A team led by Lawrence Berkeley National Laboratory and George Washington University have confirmed that atoms in semiconductors will arrange themselves in distinctive localized patterns that change the material’s electronic behavior.
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For the first time, scientists have created a fully functional memory chip only a few atoms thick and integrated it into conventional chips, an advance from Fudan University in China that could pave the way for more powerful and energy-efficient electronic devices.
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Chinese researchers at Hefei University of Technology have created a paper-thin LED that gives off a warm, sun-like glow and could light up the next generation of phone and computer screens and other light sources.
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Researchers at the University of Arizona in Tucson have developed a laser-based microscope that snaps images at attosecond — or a billionth of a billionth of a second — speed.
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The U.S. National Science Foundation has selected Purdue Engineering-led Chipshub, West Lafayettes, Ind., as its Chip Design Hub by providing a $7 million grant over five years.
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Researchers at the U.S. Department of Energy’s Argonne National Laboratory, Lemont, Ill., have developed a method to coat sulfide-based solid electrolytes, finding a thin, glass-like layer could be the key to longer-lasting, cost-effective solid-state batteries.
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Researchers from Boston University, UC Berkeley, and Northwestern University have developed the first chip that integrates electronic, photonic, and quantum components, fabricated using a standard 45-nanometer semiconductor process.
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The University of the Philippines Diliman has formalized a PHP 3 million FA Hub partnership The SEM CALACA Power Corporation and the university’s Engineering Research and Development Foundation to consolidate failure analysis labs and launch industry focused services.
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Scientists at Northeastern University, Boston, Mass., introduce a new cost- and energy-efficient computational model for designing alloys that factors in material defects.
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Scientists at Tianjin University, China, have developed a pioneering nondestructive testing technology for micro-LED wafers, offering a much-needed solution to a long-standing industry challenge through a novel “soft-touch” approach.
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The Integrated Electronics Engineering Center at Binghamton University research that partners with industry to advance electronics manufacturing has been re-designated by New York state as a Center for Advanced Technology, receiving $1 million in annual funding for the next decade.
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Researchers from UConn and the U.S. Naval Research Laboratory have outlined new ways to accurately track and manage heat in ultrawide bandgap semiconductors, a challenge that has become increasingly important as these materials drive the future of high-performance electronics.
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A team from the Center for Optics, Photonics and Lasers at Laval University, Quebec, Canada, has come up with an optical chip that can transfer massive amounts of data at ultra-high speed, offering unrivaled energy efficiency.
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Knut and Alice Wallenberg Foundation and the WISE research program, Sweden, have launched a Proof-of-Concept Grant program with the purpose to bridge the gap from academic research to innovations in materials science for sustainability.
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New research at Cornell University, Ithaca, N.Y., found that faster isn’t always better when it comes to high-speed materials science, showing that tiny metal particles bond best at a precise supersonic speed.
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Scientists at the University of Tennessee, Knoxville, recently discovered that Mn3Si2Te6 changes from an insulator to an electrically conductive metal when exposed to a magnetic field.
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Epsilon Group, India, a leading innovator in carbon black and advanced battery materials for electric vehicles and energy storage, is partnering with Tufts University in Massachusetts to launch the Tufts Epsilon Materials Institute-a new research center made possible by an $11.5 million sponsorship and dedicated to advancing materials science and engineering for global energy and sustainability solutions.
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Stanford researchers have created ultrathin niobium phosphide films that conduct electricity better than copper and can be made at low temperatures compatible with modern chip fabrication, promising more powerful, energy-efficient electronics.
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Researchers from the Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences, developed a high-pressure liquid seal technique that eliminates bubble formation in PDMS-based PCR chips by proving that water vapor diffusion—not air expansion—is the main cause of bubbles.
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University of Michigan engineers developed a modified manufacturing process for electric vehicle batteries—using a stabilizing electrode coating and microscale channels—that could enable high ranges and fast charging in cold weather, solving problems that are turning potential EV buyers away.
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Minnesota-based startup Maxwell Labs has entered into a cooperative research and development agreement with Sandia and the University of New Mexico to demonstrate laser-based photonic cooling for computer chips that may help save energy and water.
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Researchers at Argonne National Laboratory, Lemont, Ill., use Polybot, an AI-driven automated material laboratory, to produce high-conductivity, low-defect electronic polymer thin films.
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A research team from the Hefei Institutes of Physical Science of the Chinese Academy of Sciences has synthesized high-quality boride ceramic powders with an Archimedean shape, holding promising implications for the future of heat protection materials.
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The University of North Texas, Denton, Texas, has partnered with Titomic Limited, Australia, the world’s leading provider of cold spray solutions, to install a customized Titomic Kinetic Fusion Cold Spray System.
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Researchers at Xi’an Jiaotong University, China, have developed a new Template-Constrained Additive printing technology inspired by tree root systems that enhances the mechanical robustness and precision of flexible electronic circuits, allowing them to withstand extreme conditions like high temperatures and mechanical wear, expanding their applications in smart robotics and advanced sensing systems.
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Researchers at Stanford Engineering have developed an ultrathin material that conducts electricity better than copper and could enable more energy-efficient nanoelectronics.
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Researchers at the University of New South Wales, Australia, have created a protective barrier on the front silver grid of a TOPCon solar cell using a 1 µm copper plating layer, which reduces corrosion susceptibility and significantly lowers contaminant-induced degradation compared to unprotected reference devices.
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Imec, Belgium, a world-leading research and innovation hub in nanoelectronics and digital technologies, has announced a significant milestone in silicon photonics with the successful demonstration of electrically-driven GaAs-based multi-quantum-well nano-ridge laser diodes fully, monolithically fabricated on 300 mm silicon wafers in its CMOS pilot prototyping line.
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Phase3D, Chicago, Ill., is working with commercial part manufacturer, Alloyed in the UK, to characterize part and build quality and determine how anomalies in a build cause defects in a part using the Fringe in-situ inspection system.
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Harper International, Buffalo, NY, announced the successful installation and commissioning of two carbon fiber production lines for Shandong Yongcheng New Materials Co. Ltd. (SYNM) in the Shandong province of China. The newly commissioned systems incorporate Harper’s advanced thermal processing technology, including oxidation ovens, low-temperature (LT) and high-temperature (HT) carbonization furnaces, and integrated energy recovery and waste gas abatement systems.
The two 3-meter-wide production lines at SYNM’s facility will allow for an annual production capacity of 3,000 metric tons of carbon fiber. The site has been designed with future expansion in mind, with the potential to scale up to 12,000 metric tons per year. Harper’s expertise ensured efficient system performance and uniform carbon fiber product quality.
Paul Elwell, vice president of Harper International, emphasized the strong collaboration between Harper and SYNM, which contributed to a smooth installation and commissioning process. He also noted that Harper looks forward to supporting SYNM’s continued growth and expansion in carbon fiber manufacturing.
