The Department of Energy has announced funding $179 million for three Microelectronics Science Research Centers that bring together multi-institutional, multidisciplinary projects in partnership with industry organized around making microelectronics more energy efficient and able to operate better in extreme environments.
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Researchers from North Carolina State University have developed a new technique for creating simple electronic device components that proved effective in recent tests, indicating that self-assembly for more complex electronics, such as 3D computer chips, could be possible.
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Researchers at the Massachusetts Institute of Technology have developed a technique to create a multilayered chip with alternating layers of high-quality semiconducting material grown directly on top of one another.
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The Department of Energy’s Lawrence Berkeley National Laboratory and several collaborating institutions have successfully demonstrated a machine-learning technique to accelerate discovery of materials for film capacitors and used it to screen a library of nearly 50,000 chemical structures to identify and synthesize a compound with record-breaking performance.
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Penn State researchers have discovered that “atomic spray painting” of potassium niobate can precisely manipulate a material’s properties by altering its atomic arrangement, potentially leading to environmentally friendly innovations in consumer electronics, medical devices, and quantum computing.
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Researchers at Iowa State University, Ames, Iowa, have successfully demonstrated a groundbreaking zero-gravity 3D printing technology using electrohydrodynamic printing and nanoink, paving the way for on-demand manufacturing and electronics repair in space.
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Researchers at the University of Virginia and Harvard University have made an exciting discovery in thermal barrier coatings that could significantly enhance the performance and efficiency of gas turbines, key components in power plants and jet engines.
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Researchers from the University of Illinois Urbana-Champaign, in collaboration with Sandia National Laboratories and Bucknell University, have found that insight from muscovite mica and earthquake statistics can help quantify how hostile environmental interactions impact the degradation of materials used in advanced solar panels, geological carbon sequestration, and infrastructure.
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In order to overcome a fundamental limit of silicon semiconductor technology that prevents transistors from operating below a certain voltage, Massachusetts Institute of Technology researchers fabricated a different type of three-dimensional transistor using a unique set of ultrathin semiconductor materials.
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A team of researchers at Ames National Laboratory, Ames, Iowa, has made significant progress in understanding how surface oxides, a primary cause of decoherence in quantum circuits, can improve the performance of quantum computing circuits.
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Researchers at the University of Minnesota have achieved a new artificially designed material that allows electrons to move faster while remaining transparent to both visible and ultraviolet light, breaking the previous record and being pivotal in making the next generation of high-power electronics faster, transparent and more efficient.
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Using a custom-built machine to launch microprojectiles at supersonic speeds, Cornell researchers, Ithaca, N.Y., have uncovered new details about how high-speed metallic collisions can form strong, durable atomic bonds, offering insights that could enhance 3D printing and other manufacturing techniques.
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A team of academic and enterprise researchers at Penn State has developed a synthesis process to produce a “rust-resistant” coating with additional properties ideal for creating faster, more durable electronics.
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Cornell University researchers, Ithaca, N.Y., in collaboration with a team at the Polish Academy of Sciences, have developed the first dual-sided – or “dualtronic” – chip that combines photonic and electronic functions simultaneously, an innovation that could shrink the size of functional devices, make them more energy efficient and reduce manufacturing costs.
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Researchers from TU Wien, Austria, and the University of Vienna have recently unraveled the complex structure of the Al2O3 surface, a puzzle that had eluded precise determination for over half a century.
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Researchers on a team led by University of Michigan unveiled that phase separation, alongside oxygen diffusion, crucially supports the long-term retention of information in memristors, specifically in resistive random access memory.
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For the first time, researchers at Sandia National Laboratories, Albuquerque, N. M., have used silicon photonic microchip components to perform a quantum sensing technique called atom interferometry, an ultra-precise way of measuring acceleration and the latest milestone toward developing a kind of quantum compass for navigation when GPS signals are unavailable.
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Engineers at the University of Pennsylvania, Philadelphia, developed a new chip that uses light waves rather than electricity to perform the complex math essential to training AI.
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The U.S. Department of Energy Advanced Research Projects Agency-Energy announced $9.9 million for 7 projects involving emerging phytomining technologies that seek to create low-carbon, cost-competitive U.S. Nickel supply chain and reduce imports.
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A team from Trinity College Dublin has innovated a microscopic imaging technique that lowers radiation exposure and speeds up the process, enhancing safety and efficiency in imaging sensitive materials.
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A new computer vision technique developed by MIT engineers significantly speeds up the characterization of newly synthesized electronic materials.
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Scientists at Los Alamos National Laboratory, N. M., and Tel Aviv University, Israel, have achieved a breakthrough in material science with the creation of “Chaco,” a revolutionary metamaterial named after the historical site Chaco Canyon in New Mexico.
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Researchers at Pohang University of Science and Technology, South Korea, have significantly enhanced the data storage capacity of ferroelectric memory devices using hafnia-based ferroelectric materials and an innovative device structure.
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New research from Binghamton University, State University of New York investigating a way to make metals stronger through oxidation could revolutionize 3D printing and how engineers think about oxidation.
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Researchers at University of Pennsylvania demonstrated memory technology capable of enduring temperatures as high as 600° Celsius—more than twice the tolerance of any commercial drives on the market—and these characteristics were maintained for more than 60 hours, indicating exceptional stability and reliability.
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Scientists at Lawrence Berkeley National Laboratory, Berkeley, Calif., developed microcapacitors with ultrahigh energy and power density, paving the way for on-chip energy storage in electronic devices.
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Researchers from University of Toronto find cheaper, easier way to produce high-entropy alloys for use in aerospace, automotive industries.
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Ma-tek, Japan, invites research proposals centered around the development of high-tech products and themes related to manufacturing, packaging, testing, and systems, utilizing advanced analytical and diagnostic techniques for the 113th year of the “MA-tek Industry-Academia Collaboration Program”.
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Scientists from the University of New South Wales published a report into passivated emitter and rear contact (PERC) and tunnel oxide passivated contact (TOPCon) solar modules, finding that the latter has endured “significant degradation” in damp heat testing.
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Rice University students in Houston, Texas, have developed a cold spray metal 3D printing device that uses pressure and velocity instead of temperature, potentially expanding the capabilities and reducing the costs of metal additive manufacturing and repairing for complex, one-off parts.
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