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1458 items found
Fluorescent microcapsules identify microscopic failure
Published: August 18, 2016
The Autonomous Materials Systems Group at the Beckman Institute for Advanced Science and Technology, Urbana, Ill., recently devised a way to identify microscopic damage in polymers and composites by incorporating microcapsules containing materials that fluoresce under stress.
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Bruker e-FlashFS/e-FlashHd detectors enable fast, sensitive EBSD analysis
Published: August 18, 2016
Bruker Nanoanalytics, Germany, introduces the e-FlashFS and e-FlashHD, two models of a new generation of detectors for electron backscatter diffraction analysis on scanning electron microscopes; and Esprit Qube, a new software package for advanced post-processing and visualization of 3D EBSD/EDS data cubes.
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Instron Torsion Add-On enables simultaneous axial and torsion tests
Published: August 18, 2016
Instron, Norwood, Mass., has designed the Instron Torsion Add-On for simple simultaneous axial and torsional testing to ensure the performance of many consumer products, packaging, electronics, and medical devices.
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Pathfinder X-ray microanalysis software maps chemical constituents
Published: August 18, 2016
Thermo Fisher Scientific, Boston, introduces Pathfinder X-ray microanalysis software, which is designed to process incoming data from X-ray detector technology and to provide a real-time statistical map of the chemical constituents within a sample.
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EAG Laboratories combines 11 labs into one company
Published: August 17, 2016
EAG Inc., San Diego, announces that it has formed EAG Laboratories, a single entity combining all of its 11 labs, including Evans Analytical Group, ABC Laboratories, Chemir Analytical Services, SEAL Laboratories, Shiva Technologies, NanoScience, Accurel, and MEFAS, among others.
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Asian electronic company selects Harper for elevator furnaces
Published: July 27, 2016
Harper International, Buffalo, N.Y., has been selected by a leading Asian electronic components firm for the design of two high-temperature elevator furnaces for its production plant.
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Amkor receives “Device of the Year” for SWIFT semiconductor package
Published: July 25, 2016
Amkor Technology Inc., Tempe, Ariz., recently received the 3D InCites "Device of the Year" award during SEMICON West for its SWIFT semiconductor package.
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Rudolph Clearfind Technology detects organic defects
Published: July 25, 2016
Rudolph Technologies Inc., Wilmington, Mass., introduces its Clearfind technology, which can detect organic defects that are difficult or impossible to see with conventional white-light imaging techniques.
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Coventor wins “Best of West” Award
Published: July 25, 2016
Coventor, Cary, N.C., announces that it has won the "Best of West" award presented by Solid State Technology and SEMI a the Semicon West conference July 13.
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Nondestructive hybrid system integrates XRF and 3D optical methods
Published: July 25, 2016
XwinSys, Carefree, Ariz., recently launched the Onyx, a novel in-line and nondestructive hybrid metrology system that uniquely integrates advanced XRF with 2D and 3D optical technologies.
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