Bruker introduces nano-scratch capability for nanomechanical testing

Published: November 13, 2016

Bruker's Nano Surfaces Division, San Jose, Calif., announces a nanoscale scratch option for its NanoForce Nanomechanical Testing System.

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Metamaterials enable the first optically controlled electronic devices

Published: November 13, 2016

Engineers from the Applied Electromagnetics Group at the University of California San Diego report that they have fabricated the first semiconductor-free, optically controlled microelectronic device.

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Astronics Test Systems semiconductor test platform processes 396 devices at once

Published: November 13, 2016

Astronics Test Systems, East Aurora, N.Y., introduces its ATS 5034 System-Level Test Platform that improves production efficiency and greatly reduces costs by processing up to 396 devices simultaneously.

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Samsung expands its advanced foundry products portfolio with 14LPU/10LPU processes

Published: November 13, 2016

Samsung Electronics Co. Ltd., Japan, announced at its Device Solutions America headquarters in San Jose, Calif., that it is expanding its advanced foundry process technology products with the fourth-generation 14-nm process and the third-generation 10-nm process.

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Zeiss and ASML strengthen partnership for EUV semiconductor lithography

Published: November 13, 2016

ASML Holding NV, Netherlands, and Carl Zeiss SMT, Germany, have agreed to strengthen their partnership in the semiconductor lithography business to facilitate the development of the next generation of extreme ultraviolet (EUV) lithography systems.

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Qualcomm to buy NXP Semiconductors for its automotive and security systems

Published: November 13, 2016

Qualcomm Inc., San Diego, Calif., announces a definitive agreement to acquire NXP Semiconductors N.V., Netherlands, for about $38 billion because of its leading positions in automotive infotainment, networking, and safety systems, with solutions designed into 14 of the top 15 infotainment customers in 2016.

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Exelsius and Acxys partner for plasma coating printed circuit boards

Published: November 06, 2016

Exelsius, France, has teamed up with Acxys Technologies, also of France, to leverage the latest technological developments for the surface preparation and coating of printed circuit boards.

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Buehler IsoMet High Speed precision cutter enables consistent metal sample sectioning

Published: November 01, 2016

Buehler, Lake Bluff, Ill., introduces the IsoMet High Speed, a precision sectioning machine designed specifically to create consistent and efficient cuts in metals and other materials using diamond or abrasive blades.

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University at Buffalo receives $2.9 million for modeling/simulations lab

Published: October 28, 2016

The University at Buffalo, N.Y., has received a $2.9 million National Science Foundation grant to transform the traditional role of a database as a repository for information into an automated computer laboratory that rapidly collects, interprets, and learns from massive amounts of information.

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Pulsed electron beams enable rapid deposition of Ga-La-S thin films

Published: October 24, 2016

The University of Southampton, England, announces that a research group has developed a rapid deposition technology in which pulsed beams of electrons break up a gallium-lanthanum-sulfur (GLS) glass target material and deposit it as a thin film onto a substrate at a rate greater than 0.2 microns/minute.

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