Researchers at Stanford Engineering have developed an ultrathin material that conducts electricity better than copper and could enable more energy-efficient nanoelectronics.
Continue readingA new ultrathin conductor for nanoelectronics
Reducing TOPCon solar cell degradation via copper plating
Researchers at the University of New South Wales, Australia, have created a protective barrier on the front silver grid of a TOPCon solar cell using a 1 µm copper plating layer, which reduces corrosion susceptibility and significantly lowers contaminant-induced degradation compared to unprotected reference devices.
Continue readingFirst full wafer-scale fabrication of electrically-pumped GaAs-based nano-ridge lasers on 300 mm silicon wafers
Imec, Belgium, a world-leading research and innovation hub in nanoelectronics and digital technologies, has announced a significant milestone in silicon photonics with the successful demonstration of electrically-driven GaAs-based multi-quantum-well nano-ridge laser diodes fully, monolithically fabricated on 300 mm silicon wafers in its CMOS pilot prototyping line.
Continue readingExamining recoater damage: How Alloyed is addressing the challenge
Phase3D, Chicago, Ill., is working with commercial part manufacturer, Alloyed in the UK, to characterize part and build quality and determine how anomalies in a build cause defects in a part using the Fringe in-situ inspection system.
Continue readingHarper international commissions two carbon fiber production lines in China
Harper International, Buffalo, NY, announced the successful installation and commissioning of two carbon fiber production lines for Shandong Yongcheng New Materials Co. Ltd. (SYNM) in the Shandong province of China. The newly commissioned systems incorporate Harper’s advanced thermal processing technology, including oxidation ovens, low-temperature (LT) and high-temperature (HT) carbonization furnaces, and integrated energy recovery and waste gas abatement systems.
The two 3-meter-wide production lines at SYNM’s facility will allow for an annual production capacity of 3,000 metric tons of carbon fiber. The site has been designed with future expansion in mind, with the potential to scale up to 12,000 metric tons per year. Harper’s expertise ensured efficient system performance and uniform carbon fiber product quality.
Paul Elwell, vice president of Harper International, emphasized the strong collaboration between Harper and SYNM, which contributed to a smooth installation and commissioning process. He also noted that Harper looks forward to supporting SYNM’s continued growth and expansion in carbon fiber manufacturing.
SLAC will play a key role in DOE’s new research centers for advancing next-generation microelectronics
The Department of Energy has announced funding $179 million for three Microelectronics Science Research Centers that bring together multi-institutional, multidisciplinary projects in partnership with industry organized around making microelectronics more energy efficient and able to operate better in extreme environments.
Continue readingElectronic components can self-assemble using new technique
Researchers from North Carolina State University have developed a new technique for creating simple electronic device components that proved effective in recent tests, indicating that self-assembly for more complex electronics, such as 3D computer chips, could be possible.
Continue readingScalable 3D chips with high-speed interconnections
Researchers at the Massachusetts Institute of Technology have developed a technique to create a multilayered chip with alternating layers of high-quality semiconducting material grown directly on top of one another.
Continue readingA film capacitor that can take the heat
The Department of Energy’s Lawrence Berkeley National Laboratory and several collaborating institutions have successfully demonstrated a machine-learning technique to accelerate discovery of materials for film capacitors and used it to screen a library of nearly 50,000 chemical structures to identify and synthesize a compound with record-breaking performance.
Continue readingTailoring material properties with exquisite precision
Penn State researchers have discovered that “atomic spray painting” of potassium niobate can precisely manipulate a material’s properties by altering its atomic arrangement, potentially leading to environmentally friendly innovations in consumer electronics, medical devices, and quantum computing.
Continue readingNanoink, printing technologies could enable electronics repairs, production in space
Researchers at Iowa State University, Ames, Iowa, have successfully demonstrated a groundbreaking zero-gravity 3D printing technology using electrohydrodynamic printing and nanoink, paving the way for on-demand manufacturing and electronics repair in space.
Continue readingInnovative materials design in thermal barrier coatings could boost energy efficiency
Researchers at the University of Virginia and Harvard University have made an exciting discovery in thermal barrier coatings that could significantly enhance the performance and efficiency of gas turbines, key components in power plants and jet engines.
Continue readingEarthquake prediction techniques provide quick insight into material failure analysis
Researchers from the University of Illinois Urbana-Champaign, in collaboration with Sandia National Laboratories and Bucknell University, have found that insight from muscovite mica and earthquake statistics can help quantify how hostile environmental interactions impact the degradation of materials used in advanced solar panels, geological carbon sequestration, and infrastructure.
Continue readingNanoscale transistors could enable more efficient electronics
In order to overcome a fundamental limit of silicon semiconductor technology that prevents transistors from operating below a certain voltage, Massachusetts Institute of Technology researchers fabricated a different type of three-dimensional transistor using a unique set of ultrathin semiconductor materials.
Continue readingScientists gain insight into the material defects that cause errors in quantum computing
A team of researchers at Ames National Laboratory, Ames, Iowa, has made significant progress in understanding how surface oxides, a primary cause of decoherence in quantum circuits, can improve the performance of quantum computing circuits.
Continue readingNew material to make next generation of electronics faster and more efficient
Researchers at the University of Minnesota have achieved a new artificially designed material that allows electrons to move faster while remaining transparent to both visible and ultraviolet light, breaking the previous record and being pivotal in making the next generation of high-power electronics faster, transparent and more efficient.
Continue readingSupersonic microprojectiles reveal new insights into metal bonding
Using a custom-built machine to launch microprojectiles at supersonic speeds, Cornell researchers, Ithaca, N.Y., have uncovered new details about how high-speed metallic collisions can form strong, durable atomic bonds, offering insights that could enhance 3D printing and other manufacturing techniques.
Continue readingWater-free manufacturing approach could advance 2D electronics integration
A team of academic and enterprise researchers at Penn State has developed a synthesis process to produce a “rust-resistant” coating with additional properties ideal for creating faster, more durable electronics.
Continue readingThere’s two sides to this semiconductor, and many simultaneous functions
Cornell University researchers, Ithaca, N.Y., in collaboration with a team at the Polish Academy of Sciences, have developed the first dual-sided – or “dualtronic” – chip that combines photonic and electronic functions simultaneously, an innovation that could shrink the size of functional devices, make them more energy efficient and reduce manufacturing costs.
Continue readingScientists uncover detailed structure of the aluminum oxide surface
Researchers from TU Wien, Austria, and the University of Vienna have recently unraveled the complex structure of the Al2O3 surface, a puzzle that had eluded precise determination for over half a century.
Continue readingNewly discovered role of phase separation: a game changer for AI memory tech
Researchers on a team led by University of Michigan unveiled that phase separation, alongside oxygen diffusion, crucially supports the long-term retention of information in memristors, specifically in resistive random access memory.
Continue readingA quantum leap for motion sensing
For the first time, researchers at Sandia National Laboratories, Albuquerque, N. M., have used silicon photonic microchip components to perform a quantum sensing technique called atom interferometry, an ultra-precise way of measuring acceleration and the latest milestone toward developing a kind of quantum compass for navigation when GPS signals are unavailable.
Continue readingNew chip may lead to AI computing at light speed
Engineers at the University of Pennsylvania, Philadelphia, developed a new chip that uses light waves rather than electricity to perform the complex math essential to training AI.
Continue readingU.S. Department of Energy announces $9.9 Million to increase domestic critical mineral supply
The U.S. Department of Energy Advanced Research Projects Agency-Energy announced $9.9 million for 7 projects involving emerging phytomining technologies that seek to create low-carbon, cost-competitive U.S. Nickel supply chain and reduce imports.
Continue readingInternational team of scientists develops revolutionary microscopy method
A team from Trinity College Dublin has innovated a microscopic imaging technique that lowers radiation exposure and speeds up the process, enhancing safety and efficiency in imaging sensitive materials.
Continue readingComputer vision method characterizes electronic material properties 85 times faster than conventional approach
A new computer vision technique developed by MIT engineers significantly speeds up the characterization of newly synthesized electronic materials.
Continue readingChaco metamaterial paves the way for exciting applications in memory storage
Scientists at Los Alamos National Laboratory, N. M., and Tel Aviv University, Israel, have achieved a breakthrough in material science with the creation of “Chaco,” a revolutionary metamaterial named after the historical site Chaco Canyon in New Mexico.
Continue readingPOSTECH researchers maximize the efficiency of hafnia-based ferroelectric memory devices
Researchers at Pohang University of Science and Technology, South Korea, have significantly enhanced the data storage capacity of ferroelectric memory devices using hafnia-based ferroelectric materials and an innovative device structure.
Continue readingCould corrosion actually be helpful? New 3D printing technique might turn oxidation into an advantage
New research from Binghamton University, State University of New York investigating a way to make metals stronger through oxidation could revolutionize 3D printing and how engineers think about oxidation.
Continue readingTurning up the heat on data storage: New memory device paves the way for AI computing in extreme environments
Researchers at University of Pennsylvania demonstrated memory technology capable of enduring temperatures as high as 600° Celsius—more than twice the tolerance of any commercial drives on the market—and these characteristics were maintained for more than 60 hours, indicating exceptional stability and reliability.
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