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1458 items found
ASM Appoints New Managing Director
Published: September 13, 2016
The ASM International Board of Trustees announces the appointment of William T. (Bill) Mahoney as Managing Director effective immediately.
News, Magazine & Media / Industry News
SEMI forecasts 19 new fabs and lines to be built this year and next
Published: August 22, 2016
SEMI, San Jose, Calif., forecasts that 19 new fabs and lines will be built in 2016 and 2017, according to the latest update of the SEMI World Fab Forecast report.
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New Imec Florida to focus on photonics and high-speed integrated circuits
Published: August 22, 2016
Imec, San Francisco, a nanoelectronics research center, has opened Imec Florida, a new entity focusing on photonics and high-speed electronics IC design based in Osceola.
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GlobalWafers to acquire SunEdison Semiconductor for its global footprint
Published: August 22, 2016
GlobalWafers Co. Ltd., Taiwan, announces that it has agreed to acquire SunEdison Semiconductor Ltd., Singapore, because of SunEdison's expansive global footprint and product development capabilities.
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Helios G4 CX plasma focused ion beam instrument enables nanometer analysis
Published: August 22, 2016
FEI Co., Hillsboro, Oregon, announces that the latest technological innovations of the Helios G4 CX plasma-focused ion beam instrument, in combination with comprehensive software and FEI's application expertise, allow Helios G4 CX with optional AS&V4 software to acquire the highest-quality multi-modal 3D datasets.
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Analog Devices to acquire Linear Technology to bridge analog and digital worlds
Published: August 20, 2016
Analog Devices Inc., Norwood, Mass., and Linear Technology Corp., Milpitas, Calif., announce that they have entered into a definitive agreement under which Analog Devices will acquire Linear Technology in a cash and stock transaction that values the combined enterprise at approximately $30 billion.
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E-beam wafer inspection system provides high resolution, fast throughput
Published: August 20, 2016
Applied Materials Inc., Santa Clara, Calif., announces that its next-generation ProVision e-beam wafer inspection system delivers the highest resolution and image quality at the fastest throughput to foundry, logic, DRAM, and 3D NAND customers as they move to advanced nodes.
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Tokyo Electron joins Semiconductor Research Corporation
Published: August 19, 2016
Semiconductor Research Corp., Durham, N.C., announces that Tokyo Electron Limited has joined SRC's Nanomanufacturing Materials and Processes initiative.
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Mentor Graphics launches new Xpedition enterprise platform
Published: August 19, 2016
Mentor Graphics Corp., Wilsonville, Ore., announces the first phase of the new Xpedition printed circuit design flow to address the increasing complexity of today's advanced systems.
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ALD process developed for low-fluorine tungsten films
Published: August 19, 2016
Lam Research Corp., Fremont, Calif., an advanced manufacturer of semiconductor equipment,introduces an atomic layer deposition process for depositing low-fluorine-content tungsten films, the latest addition to its Altus family of products.
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