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1458 items found
Scalable 3D chips with high-speed interconnections
Published: January 16, 2025
Researchers at the Massachusetts Institute of Technology have developed a technique to create a multilayered chip with alternating layers of high-quality semiconducting material grown directly on top of one another.
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A film capacitor that can take the heat
Published: December 12, 2024
The Department of Energy’s Lawrence Berkeley National Laboratory and several collaborating institutions have successfully demonstrated a machine-learning technique to accelerate discovery of materials for film capacitors and used it to screen a library of nearly 50,000 chemical structures to identify and synthesize a compound with record-breaking performance.
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Tailoring material properties with exquisite precision
Published: December 12, 2024
Penn State researchers have discovered that “atomic spray painting” of potassium niobate can precisely manipulate a material's properties by altering its atomic arrangement, potentially leading to environmentally friendly innovations in consumer electronics, medical devices, and quantum computing.
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GTP elastomer sockets for high-speed applications
Published: December 12, 2024
Ironwood Electronics, Eagan, Minn., is now producing elastomer sockets which include a protective “P” layer that allows for more insertions by protecting the elastomer from erosion and debris build up, extending the life of the elastomers to 200,000 plus insertions.
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Raith acquires Xnovo Technology
Published: December 12, 2024
Raith, Denmark, a developer of maskless nanofabrication systems and characterization solutions, acquired Xnovo Technology ApS, a dynamic and innovative technology development company in Denmark specializing in advanced imaging methods and materials characterization.
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Nanoink, printing technologies could enable electronics repairs, production in space
Published: December 11, 2024
Researchers at Iowa State University, Ames, Iowa, have successfully demonstrated a groundbreaking zero-gravity 3D printing technology using electrohydrodynamic printing and nanoink, paving the way for on-demand manufacturing and electronics repair in space.
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TESCAN Group acquires EXpressLO LLC
Published: December 11, 2024
TESCAN Group, a.s, Czech Republic, a leading global manufacturer of electron microscopes and advanced scientific instruments, has acquired EXpressLO LLC, Lehigh Acres, Fla., a provider of innovative FIB lift-out solutions for specimen preparation in STEM and other analytical techniques.
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Airbus and Plastometrex partner on standardization of PIP
Published: November 14, 2024
In a significant move to streamline mechanical testing and enhance material insights, Airbus, France, the global aerospace leader, is collaborating with Plastometrex, England, to support the standardization of profilometry-based indentation plastometry (PIP) - the innovative mechanical testing technique developed and commercialized by the Cambridge-based technology provider.
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Earthquake prediction techniques provide quick insight into material failure analysis
Published: November 14, 2024
Researchers from the University of Illinois Urbana-Champaign, in collaboration with Sandia National Laboratories and Bucknell University, have found that insight from muscovite mica and earthquake statistics can help quantify how hostile environmental interactions impact the degradation of materials used in advanced solar panels, geological carbon sequestration, and infrastructure.
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Failure and collapse of the Arecibo Observatory telescope assessed by new report
Published: November 14, 2024
A new report from the National Academies of Sciences, Engineering, and Medicine, Washington, D.C., analyzes the causes of the 2020 collapse of the National Science Foundation’s telescope at the Arecibo Observatory in Puerto Rico, where NSF maintained research operations for its National Astronomy and Ionosphere Center, and draws lessons learned for other unique, critical science facilities.
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