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1458 items found
Global Wafers acquires SunEdison for its product development capabilities
Published: December 18, 2016
Global Wafers Co. Ltd., Taiwan, announces that its acquisition of SunEdison Semiconductor, St. Peters, Mo., has been successfully completed.
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Lincoln Lab wins Herschel Award for digital-pixel readout integrated circuits
Published: December 18, 2016
The Massachusetts Institute of Technology, Cambridge, announces that the MIT Lincoln Laboratory was presented with the Herschel Award at the recent 2016 Military Sensing Symposia Detectors and Materials Conference for its development of digital-pixel readout integrated circuits.
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Semiconductor equipment sales forecast to reach $40 billion in 2016
Published: December 16, 2016
SEMI, San Jose, Calif., says that worldwide sales of new semiconductor manufacturing equipment will increase by 8.7% to $39.7 billion in 2016, according to its year-end forecast.
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Zeiss automated digital microscope combines three functions into a single module
Published: November 26, 2016
Carl Zeiss, Germany, offers the Smartzoom 5 optical digital microscope in which three functions (zoom, overview camera, and coaxial illumination) are combined in a single optical engine.
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Microscope camera provides intelligent real-time and fluorescence imaging
Published: November 26, 2016
Olympus, Japan, introduces the DP74 color fluorescence microscope camera, which combines advanced image processing technology, a low-noise design, and easy-to-use software to deliver smooth, true-to-life images in demanding industrial applications.
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NIST releases “Fractography of Ceramics and Glasses” to facilitate failure analysis
Published: November 26, 2016
NIST, Gaithersburg, Md., has released a new and expanded edition of the NIST Recommended Practice Guide, "Fractography of Ceramics and Glasses" (NIST Special Publication 960-16e2), developed to help engineers and scientists analyze the patterns in fractures of ceramics and glasses.
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Hitachi high-voltage CD-SEM measures high aspect-ratio trenches and contact holes
Published: November 19, 2016
Hitachi High-Technologies Corp., Japan, launches its Advanced High Voltage CD-SEM - CV5000 Series, which is capable of measuring high aspect-ratio trenches and contact holes, as well as measuring device patterns.
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Siemens to acquire Mentor Graphics for its electronics IC and systems design
Published: November 14, 2016
Siemens AG, Munich, and Mentor Graphics, Wilsonville, Ore., announce that they have entered into a merger agreement under which Siemens will acquire Mentor for its electronics IC and systems design, simulation, and manufacturing solutions.
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Optotherm radiometric infrared camera based on amorphous silicon microbolometers
Published: November 14, 2016
Optotherm, Sewickley, Pa., recently developed the IS640 radiometric infrared camera designed for thermographic applications requiring high sensitivity, resolution, and accuracy.
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Suss MicroTec launches coat and develop solution for advanced packaging
Published: November 13, 2016
Suss MicroTec, Germany, has launched its new generation of the fully automated ACS300 Gen3 platform specifically designed for high volume manufacturing of advanced packaging applications such as wafer-level chip scale packaging, fan-out wafer-level packaging, copper pillar flip-chip, and 3D packaging.
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