Researchers at the Fraunhofer Institute for Integrated Circuits IIS, Germany, are developing an open-source tool to enhance the prevention of radiation-induced functional degradation in electronic systems.
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By studying the theoretical limits of how light can be used to perform computation, Cornell researchers have uncovered new insights and strategies for designing energy-efficient optical computing systems.
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A research team from Tokyo University of Science, Japan, has developed an automated artificial intelligence-based approach for analyzing X-ray absorption spectroscopy data to establish a clear and objective link between a material’s spectral data and its underlying material properties.
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Tescan Group, Czech Republic, acquired FemtoInnovations, a leading innovator in ultrafast laser technologies, and created a new dedicated Laser Technology Business Unit headquartered at the University of Connecticut Tech Park that expands Tescan’s correlative and multimodal portfolio for semiconductor, biomedical device manufacturing, and advanced research markets.
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Materials scientists at the University of Minnesota Twin Cities have found a way to create and control tiny internal “flaws” inside ultra-thin materials known as extended defects, that could give next-generation nanomaterials entirely new properties, opening the door to advances in nanotechnology.
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A team led by Lawrence Berkeley National Laboratory and George Washington University have confirmed that atoms in semiconductors will arrange themselves in distinctive localized patterns that change the material’s electronic behavior.
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For the first time, scientists have created a fully functional memory chip only a few atoms thick and integrated it into conventional chips, an advance from Fudan University in China that could pave the way for more powerful and energy-efficient electronic devices.
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Chinese researchers at Hefei University of Technology have created a paper-thin LED that gives off a warm, sun-like glow and could light up the next generation of phone and computer screens and other light sources.
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Researchers at the University of Arizona in Tucson have developed a laser-based microscope that snaps images at attosecond — or a billionth of a billionth of a second — speed.
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The U.S. National Science Foundation has selected Purdue Engineering-led Chipshub, West Lafayettes, Ind., as its Chip Design Hub by providing a $7 million grant over five years.
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Researchers at the U.S. Department of Energy’s Argonne National Laboratory, Lemont, Ill., have developed a method to coat sulfide-based solid electrolytes, finding a thin, glass-like layer could be the key to longer-lasting, cost-effective solid-state batteries.
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Researchers from Boston University, UC Berkeley, and Northwestern University have developed the first chip that integrates electronic, photonic, and quantum components, fabricated using a standard 45-nanometer semiconductor process.
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The University of the Philippines Diliman has formalized a PHP 3 million FA Hub partnership The SEM CALACA Power Corporation and the university’s Engineering Research and Development Foundation to consolidate failure analysis labs and launch industry focused services.
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Scientists at Northeastern University, Boston, Mass., introduce a new cost- and energy-efficient computational model for designing alloys that factors in material defects.
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Scientists at Tianjin University, China, have developed a pioneering nondestructive testing technology for micro-LED wafers, offering a much-needed solution to a long-standing industry challenge through a novel “soft-touch” approach.
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The Integrated Electronics Engineering Center at Binghamton University research that partners with industry to advance electronics manufacturing has been re-designated by New York state as a Center for Advanced Technology, receiving $1 million in annual funding for the next decade.
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Researchers from UConn and the U.S. Naval Research Laboratory have outlined new ways to accurately track and manage heat in ultrawide bandgap semiconductors, a challenge that has become increasingly important as these materials drive the future of high-performance electronics.
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A team from the Center for Optics, Photonics and Lasers at Laval University, Quebec, Canada, has come up with an optical chip that can transfer massive amounts of data at ultra-high speed, offering unrivaled energy efficiency.
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Knut and Alice Wallenberg Foundation and the WISE research program, Sweden, have launched a Proof-of-Concept Grant program with the purpose to bridge the gap from academic research to innovations in materials science for sustainability.
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New research at Cornell University, Ithaca, N.Y., found that faster isn’t always better when it comes to high-speed materials science, showing that tiny metal particles bond best at a precise supersonic speed.
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Scientists at the University of Tennessee, Knoxville, recently discovered that Mn3Si2Te6 changes from an insulator to an electrically conductive metal when exposed to a magnetic field.
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Epsilon Group, India, a leading innovator in carbon black and advanced battery materials for electric vehicles and energy storage, is partnering with Tufts University in Massachusetts to launch the Tufts Epsilon Materials Institute-a new research center made possible by an $11.5 million sponsorship and dedicated to advancing materials science and engineering for global energy and sustainability solutions.
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Stanford researchers have created ultrathin niobium phosphide films that conduct electricity better than copper and can be made at low temperatures compatible with modern chip fabrication, promising more powerful, energy-efficient electronics.
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Researchers from the Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences, developed a high-pressure liquid seal technique that eliminates bubble formation in PDMS-based PCR chips by proving that water vapor diffusion—not air expansion—is the main cause of bubbles.
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University of Michigan engineers developed a modified manufacturing process for electric vehicle batteries—using a stabilizing electrode coating and microscale channels—that could enable high ranges and fast charging in cold weather, solving problems that are turning potential EV buyers away.
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Minnesota-based startup Maxwell Labs has entered into a cooperative research and development agreement with Sandia and the University of New Mexico to demonstrate laser-based photonic cooling for computer chips that may help save energy and water.
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Researchers at Argonne National Laboratory, Lemont, Ill., use Polybot, an AI-driven automated material laboratory, to produce high-conductivity, low-defect electronic polymer thin films.
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A research team from the Hefei Institutes of Physical Science of the Chinese Academy of Sciences has synthesized high-quality boride ceramic powders with an Archimedean shape, holding promising implications for the future of heat protection materials.
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The University of North Texas, Denton, Texas, has partnered with Titomic Limited, Australia, the world’s leading provider of cold spray solutions, to install a customized Titomic Kinetic Fusion Cold Spray System.
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Researchers at Xi’an Jiaotong University, China, have developed a new Template-Constrained Additive printing technology inspired by tree root systems that enhances the mechanical robustness and precision of flexible electronic circuits, allowing them to withstand extreme conditions like high temperatures and mechanical wear, expanding their applications in smart robotics and advanced sensing systems.
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