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1458 items found
Thermo Fisher highlights use of advanced SEM for metal quality control analysis
Published: November 14, 2024
Thermo Fisher Scientific, Waltham, Mass., has highlighted the ability of scanning electron microscopy to successfully capture defects when conducting failure analysis on metals.
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Nanoscale transistors could enable more efficient electronics
Published: November 14, 2024
In order to overcome a fundamental limit of silicon semiconductor technology that prevents transistors from operating below a certain voltage, Massachusetts Institute of Technology researchers fabricated a different type of three-dimensional transistor using a unique set of ultrathin semiconductor materials.
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Release of the Xtrology fully automated thin film inspection system
Published: November 14, 2024
HORIBA STEC, Co., Ltd., Japan, released the fully automated thin film inspection system, Xtrology, that combines spectroscopic ellipsometry, Raman spectroscopy, and photoluminescence sensors making it possible to perform important inspections, such as film thickness measurement, defect analysis, and composition analysis of various wafers with a single instrument.
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LiteScope receives prestigious R&D 100 Award
Published: November 14, 2024
NenoVision, Czech Republic, a leading innovator in advanced microscopy solutions, has been honored with the esteemed R&D 100 Award in the Analytical/Test category for its AFM-in-SEM LiteScope technology.
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Acquisition of BAE Systems Imaging Solutions, Inc. strengthening the opto-semiconductor segment and accelerating value-added growth
Published: November 14, 2024
Photonics Management Corp., Bridgewater, N. J., a subsidiary of Hamamatsu Photonics K.K., Japan, has purchased the stock of BAE Systems Imaging Solutions, Inc. a subsidiary of BAE Systems, Inc., Falls Church, Va.
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Scientists gain insight into the material defects that cause errors in quantum computing
Published: November 14, 2024
A team of researchers at Ames National Laboratory, Ames, Iowa, has made significant progress in understanding how surface oxides, a primary cause of decoherence in quantum circuits, can improve the performance of quantum computing circuits.
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New material to make next generation of electronics faster and more efficient
Published: November 14, 2024
Researchers at the University of Minnesota have achieved a new artificially designed material that allows electrons to move faster while remaining transparent to both visible and ultraviolet light, breaking the previous record and being pivotal in making the next generation of high-power electronics faster, transparent and more efficient.
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QuantumDiamonds launches QD m.0: first commercial quantum device for semiconductor chip failure analysis
Published: October 17, 2024
QuantumDiamonds GmbH, Germany, a pioneer in quantum sensing technology, released the QD m.0, the first commercial quantum device designed specifically for semiconductor chip failure analysis, using diamond-based quantum microscopy to detect and localize faults in integrated circuits with high precision.
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Materials Analysis Technology releases a MOU with SGS
Published: October 17, 2024
Materials Analysis Technology Inc., Taiwan, and Swiss SGS Taiwan Ltd. signed a memorandum of understanding with the goal of providing comprehensive ISO 26262 functional safety product certification services, AEC-Q automotive electronic component reliability verification services, and soft error rate assessment and analysis in the automotive semiconductor and electronic component industries in Taiwan.
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Faraday enhances 3D-IC design service with Ansys multiphysics analysis
Published: October 17, 2024
Faraday Technology Corporation, Pittsburgh, Pa., a leading application specific integrated circuits (ASIC) design service and IP provider, is expanding its use of Ansys technology to enhance its capabilities in developing advanced designs for multi-die 2.5D/3D-ICs — critical for artificial intelligence (AI), IoT, and 5G applications. With support from Ansys, Faraday will empower its customers to... View Article
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