Bruker Corporation, Billerica, Mass., announced accelerated development of its photothermal AFM-IR spectroscopy capabilities to address research challenges facing the semiconductor industry as device architectures continue to shrink and systems become increasingly more complex.
Continue readingThis new chip survives 1300°F (700°C) and could change AI forever
Researchers at the University of Southern California have unveiled a new memristor memory device that continues to operate at 700 degrees Celsius (~1300 degrees Fahrenheit), marking it as the most robust high-temperature memory technology ever demonstrated.
Continue readingCamtek acquires Visual Layer to deepen its visual AI capabilities in its inspection and metrology offering
Camtek Ltd., Israel, a leading developer and manufacturer of inspection and metrology equipment for the semiconductor industry, has signed a definitive agreement to acquire Visual Layer, a Tel Aviv-based AI company specializing in visual analytics.
Continue readingNo batteries, just body heat: demonstrating the potential of battery-free sensing
Researchers at The University of Osaka, Japan, have developed an outdoor wireless EEG transmission system using energy harvested from the temperature difference between the human body and surrounding air, even under hot summer conditions.
Continue readingQuantumDiamonds deploys failure analysis technology at Taiwan semiconductor test house
QuantumDiamonds GmbH, Germany, deployed its QDm.1 quantum sensing system at Integrated Service Technology (iST) in Taiwan, marking its first installation in Asia and a step toward adoption in high-volume semiconductor failure analysis.
Continue readingCosmic is born: A new global player for semiconductor test solutions – built on decades of experience
Following an international expansion strategy initiated in 2022, a new global semiconductor test solutions group named Cosmic has been formed by uniting specialized industrial companies from Italy, the Netherlands, Germany, the United Kingdom, and the United States into two independent divisions: Cosmic Equipment and Cosmic Services.
Continue readingFlorida delegation secures $9.3M+ for FIU research leadership
A $10 million programmatic increase at the Army Research Laboratory for rapid deposition research is anticipated to support cold spray engineering research at Florida International University.
Continue readingGE Aerospace invests $300M USD to bolster engine repair capabilities in Singapore
Partnership between GE Aerospace, Cincinnati, Ohio and the Singapore Economic Development Board brings AI-enabled inspection, predictive maintenance, and automated repair to speed turnaround and improve connectivity and customer experiences.
Continue readingBrowserStack bridges developer-QA productivity gap with test failure analysis agent
BrowserStack, Ireland, the world’s leading software testing platform, launched its AI-powered Test Failure Analysis Agent, an autonomous system that debugs test failures with QA-level accuracy up to 95% faster, directly addressing the widening productivity gap between developers and QA teams.
Continue readingIntertek Caleb Brett opens new laboratory in Naples, Italy
Intertek, UK, a leading Total Quality Assurance provider to industries worldwide, announced the opening of a new Intertek Caleb Brett laboratory in Naples, Italy, strengthening its presence in this important region and addressing a growing demand for reliable, high-quality testing services in crude oil, refined fuels, and emerging biofuels.
Continue readingHitachi High-Tech announces the SU9600: Next-generation ultrahigh-resolution SEM with high throughput
Hitachi High-Tech Corporation, Japan, has launched the Ultrahigh-Resolution Scanning Electron Microscope SU9600, which allows for highly accurate and precise observation of substances down to the sub-nano level.
Continue readingPhotothermal Spectroscopy Corp. launches stRAMos — a breakthrough SRS, Stimulated Raman microscope based on photothermal detection
Photothermal Spectroscopy Corp., Santa Barbara, Calif., released stRAMos, a next-generation Raman microscope based on photothermal detection of Stimulated Raman scattering that delivers unmatched speed, sensitivity, spatial resolution, and multimodal imaging capabilities for life science and materials research.
Continue readingSiemens unveils groundbreaking Tessent Analogtest software for automated analog circuit test generation
Siemens Digital Industries Software, Plano, Texas, introduced Tessent AnalogTest software – an innovative solution that reduces pattern generation time for analog circuit tests from months to days, enabling testing of analog circuitry in integrated circuits up to 100 times faster than traditional manual methods.
Continue readingResearchers outline innovative ways to track heat in advanced semiconductors
Researchers from UConn and the U.S. Naval Research Laboratory have outlined new ways to accurately track and manage heat in ultrawide bandgap semiconductors, a challenge that has become increasingly important as these materials drive the future of high-performance electronics.
Continue readingInstron launches new AVE3 Advanced Video Extensometer
Instron, Norwood, Mass., released the AVE3, an advanced non-contacting video extensometer that delivers precise strain measurement with unparalleled, micron-level accuracy for tensile, compression, and bend testing.
Continue readingMechanical engineering student brings fresh perspective to National Renewable Energy Laboratory
University of Cincinnati co-op student Addie Salvador is quietly reshaping the future of materials science, bringing autonomy to a transmission electron microscope in the cutting-edge laboratories of the National Renewable Energy Laboratory in Golden, Colorado.
Continue readingAnsys strengthens collaboration with TSMC on advanced node processes certification and 3D-IC multiphysics design solutions
Through continued collaboration with TSMC, Ansys, Canonsburg, Pa., announced enhanced AI-assisted workflows for radio frequency design migration and photonic integrated circuits, and new certifications for its semiconductor solutions.
Continue readingFlawed fillers in polymers boost heat transfer
A team of researchers, led by the University of Massachusetts Amherst, made an important discovery in their quest to design the next generation of materials for modern devices—ones that are lightweight, flexible, and excellent at dissipating heat: imperfection has its upsides.
Continue readingResearchers obtain a rare view of promethium’s properties
For the first time, scientists characterize a promethium coordination complex, which furthers their understanding of elusive lanthanide elements. The rare earth element promethium is unique in that it has no stable isotopes. This means that it is constantly decaying, making it difficult to study.
Continue readingHamamatsu Photonics Korea completes new factory to boost production of semiconductor failure analysis equipment
Hamamatsu Photonics Korea Co., Ltd., a Korean subsidiary of Hamamatsu Photonics K.K., has completed a new factory in Hwaseong-si, South Korea, which will enhance its production capacity for semiconductor failure analysis equipment and expand global sales.
Continue readingUKBIC opens new advanced battery development laboratory
The UK Battery Industrialization Center, United Kingdom, opened its new upgraded and extended Battery Development Laboratory, greatly increased the facility’s capabilities in key areas of battery materials characterization, cell analysis, and forensic activities.
Continue readingSLAC will play a key role in DOE’s new research centers for advancing next-generation microelectronics
The Department of Energy has announced funding $179 million for three Microelectronics Science Research Centers that bring together multi-institutional, multidisciplinary projects in partnership with industry organized around making microelectronics more energy efficient and able to operate better in extreme environments.
Continue readingTailoring material properties with exquisite precision
Penn State researchers have discovered that “atomic spray painting” of potassium niobate can precisely manipulate a material’s properties by altering its atomic arrangement, potentially leading to environmentally friendly innovations in consumer electronics, medical devices, and quantum computing.
Continue readingThermo Fisher highlights use of advanced SEM for metal quality control analysis
Thermo Fisher Scientific, Waltham, Mass., has highlighted the ability of scanning electron microscopy to successfully capture defects when conducting failure analysis on metals.
Continue readingAcquisition of BAE Systems Imaging Solutions, Inc. strengthening the opto-semiconductor segment and accelerating value-added growth
Photonics Management Corp., Bridgewater, N. J., a subsidiary of Hamamatsu Photonics K.K., Japan, has purchased the stock of BAE Systems Imaging Solutions, Inc. a subsidiary of BAE Systems, Inc., Falls Church, Va.
Continue readingLiteScope receives prestigious R&D 100 Award
NenoVision, Czech Republic, a leading innovator in advanced microscopy solutions, has been honored with the esteemed R&D 100 Award in the Analytical/Test category for its AFM-in-SEM LiteScope technology.
Continue readingThere’s two sides to this semiconductor, and many simultaneous functions
Cornell University researchers, Ithaca, N.Y., in collaboration with a team at the Polish Academy of Sciences, have developed the first dual-sided – or “dualtronic” – chip that combines photonic and electronic functions simultaneously, an innovation that could shrink the size of functional devices, make them more energy efficient and reduce manufacturing costs.
Continue readingSpray Tips: Quality control and feedstock material specification
The specification of a material is important for the TS process. A thorough knowledge of the appropriate standards and testing procedures is necessary for appropriate comparisons between materials. These considerations should not be considered alone but in conjunction with the TS process, because this also influences the coating quality. Some of the quality-control tests that should be considered are powder manufacture, particle size, powder quality control, material chemistry, Heill flow rate, deposition parameter, safety, porosity of powder, and handling characteristics.
Any of the existing standards or potential standards for powder quality control should be implemented with regard to the intended use of the coating/substrate system. It is important that any coating not only be subject to some specific standard but that the standard be relevant to the particular feedstock material. The following aspects can be noted with regard to testing methods for feedstock materials.
There are two major methods of measuring the particle size (other than the sieving method): by an x-ray method or by a light-scattering technique. Batches of the same material, when tested by the two methods, have been found to produce quite different particle size distributions. There are technical reasons for this discrepancy, but, more to the point, it is disturbing that the particle size depends on the measuring technique, because the TS applicator desires these data to optimize the spray parameters. The upshot of this discussion is that the measuring technique for the mean particle size or the particle size distribution should always be referenced so that the applicator is able to adjust the spray parameters accordingly.
A quality-control issue that is related to powders concerns the examination of deposits. A simple method of determining whether the material or thermal spray parameters are suitable is the wiper blade test. This involves passing a series of glass sides (or metallic substrates) in front of the thermal spray torch during a trial powder-spraying operation. Usually, a series of glass slides are tested simultaneously by offsetting them on a rotor-type device so that a range of stand-off distances can be examined in one TS run. The degree of particle melting can be quickly determined by optical microscopy and the optimum TS deposition parameters found. The best powder/spraying conditions will be obtained when a well-formed and coherent splat can be produced.
It is appropriate to comment on the powder-feeding problem that was addressed earlier. Three common observations that infer a quality-control procedure is necessary are as follows:
- Powder has irregular flow. For example, it is observed that the powder seems to be turning on and off.
- The powder can only be fed at high carrier gas flow rates. These flow rates are high enough to carry the powder straight through the thermal source.
- The deposit efficiency is observed to be low.
Possible solutions to these problems include adjusting the powder port and delivery tube sizes, drying the powder in an oven, and/or homogenizing the powder by rotating the powder container for a few minutes. Powder testing and the associated quality control must be an unending task, and a suggested schedule is shown in the figure. This figure emphasizes that it is essential to test coatings as well as specify only high-quality powders. Very few of the determinations have standards that are followed throughout the TS community. Often, any standards or specifications are supplied by the consumer of the feedstock, and different consumers may have different requirements for exactly the same powder under different applications. These standards issues need to be resolved.
The impact of poor powder feeding cannot be underestimated, because it limits the utility, productivity, and efficiency of the TS process. Observations such as irregular or pulsating feed rates, powders that do not flow within their container, agglomerate of melted powder in the anode throat, and low deposition efficiencies all indicate process parameter problems that may be traced back to the feedstock.
The ideal powder is thought to be monosized, with spherical particles that follow an ideal trajectory through the TS source. Each particle becomes fully melted or attains a plastic condition so that it flows on the substrate surface and forms a coherent, dense deposit. Such powders are not commercially available for all materials.
Image – Quality-control procedures for powders. EDAX, energy-dispersive x-ray spectroscopy; XRD, x-ray diffraction; TEM, transmission electron microscopy.
This information is from ASM Handbooks Online, Vol. 5A: Thermal Spray Technology, Coating Structures, Properties, and Materials. To find this information (subscription required), click on the link below and scroll down to Figure 22.
Bruker introduces next generation benchtop stylus profilometer
Bruker Corporation, Billerica, Mass., released the Dektak Pro stylus profilometer, the next-generation profiler in the industry-leading Dektak product line, expanding measurement area and accuracy for critical analyses.
Continue readingECM USA announces partnership with PAI Industries for in-house furnace system
ECM USA, Pleasant Prairie, WI, announced a partnership with PAI Industries to enhance manufacturing capabilities by introducing an in-house carburizing vacuum furnace system. PAI Industries, a leading provider of parts for the heavy-duty truck industry, will integrate the ECM NANO vacuum furnace into its 112,000 sq. ft. facility in Suwanee, GA, moving away from outsourced heat treatment.
This addition enables PAI Industries to perform low-pressure carburizing and through-hardening processes continuously, improving production speed and capacity. The ECM NANO system, featuring an external loader, three-position temper oven, and queuing positions, offers benefits such as no internal oxidation (IGO), zero CO2 emissions, reduced fire risk, and improved metallurgical outcomes. Testing was conducted at ECM USA’s Synergy Center to validate these advantages before project acceptance.
Read further here































