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1458 items found
Cadence Virtuoso LDE analyzer helps accelerate designs to production
Published: April 25, 2016
Cadence Design Systems Inc., England, announces that Cadence Virtuoso Layout-Dependent Effects (LDE) analyzer has been qualified by United Microelectronics Corporation (UMC) to support its 28HPCU process technology.
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North American semiconductor 2015 market report
Published: April 24, 2016
Semi, San Jose, Calif., reports that the global semiconductor materials market decreased by 1.5% in 2015 compared to 2014, while worldwide semiconductor revenues decreased by 0.2 %.
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2016 Pittcon Heritage Award presented to JEOL founders
Published: April 24, 2016
The 2016 Pittcon Heritage Award, jointly sponsored by the Pittsburgh Conference on Analytical Chemistry and Applied Spectroscopy (Pittcon) and the Chemical Heritage Foundation (CHF), has been presented to Kenji Kazato (1917-2012) and Kazuo Ito (1921- ), who led a group of scientists in Japan to develop an electron microscope.
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Dual-beam laser spike anneal system enables process flexibility in chip production
Published: April 24, 2016
Ultratech Inc., San Jose, Calif., announces a follow-on order from a major foundry for its LSA101 laser spike anneal system equipped with the dual-beam option, which provides a second low-power laser that adds flexibility to chip production.
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Samsung mass produces first 10-nm class DRAM
Published: April 24, 2016
Samsung Electronics Co. Ltd., Korea, has begun mass producing the industry's first 10-nm class 8Gb DDR4 (double-data-rate-4) DRAM chips and the modules derived from them.
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Sandia National Laboratories licenses Invensas ZiBond and DBI electronic bonding technologies
Published: April 24, 2016
Invensas Corp., San Jose, Calif., announces that Sandia National Laboratories has signed a new license agreement for ZiBond low-temperature homogeneous bonding technology and for Direct Bond Interconnect (DBI) technology, a low-temperature, hybrid bonding technology for integrated electrical interconnects.
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ESD Alliance, Semico Research sign joint marketing agreement
Published: April 24, 2016
The Electronic System Design (ESD) Alliance, San Jose, Calif., and Semico Research, Phoenix, Ariz., announce that they have entered into a joint marketing agreement to work together on several business initiatives in support of the semiconductor design ecosystem.
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Amkor ships 700 million RF and advanced SIP modules for mobile devices
Published: April 24, 2016
Amkor Technology Inc., Tempe, Ariz., announces that it has shipped 700 million RF and front-end advanced system-in-package (SIP) modules for mobile device applications.
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Software enables automated reporting of surface analyses from 3D optical microscopes
Published: April 24, 2016
Bruker Corp., San Jose, Calif., and Digital Surf, France, announce that Bruker Nano Surfaces is offering Vision64 Map data analysis and reporting software, which enables streamlined access to automated reporting of advanced surface measurements in 11 languages, while ensuring compatibility across a wide range of industry standards.
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Advanced thermal imaging cameras can detect temperature differences of 1 mK
Published: April 20, 2016
Flir Systems, Wilsonville, Oregon, has developed X6000sc and X8000sc series thermal imaging cameras with Lock-In, Transient, and Pulse capabilities that can resolve temperature differences as low as 1 mK for advanced inspections.
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