Industries and Applications Archives - Page 3 of 11

Analysis of 6,276 connectors for rooftop PV systems

Sandia National Labs researchers have created a new dataset on the rates and types of rooftop photovoltaic connector failures and published the first large-scale investigation of harvested PV connectors, drawing from a dataset of 6276 connectors from residential rooftop solar systems across the United States.

Toyota recalls over 1 million vehicles for camera problems

Toyota and Lexus have launched one of the year’s biggest recalls, affecting over a million vehicles from 2023–2026 due to a parking assist camera issue.

New inspeXio 7000 microfocus X-ray CT system delivers advanced imaging, powerful filters, and support for large components across multiple fields

Shimadzu Corporation, Japan, launched the inspeXio 7000 microfocus X-ray CT system, a high-end industrial model that builds on the high-resolution, high-contrast imaging capabilities of its predecessor while offering improved image quality through new scanning modes and a larger maximum sample capacity.

Startup enables 100-year bridges with corrosion-resistant steel

Allium Engineering, Billerica, Mass., founded by two MIT PhDs, is tripling the lifetime of bridges and other structures with a new technology that uses a stainless steel cladding to make rebar resilient to corrosion.

SECO/WARWICK India Wins New Contract as Shital Vacuum Treat Adds Third Vacuum Furnace

SECO/WARWICK India has secured a new order from Shital Vacuum Treat Pvt Ltd, marking the third time the Indian heat-treatment specialist has chosen SECO/WARWICK’s vacuum furnace technology. The newly ordered furnace will support a wide range of processes including vacuum hardening, tempering, solution treatment, aging, annealing, brazing, and high-pressure gas quenching. Designed to meet NADCA (North American Die Casting Association) global standards, the equipment also positions Shital Vacuum Treat for future NADCAP certification.

As a long-standing provider of heat-treatment services to India’s automotive, aerospace, toolmaking, and machinery sectors, Shital Vacuum Treat plays a critical role in enabling high-performance manufacturing for small and medium-sized enterprises. This latest investment is driven by increased demand and reflects the company’s ongoing commitment to quality and process excellence.

The furnace will be fully manufactured under the “Made in India” initiative at SECO/WARWICK’s Pune facility, located just 25 kilometers from Shital’s headquarters. “Shital Vacuum Treat is a long-standing partner, promoter, and a true ambassador of SECO/WARWICK technology in the Indian market,” said Arvind Agarwal, Managing Director of SECO/WARWICK India. “Their third investment in our equipment demonstrates their continued trust in our solutions and underscores our shared commitment to advancing India’s industrial capabilities.”

Read further here. https://www.secowarwick.com/en/news/secowarwick-india-secures-a-new-contract/

Scientists create world’s first chip that combines 2D materials with conventional silicon circuitry

For the first time, scientists have created a fully functional memory chip only a few atoms thick and integrated it into conventional chips, an advance from Fudan University in China that could pave the way for more powerful and energy-efficient electronic devices.

Oxford Instruments launched witec360 Raman microscope with Hexalight spectrometer

Oxford Instruments’ Raman imaging team in England announced a refreshed core microscope line and a groundbreaking new spectrometer, Hexalight, which together with the witec360 microscope constitute the most advanced confocal Raman imaging system yet devised.

Siemens unveils groundbreaking Tessent Analogtest software for automated analog circuit test generation

Siemens Digital Industries Software, Plano, Texas, introduced Tessent AnalogTest software – an innovative solution that reduces pattern generation time for analog circuit tests from months to days, enabling testing of analog circuitry in integrated circuits up to 100 times faster than traditional manual methods.

Tektronix introduces 7 Series DPO, setting a new benchmark in ultra-high-performance test and measurement

Tektronix, Beaverton, Ore., announced the 7 Series DPO oscilloscope, the first in a new generation of ultra-high-performance instruments, purpose-built for engineering teams and researchers pushing the boundaries of high-speed communications, high-energy physics, AI, and quantum computing.

A prototype LED as thin as wallpaper that glows like the sun

Chinese researchers at Hefei University of Technology have created a paper-thin LED that gives off a warm, sun-like glow and could light up the next generation of phone and computer screens and other light sources.

Ilika and Cirtec advance miniaturized medical implants

Cirtec Medical, Brooklyn Park, Minnesota announced a collaborative approach with Ilika, Southampton, United Kingdom, combining application-specific integrated circuit (ASIC) technology with solid-state battery (SSB) innovation to power the next generation of active implantable medical devices (AIMDs). The integration aims to enable compact, rechargeable, and efficient implants for applications such as neuromodulation and cardiac sensing.

The joint solution addresses long-standing design challenges in AIMDs, including limited energy storage capacity, wireless power transfer efficiency, and stable memory retention during low-power or pulsed operating cycles.

Ilika’s Stereax M300 solid-state battery delivers high energy density in a miniaturized footprint, reducing recharge times and extending implant life to minimize the need for replacement surgeries. Cirtec’s ASIC platform complements this by managing power regulation, memory integrity, and startup control, even under variable energy conditions.

By combining these technologies, Ilika and Cirtec offer a scalable and reliable energy architecture for medical device developers, supporting safer, longer-lasting, and more sustainable implant designs that enhance patient outcomes while accelerating product development for medtech innovators.

‍Read further here

3D real-time imaging of hydrogen’s effect on stainless steel defects

Researchers from University of Oxford and Brookhaven National Laboratory have uncovered how exposure to hydrogen atoms dynamically alters the internal structure of stainless steel. Their findings reveal that hydrogen allows internal defects in steel to move in ways not normally possible, which can lead to unexpected failure.

Lam Research introduces VECTOR TEOS 3D to address critical advanced packaging challenges in chipmaking

The new inter-die gapfill tool from Lam Research Corp., Fremont, Calif., expands industry-leading portfolio of solutions for 3D integration and chiplet technologies; paves way for new, AI-accelerating architectures.

The world’s fastest microscope makes its debut

Researchers at the University of Arizona in Tucson have developed a laser-based microscope that snaps images at attosecond — or a billionth of a billionth of a second — speed.

Purdue’s Chipshub wins NSF award for Chip Design Hub to help ease urgent national semiconductor workforce shortage

The U.S. National Science Foundation has selected Purdue Engineering-led Chipshub, West Lafayettes, Ind., as its Chip Design Hub by providing a $7 million grant over five years.

Solid-state batteries get a boost with new protective coating

Researchers at the U.S. Department of Energy’s Argonne National Laboratory, Lemont, Ill., have developed a method to coat sulfide-based solid electrolytes, finding a thin, glass-like layer could be the key to longer-lasting, cost-effective solid-state batteries.

The “soft side” of chips: NIST advances polymer science for semiconductor packaging

A new perspective article from NIST and collaborators highlights a critical but often underrated piece of the semiconductor revolution: the “soft” polymer-based packaging materials that hold advanced chips together that are emerging as important factors for reliability, performance, and cost.

Exosens expands technology portfolio

Exosens, France, extends its technology portfolio by signing an agreement to acquire Phasics, France, leader in high performance cameras based solutions for optical metrology.

Elmet Technologies granted U.S. patent for tungsten heavy metal alloy powders

Elmet Technologies, Lewiston, Maine, the last and only fully integrated, U.S.-owned and operated tungsten and molybdenum manufacturer, announced the issuance of U.S. Patent No. 12,359,290 titled “Tungsten Heavy Metal Alloy Powders and Methods of Forming Them.”

Impact Innovations installs 100+ cold spray systems across 30+ countries

Impact Innovations, German cold spray AM specialist, has reached a key milestone by installing over 100 Cold Spray systems across more than 30 countries.

The Institute for Manufacturing at the University of Cambridge, England, has developed a groundbreaking additive manufacturing technique, laser-assisted cold spray.

Nissan introduces world’s first valve seat using cold spray technology in new e-POWER dedicated engine

Nissan, Japan, has adopted valve seats manufactured using cold spray technology, marking a world-first application in automotive engines.

Nanoscale facility thinks big on developing microchip workforce

For the first time, the Cornell Nanoscale Science and Technology Facility (CNF) is using virtual reality to inspire and train the next generation of semiconductor professionals. CNF has launched a free VR outreach module that immerses students in its 17,000-square-foot clean room, where microchips are made, using high-definition, 360-degree video accessible via VR headsets, laptops, or tablets.

Multimillion-dollar award from U.S. Army to fund advanced manufacturing research

To meet the growing demand for metal in the U.S. military—estimated at 750 million tons annually for uses ranging from ship repairs to tank construction—the U.S. Army Research Laboratory is investing millions over five years in advanced manufacturing research.

World’s first hybrid chip combines electronics, photonics, and quantum power

Researchers from Boston University, UC Berkeley, and Northwestern University have developed the first chip that integrates electronic, photonic, and quantum components, fabricated using a standard 45-nanometer semiconductor process.

Texas Tech to earn $14M for advanced semiconductor power devices program

Texas Tech University’s Edward E. Whitacre Jr. College of Engineering, Lubbock, Texas, will earn $14 million from the U.S. Department of Defense Army Research Laboratory for an Advanced Semiconductor Power Devices Program that will develop reliable, high-performance and power electronic devices with wide and ultrawide bandgap semiconductors.