Keysight Technologies, Santa Rosa, Calif., announced Keysight Multiphysics, a design and verification solution that addresses the physics interactions driving failure in modern electronic designs, featuring a structural analysis application covering drop, shock, and vibration that enables engineering teams to identify and fix problems earlier, before a prototype is built.
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Tescan, Czech Republic, unifies non-destructive Micro-CT, ultrafast laser processing, and high-precision FIB-SEM into a single, integrated workflow to accelerate root-cause determination in advanced semiconductor packaging while minimizing preparation-induced artifacts.
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Camtek Ltd., Israel, a leading developer and manufacturer of inspection and metrology equipment for the semiconductor industry, has signed a definitive agreement to acquire Visual Layer, a Tel Aviv-based AI company specializing in visual analytics.
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Following an international expansion strategy initiated in 2022, a new global semiconductor test solutions group named Cosmic has been formed by uniting specialized industrial companies from Italy, the Netherlands, Germany, the United Kingdom, and the United States into two independent divisions: Cosmic Equipment and Cosmic Services.
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Cornell researchers, Ithaca, N.Y., have used high-resolution 3D imaging to detect, for the first time, the atomic-scale defects in computer chips that can sabotage their performance using a new imaging technique called electron ptychography.
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Applied Materials, Inc., Santa Clara, Calif., introduced a new defect review system to help semiconductor manufacturers continue pushing the limits of chip scaling combining the industry’s most sensitive electron beam technology with advanced AI image recognition to enable better and faster analysis of buried nanoscale defects.
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Backblaze, Inc., San Mateo, Calif., published its 2025 Year-End Drive Stats report that analyzes the performance of 344,196 hard drives across 30 models and found the annual failure rate drops to 1.36% across 344,000+ drives and high-capacity models are on the rise as first 26TB drives enter service.
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Partnership between GE Aerospace, Cincinnati, Ohio and the Singapore Economic Development Board brings AI-enabled inspection, predictive maintenance, and automated repair to speed turnaround and improve connectivity and customer experiences.
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Governor Greg Abbott announced that a Texas Semiconductor Innovation Fund grant of $4,162,550 has been extended to Arm Inc. for an expansion of their Austin campus to include a new semiconductor lab with failure analysis capabilities.
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BrowserStack, Ireland, the world’s leading software testing platform, launched its AI-powered Test Failure Analysis Agent, an autonomous system that debugs test failures with QA-level accuracy up to 95% faster, directly addressing the widening productivity gap between developers and QA teams.
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A new University of Florida study reveals how hidden flaws in design and installation of aluminum light poles on a Central Florida bridge contributed to their unexpected collapse when Hurricane Ian moved across Florida in 2022, even though wind speeds remained below the structures’ design limits.
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An E190 airliner had a slat failure on approach to Launceston, Tasmania, Australia after a torque tube was incorrectly installed during recent maintenance, an ATSB investigation report details.
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Imina Technologies SA, Switzerland, released a new Nanoprobing High-Voltage Platform designed to safely apply voltages up to 1 kV through both nanoprobing tips and the backside of the sample, addressing the growing need for reliable electrical characterization of wide-bandgap and high-power semiconductor devices such as SiC- and GaN-based MOSFETs, IGBTs, and other devices.
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Oxford Instruments, UK, has been awarded a prestigious Institute of Physics Business Innovation Award for the development of BEX, a breakthrough analytical technique in scanning electron microscopes, enabling new capabilities and accelerating time to results by at least an order of magnitude.
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Intertek, UK, a leading Total Quality Assurance provider to industries worldwide, announced the opening of a new Intertek Caleb Brett laboratory in Naples, Italy, strengthening its presence in this important region and addressing a growing demand for reliable, high-quality testing services in crude oil, refined fuels, and emerging biofuels.
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Tescan, Czech Republic, announces that Carlyle, together with the other shareholders, has entered into a definitive agreement with Shimadzu Corporation, Japan, for the sale of the company, resulting in a change in Tescan’s shareholding structure.
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3D-Micromac AG, Germany, introduced microPREP L, a laser-based sample prep system that supports up to whole 12-inch wafers and system-level boards, enabling fast, precise, reproducible, and non-destructive material removal for semiconductor failure analysis and quality assurance.
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Tescan Group, Czech Republic, acquired FemtoInnovations, a leading innovator in ultrafast laser technologies, and created a new dedicated Laser Technology Business Unit headquartered at the University of Connecticut Tech Park that expands Tescan’s correlative and multimodal portfolio for semiconductor, biomedical device manufacturing, and advanced research markets.
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Materials scientists at the University of Minnesota Twin Cities have found a way to create and control tiny internal “flaws” inside ultra-thin materials known as extended defects, that could give next-generation nanomaterials entirely new properties, opening the door to advances in nanotechnology.
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Toyota and Lexus have launched one of the year’s biggest recalls, affecting over a million vehicles from 2023–2026 due to a parking assist camera issue.
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Oxford Instruments’ Raman imaging team in England announced a refreshed core microscope line and a groundbreaking new spectrometer, Hexalight, which together with the witec360 microscope constitute the most advanced confocal Raman imaging system yet devised.
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Exosens, France, extends its technology portfolio by signing an agreement to acquire Phasics, France, leader in high performance cameras based solutions for optical metrology.
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Gatan, Inc., Pleasanton, Calif., launched the EDAX Orbis II System, designed to support a wide range of non-destructive elemental analysis that use micro x-ray fluorescence.
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Researchers from UConn and the U.S. Naval Research Laboratory have outlined new ways to accurately track and manage heat in ultrawide bandgap semiconductors, a challenge that has become increasingly important as these materials drive the future of high-performance electronics.
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Instron, Norwood, Mass., released the AVE3, an advanced non-contacting video extensometer that delivers precise strain measurement with unparalleled, micron-level accuracy for tensile, compression, and bend testing.
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Integrated Service Technology Inc., Taiwan, a leading provider of electronic product verification and analysis services, launched its Global Smart Reliability Center, developed in response to the growing demand for early-stage reliability testing in AI, high-performance computing, and electric vehicle applications.
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Sigray, Inc. of Benicia, Calif. has launched the Apex-Hybrid, a breakthrough X-ray system designed to revolutionize failure analysis in semiconductor and electronics labs with interchangeable laminography and tomography modes, delivering exceptional speed and 350nm high-resolution imaging for everything from large packages and PCBs to the smallest components.
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SKF, Sweden, and Bearings Services Durban, South Africa, conducted a collaborative bearing failure analysis at Tongaat Hulett’s sugar refinery in Durban, South Africa, identifying inadequate lubrication as the root cause of rolling contact fatigue and providing corrective measures to prevent future failure.
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Engineering Systems Inc., Aurora, Ill., expanded its Northeast presence by opening a new office in Lincoln Park, New Jersey, enhancing its ability to serve clients in the tri-state area with direct access to its nationwide network of experts and laboratories.
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Southwest Research Institute, San Antonio, Texas, collaborated with the U.S. Air Force to enhance fleet safety by developing advanced risk and damage tolerance analyses that led to a more effective inspection schedule for the T-38 Talon-helping detect cracks before they become critical.
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