts, low-energy-consuming HVAC systems, photovoltaic streetlights, advanced energy monitoring, and Breakthrough Energy-backed energy-efficient LuxWall windows, the Fort Worth facility is an archetype for the future of manufacturing – lowering cost and energy usage wherever possible.
Showcasing the future of industrial automation, the facility team utilized Siemens’ Digital Industries Software to optimize the production flow. Siemens Technomatix’s 3D models were used to simulate, validate, and commission the production process so the shop floor could be designed for higher production quality.
For more information:
Siemens Corporation
A surprise contender for cooling computers: Lasers
Minnesota-based startup Maxwell Labs has entered into a cooperative research and development agreement with Sandia and the University of New Mexico to demonstrate laser-based photonic cooling for computer chips that may help save energy and water.
Continue readingSelf-driving lab transforms materials discovery
Researchers at Argonne National Laboratory, Lemont, Ill., use Polybot, an AI-driven automated material laboratory, to produce high-conductivity, low-defect electronic polymer thin films.
Continue readingLifetime of semiconductor processing equipment parts can be checked in real time
Researchers at the Korea Research Institute of Standards and Science have developed a real-time diagnostic system for semiconductor plasma process parts which is expected to enhance yield, stability, and cost efficiency by preemptively preventing contaminant particles generated from component corrosion.
Continue readingAndes Technology and proteanTecs partner to bring performance and reliability monitoring to RISC-V cores
Andes Technology Corporation, Taiwan, and proteanTecs, Israel, have partnered to integrate proteanTecs’ on-chip monitoring IP into Andes’ RISC-V processor cores, enabling customers to enhance performance and reliability monitoring in advanced electronics.
Continue readingHamamatsu Photonics Korea completes new factory to boost production of semiconductor failure analysis equipment
Hamamatsu Photonics Korea Co., Ltd., a Korean subsidiary of Hamamatsu Photonics K.K., has completed a new factory in Hwaseong-si, South Korea, which will enhance its production capacity for semiconductor failure analysis equipment and expand global sales.
Continue readingKeysight enables dynamic test on a wide-bandgap power semiconductor bare chip
Keysight Technologies, Inc., Santa Rosa, Calif., has enhanced its double-pulse test portfolio enabling customers to benefit from accurate and easy measurement of the dynamic characteristics of wide-bandgap power semiconductor bare chips.
Continue reading3M joins consortium to accelerate semiconductor technology in the US
3M, St. Paul, Minn., is expanding its commitment to the semiconductor industry by joining the US-JOINT Consortium, a strategic partnership of 12 leading suppliers focused on advancing next-generation semiconductor technologies through research and development at a new Silicon Valley facility.
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