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1458 items found
Moticam CMOS camera with Android tablet attaches to optical microscope
Published: March 29, 2016
Ted Pella Inc., Redding, Calif., offers Moticam CMOS cameras with attached Android tablet, as well as Bluetooth, a Quad Core CPU, and 16 gigabits of internal storage.
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Keyence VHX -5000 microscope enables IMR Test Labs to speed turnaround
Published: March 29, 2016
IMR Test Labs, Lansing, N.Y., now offers metallurgical services using a Keyence VHX-5000 microscope, which allows IMR to provide enhanced 3D, free-angle imaging at magnifications previously not available, which enables more-accurate measurements and photomicrographs of samples.
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IBC to supply Beralcast components to semiconductor manufacturer
Published: March 20, 2016
IBC Advanced Alloys Corp., Vancouver, has signed an agreement with a leading global manufacturer of semiconductor and electronics assembly equipment to be its exclusive supplier of Beralcast beryllium-aluminum cast components.
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Jeol Neoscope SEM enables rapid inspection of electronics
Published: March 19, 2016
Jeol USA, Peabody, Mass., introduces a new benchtop SEM, the JSM-6000Plus, the third generation of the NeoScope, which delivers fast, high-magnification electron microscopy with more functionality than typical benchtop SEMs.
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Cadence develops design and analysis solution for wafer-level chip scale packaging
Published: March 19, 2016
Cadence Design Systems Inc., San Jose, Calif., offers a foundry-proven IC packaging design and analysis solution for advanced fan-out Wafer-Level Chip Scale Packaging (WLCSP) and 2.5D interposer-based designs.
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Oxford Instruments Aztec One XT software platform simplifies EDS analysis
Published: March 19, 2016
Oxford Instruments, has launched the Aztec One XT system, an ideal solution for those who want to perform a complex task such as EDS as quickly and as easily as possible.
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Imec opens 300mm cleanroom for 7nm and beyond chip scaling
Published: March 19, 2016
Imec, Belgium, announces the opening of its new 4000-square-meter cleanroom facility dedicated to scaling IC technology beyond 7nm, bringing the total floor space of its semiconductor research cleanrooms to 12,000 square meters.
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Taiwan is new global leader in total IC wafer fab capacity
Published: March 19, 2016
IC Insights, Scottsdale, Ariz., recently released its new "Global Wafer Capacity 2016-2020" report showing that, as of December 2015, Taiwan is now the global leader in wafer capacity with nearly 22% of worldwide IC capacity installed in the country.
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Market for GaN and SiC power semiconductors to top $1B in 2020
Published: March 19, 2016
IHS Inc., Englewood, Colo., reports that the emerging market for silicon carbide and gallium nitride power semiconductors is forecast to pass the $1 billion mark in five years, energized by demand from hybrid and electric vehicles, power supplies, and photovoltaic inverters.
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Advanced power amplifiers enable faster data access, better connections
Published: March 19, 2016
Global Foundries, Santa Clara, Calif., announces advanced radio-frequency silicon solutions for power amplifiers, further expanding the portfolio of silicon-germanium power amplifier technologies designed to enable performance-optimized cellular and Wi-Fi devices.
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