Dragonfly, a brand of Comet Group, Switzerland, applied high-resolution 3D X-ray imaging to inspect 20 µm micro-bumps in HBM stacks, where sub-micron voids and cracks can critically affect performance and yield.
Continue readingCounterfeit electronics reports reach nine-year high amid expanding target base
A sharp uptick in reported counterfeit and nonconforming electronic components in 2024 has underscored a widening threat to component authenticity, according to the latest ERAI Annual Report.
Continue reading‘Soft-touch’ approach advances nondestructive testing for micro-LED wafers
Scientists at Tianjin University, China, have developed a pioneering nondestructive testing technology for micro-LED wafers, offering a much-needed solution to a long-standing industry challenge through a novel “soft-touch” approach.
Continue readingResearchers outline innovative ways to track heat in advanced semiconductors
Researchers from UConn and the U.S. Naval Research Laboratory have outlined new ways to accurately track and manage heat in ultrawide bandgap semiconductors, a challenge that has become increasingly important as these materials drive the future of high-performance electronics.
Continue readingInstron launches new AVE3 Advanced Video Extensometer
Instron, Norwood, Mass., released the AVE3, an advanced non-contacting video extensometer that delivers precise strain measurement with unparalleled, micron-level accuracy for tensile, compression, and bend testing.
Continue readingSemiconductor takes an unconventional path from insulator to metal
Scientists at the University of Tennessee, Knoxville, recently discovered that Mn3Si2Te6 changes from an insulator to an electrically conductive metal when exposed to a magnetic field.
Continue readingFlawed fillers in polymers boost heat transfer
A team of researchers, led by the University of Massachusetts Amherst, made an important discovery in their quest to design the next generation of materials for modern devices—ones that are lightweight, flexible, and excellent at dissipating heat: imperfection has its upsides.
Continue readingNew PCR chip design: High-pressure liquid seal solves bubble problem
Researchers from the Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences, developed a high-pressure liquid seal technique that eliminates bubble formation in PDMS-based PCR chips by proving that water vapor diffusion—not air expansion—is the main cause of bubbles.
Continue readingNon-Drip cryogenic epoxy offers electrical and thermal insulation
Master Bond Inc., Hackensack, N.J., released its newest product, Master Bond EP29LPSPND-3, a two component, non-drip epoxy compound with a paste consistency that can be used for bonding and sealing applications.
Continue readingLifetime of semiconductor processing equipment parts can be checked in real time
Researchers at the Korea Research Institute of Standards and Science have developed a real-time diagnostic system for semiconductor plasma process parts which is expected to enhance yield, stability, and cost efficiency by preemptively preventing contaminant particles generated from component corrosion.
Continue readingCeramic powders with Archimedean shapes resist extreme heat and oxidation
A research team from the Hefei Institutes of Physical Science of the Chinese Academy of Sciences has synthesized high-quality boride ceramic powders with an Archimedean shape, holding promising implications for the future of heat protection materials.
Continue readingA new ultrathin conductor for nanoelectronics
Researchers at Stanford Engineering have developed an ultrathin material that conducts electricity better than copper and could enable more energy-efficient nanoelectronics.
Continue readingSLAC will play a key role in DOE’s new research centers for advancing next-generation microelectronics
The Department of Energy has announced funding $179 million for three Microelectronics Science Research Centers that bring together multi-institutional, multidisciplinary projects in partnership with industry organized around making microelectronics more energy efficient and able to operate better in extreme environments.
Continue readingNanoink, printing technologies could enable electronics repairs, production in space
Researchers at Iowa State University, Ames, Iowa, have successfully demonstrated a groundbreaking zero-gravity 3D printing technology using electrohydrodynamic printing and nanoink, paving the way for on-demand manufacturing and electronics repair in space.
Continue readingNew material to make next generation of electronics faster and more efficient
Researchers at the University of Minnesota have achieved a new artificially designed material that allows electrons to move faster while remaining transparent to both visible and ultraviolet light, breaking the previous record and being pivotal in making the next generation of high-power electronics faster, transparent and more efficient.
Continue readingLeica Microsystems combines high-definition confocal microscopy and interferometry
Leica Microsystems, Germany, launches the Leica DCM8 for nondestructive three-dimensional surface profiling.
Continue readingSensors built into wearable patches could signal the future
Nomination deadline for the 2016 Class of Fellows is fast approaching
The honor of Fellow of the Society was established to provide recognition to members for distinguished contributions in the field of materials science and engineering, and to develop a broadly based forum for technical and professional leaders to serve as advisors to the Society. The deadline for submission is November 30.
Continue readingGreener electronics being developed to reduce unsustainably high levels of e-waste
To reduce unsustainably high levels of e-waste, an expert in green chemistry at Swedish research institute Research Institutes of Sweden has switched his focus from pulp to wood in a bid to make consumer electronic devices that have no carbon footprint and are easier to recycle.
Continue readingTurning up the heat on data storage: New memory device paves the way for AI computing in extreme environments
Researchers at University of Pennsylvania demonstrated memory technology capable of enduring temperatures as high as 600° Celsius—more than twice the tolerance of any commercial drives on the market—and these characteristics were maintained for more than 60 hours, indicating exceptional stability and reliability.
Continue readingGroundbreaking microcapacitors could power chips of the future
Scientists at Lawrence Berkeley National Laboratory, Berkeley, Calif., developed microcapacitors with ultrahigh energy and power density, paving the way for on-chip energy storage in electronic devices.
Continue readingTwo-faced solar panels can generate more power at up to 70% less cost
Researchers at the University of Surrey, England, University of Cambridge, the Chinese Academy of Sciences, Xidian University, and Zhengzhou University, China, built a new kind of two-faced (bifacial) solar panel using single-walled carbon nanotubes as both front and back electrodes that are the highest efficiency single junction solar cells to date.
Continue readingSearching space for stealthy dark matter
From deep underground to outer space, researchers supported by the DOE’s Office of Science are working to understand this mysterious type of matter.
Continue readingSpray Tips – Grit blasting abrasives
Blasting abrasives include angular chilled iron grit, alumina, crushed flint, crushed garnet, silicon carbide, and crushed slag.
Continue readingChinese scientists develop ultrastrong, high thermal insulating ceramics
Scientists at the South China University of Technology have created a new porous ceramic that is ultrastrong at elevated temperatures and simultaneously high thermal insulating, two properties needed for making the shell of hypersonic aircraft.
Continue readingEnovis earns recognition from The Healthcare Technology Report
Envois, Wilmington, DE, The Healthcare Technology Report named Enovis as one of the Top 100 Healthcare Technology Companies and announced Enovis Chief Financial Officer Ben Berry as one of the Top 25 Healthcare Technology Leaders of Dallas.
Coming in at #16 on the Top 100 list, Enovis is being recognized for our focus on continuous improvement and commitment to creating the future of better care through our groundbreaking products, software, and solutions that enable healthcare professionals to help their patients achieve extraordinary results.
New initiatives meet demand for semiconductor technology expertise
The Center for Harsh Environment Semiconductors and Systems is the first initiative of the university’s North Texas Semiconductor Institute.
Continue readingNew laser-based method could help scientists discover new puncture-resistant materials
Researchers at the National Institute of Standards and Technology, Gaithersburg, Md., developed a laser-based method that uses high-intensity laser to blast microscale projectiles into a small sample at velocities close to the speed of sound to analyze the energy exchange and predict the puncture resistance of materials against larger projectiles encountered in real-world situations.
Continue readingCorrosion control by self-healing epoxy coatings
Scientists at the Instituto de Ciencia y Tecnologia de Polimeros (ICTP) and Centro Nacional de Investigaciones Metalurgicas (CENIM), Spain, studied corrosion control by autonomous self-healing epoxy coatings based on superabsorbent healing agents.
Continue readingNew robot boosts solar energy research
Researchers at North Carolina State University, Raleigh, N.C., have created a robot called RoboMapper that can rapidly identify new perovskite materials with improved stability and solar cell efficiency and is capable of conducting experiments more efficiently and sustainably to develop a range of new semiconductor materials with desirable attributes.
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