Keysight Technologies, Inc., Santa Rosa, Calif., has enhanced its double-pulse test portfolio enabling customers to benefit from accurate and easy measurement of the dynamic characteristics of wide-bandgap power semiconductor bare chips.
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Phase3D, Chicago, Ill., is working with commercial part manufacturer, Alloyed in the UK, to characterize part and build quality and determine how anomalies in a build cause defects in a part using the Fringe in-situ inspection system.
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The UK Battery Industrialization Center, United Kingdom, opened its new upgraded and extended Battery Development Laboratory, greatly increased the facility’s capabilities in key areas of battery materials characterization, cell analysis, and forensic activities.
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Ironwood Electronics, Eagan, Minn., is now producing elastomer sockets which include a protective “P” layer that allows for more insertions by protecting the elastomer from erosion and debris build up, extending the life of the elastomers to 200,000 plus insertions.
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Raith, Denmark, a developer of maskless nanofabrication systems and characterization solutions, acquired Xnovo Technology ApS, a dynamic and innovative technology development company in Denmark specializing in advanced imaging methods and materials characterization.
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TESCAN Group, a.s, Czech Republic, a leading global manufacturer of electron microscopes and advanced scientific instruments, has acquired EXpressLO LLC, Lehigh Acres, Fla., a provider of innovative FIB lift-out solutions for specimen preparation in STEM and other analytical techniques.
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Thermo Fisher Scientific, Waltham, Mass., has highlighted the ability of scanning electron microscopy to successfully capture defects when conducting failure analysis on metals.
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In a significant move to streamline mechanical testing and enhance material insights, Airbus, France, the global aerospace leader, is collaborating with Plastometrex, England, to support the standardization of profilometry-based indentation plastometry (PIP) – the innovative mechanical testing technique developed and commercialized by the Cambridge-based technology provider.
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Photonics Management Corp., Bridgewater, N. J., a subsidiary of Hamamatsu Photonics K.K., Japan, has purchased the stock of BAE Systems Imaging Solutions, Inc. a subsidiary of BAE Systems, Inc., Falls Church, Va.
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HORIBA STEC, Co., Ltd., Japan, released the fully automated thin film inspection system, Xtrology, that combines spectroscopic ellipsometry, Raman spectroscopy, and photoluminescence sensors making it possible to perform important inspections, such as film thickness measurement, defect analysis, and composition analysis of various wafers with a single instrument.
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NenoVision, Czech Republic, a leading innovator in advanced microscopy solutions, has been honored with the esteemed R&D 100 Award in the Analytical/Test category for its AFM-in-SEM LiteScope technology.
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QuantumDiamonds GmbH, Germany, a pioneer in quantum sensing technology, released the QD m.0, the first commercial quantum device designed specifically for semiconductor chip failure analysis, using diamond-based quantum microscopy to detect and localize faults in integrated circuits with high precision.
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Materials Analysis Technology Inc., Taiwan, and Swiss SGS Taiwan Ltd. signed a memorandum of understanding with the goal of providing comprehensive ISO 26262 functional safety product certification services, AEC-Q automotive electronic component reliability verification services, and soft error rate assessment and analysis in the automotive semiconductor and electronic component industries in Taiwan.
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Nearly $5 million has been awarded to 17 small businesses across nine states under the Small Business Innovation Research Program to fund projects exploring innovative metrology, measurement services, tools, and instrumentation, marking the first award for the CHIPS Research and Development Office in support of the U.S. semiconductor ecosystem.
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Bruker Corporation, Billerica, Mass., released the Dektak Pro stylus profilometer, the next-generation profiler in the industry-leading Dektak product line, expanding measurement area and accuracy for critical analyses.
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Nitrex, based in Quebec, announced the installation of a new nitriding/nitrocarburizing system at Volkan Steels (V’Steels), a prominent tool steels supplier in Istanbul, Turkey. The new system, model NX-1015, has a 2,000 kg (4,400 lb) capacity, enhancing V’Steels’ ability to provide value-added heat treatment services to its customers.
This advanced Nitrex system supports nitriding, nitrocarburizing, and post-oxidation processes using Nitreg, Nitreg-C, and ONC technologies, crucial for increasing the wear resistance, fatigue strength, and durability of tooling. The upgrade is expected to improve the performance of various tooling applications, such as aluminum extrusion dies, die-casting dies, forging dies, and plastic injection molding dies. This installation reflects V’Steels’ dedication to delivering top-quality tool and stainless steels to industries like energy, petrochemistry, defense, and maritime, meeting the growing demand for high-performance materials.
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Oxford Instruments plc, United Kingdom, a leading provider of high technology products and services to industry and scientific research communities, completed the acquisition of FemtoTools AG, Switzerland. The acquisition was first announced on 11 June 2024, and has been completed following the satisfactory conclusion of closing conditions.
FemtoTools specializes in measuring and imaging the properties (primarily the hardness and stiffness) of materials for research and semiconductor applications at very high resolution via a technique called nanoindentation. It joins Oxford Instruments’ Imaging & Analysis division, where its products will be sold in conjunction with the Group’s existing range of materials analysis tools, including electron microscope micro-analyzers and Raman microscopes.
Richard Tyson, chief executive officer, Oxford Instruments plc, said: “We are delighted to have completed the acquisition of FemtoTools. We welcome our new colleagues and look forward to working with them to integrate nanoindentation – a new technique to Oxford Instruments – into our extensive portfolio of materials analysis capabilities.”
Christian Lang, managing director, Materials Analysis, Oxford Instruments plc, said: “We’re so pleased that the FemtoTools team have chosen to join Oxford Instruments. We’ve had a number of very positive meetings since the announcement and are already making plans for our future together.
“I’m looking forward to integrating FemtoTools’ brilliant technology into our wider product range, and to working with this talented group of people.”
Felix Beyeler, co-founder of FemtoTools, said: “The team and I are very excited for the journey ahead as part of Oxford Instruments. Working together will enable us to extend the reach of our technology and provide even richer analysis to our combined customer base. We’re also looking forward to learning from the hugely experienced Oxford Instruments team.”
For more information:
Oxford Instruments plc
https://www.oxinst.com
A team from Trinity College Dublin has innovated a microscopic imaging technique that lowers radiation exposure and speeds up the process, enhancing safety and efficiency in imaging sensitive materials.
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Nikon Metrology, Inc., Japan, and Hyundai Motor North America, Fountain Valley, Calif., announced that Hyundai has purchased and installed Nikon’s X-ray computed tomography system in its newly opened $51.4 million Safety Test and Investigation Laboratory in Superior Township, Mich.
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NEOTech, Chatsworth, Calif., a leading provider of electronic manufacturing services, design engineering, and supply chain solutions in the high-tech industrial, medical device, and aerospace/defense markets, announced a significant investment in and acquisition of state-of-the-art three-dimensional Computed Tomography scan equipment for its engineering laboratory.
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An improved technique for analyzing single-atom defect structures and minor electron behavior disturbance in semiconductor and other materials has been demonstrated by researchers from the University of Tsukuba in Japan using time-resolved atomic force microscopy combed with ultra-short laser pulse technology.
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The U.S. Department of Energy Office of Environmental Management and contractor Washington River Protection Solutions, Richland, Wash., recently demonstrated a potential new approach to refurbish double-shell tanks at the Hanford Site – a cold spray technology for creating metal patches outside the simulated large waste tank at Hanford’s Cold Test Facility.
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inTEST Corporation, Mt. Laurel, N. J., launched the Acculogic patent-pending hover sense non-contact technology for electric vehicle battery testing, representing a significant leap forward in validating the quality and reliability of EV battery interconnects.
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Scientists from the University of New South Wales published a report into passivated emitter and rear contact (PERC) and tunnel oxide passivated contact (TOPCon) solar modules, finding that the latter has endured “significant degradation” in damp heat testing.
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A transformative merger has been announced in the industrial inspection services sector with the formation of Allco Solutions, LLC, Broussard, LA., a dynamic new company resulting from the integration of GIR Solutions, GIR Mechanical Integrity, and CCI Inspection Services, bringing together comprehensive mechanical integrity, coating, and corrosion inspections under one roof.
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Researchers at the Department of Energy’s Oak Ridge National Laboratory, Oak Ridge, Tenn., are developing algorithms and multilayered communication and control systems that make electric vehicle chargers operate more reliably, even if there is a voltage drop or disturbance in the electric grid.
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Hexagon’s Manufacturing Intelligence division, Sweden, launched the first optical 3D scanner on the market with a motorized zoom lens that enables users to adjust data resolution and measurement volume entirely through software settings.
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The Fraunhofer Institute for Material and Beam Technology IWS in Germany is showcasing the second generation of its user-friendly laser-induced surface wave spectroscopy technology, called LAwave, at the “Control” trade fair in April 2024, facilitating the transition of this research-proven technology into industrial applications.
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The National Institute of Standards and Technology ongoing project will improve time-resolved-emission microscopy by tailoring its’ single-photon detectors and scaling up these sensors to the megapixel level.
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Researchers at the Technion – Israel Institute of Technology, Israel, have shown how to exploit the natural nonlinearity of silicon to track the propagation of light through a circuit to characterize a chip’s performance.
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