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1458 items found
SEMI launches European integrated packaging assembly/test group
Published: February 22, 2016
Semi, San Jose, Calif., has launched the European Semiconductor integrated Packaging and Test (ESiPAT) Special Interest Group to foster collaboration among companies, and to collectively raise the profile and reinforce the semiconductor back-end industry in Europe.
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Global semiconductor sales top $335B in 2015
Published: February 22, 2016
The Semiconductor Industry Association, Washington, announces that the global semiconductor industry posted sales totaling $335.2 billion in 2015, a slight decrease of 0.2% compared to the 2014 total, which was the industry's highest-ever sales total.
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Imec and Iminds to merge and create nanoelectronics research center
Published: February 22, 2016
Imec and Iminds, both of Belgium, announce that they intend to merge the research centers to create a nanotech research center in which Iminds will be integrated as an additional business unit within Imec.
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Veeco TurboDisc As/P MOCVD reactor system enables 20% cost reduction
Published: February 22, 2016
Veeco Instruments Inc., Plainview, N.Y., has launched the TurboDisc K475i arsenic phosphide (As/P) metal organic chemical vapor deposition (MOCVD) system for the production of red, orange, and yellow light-emitting diodes, as well as multi-junction III-V solar cells, laser diodes, and transistors.
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Keysight Precision SMU low-cost software supports full device characterization
Published: February 22, 2016
Keysight Technologies Inc., Santa Rosa, Calif., introduces a number of different low- or no-cost software control options for its B2900A Series Precision Source/Measure Units.
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Ultratech’s AP300 lithography systems chosen for next-gen packaging applications
Published: February 21, 2016
Ultratech Inc., San Jose, Calif., announces that it has received an order for multiple AP300E lithography systems from a leading outsourced semiconductor assembly and test company.
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Cadence debuts product for reducing test time, costs
Published: February 21, 2016
Cadence Design Systems, San Jose, Calif., introduces the Modus Test Solution, a product that reportedly enables design engineers to reduce test time by up to a factor of three, thereby reducing production test cost and increasing silicon profit margins.
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Soitec announces volume manufacturing of 300mm RF-SOI substrates
Published: February 21, 2016
Soitec, France, has begun mass production of 300mm radio-frequency silicon-on-insulator (RF-SOI) substrates for mobile communications.
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Suny Polytechnic and Global Foundries establish $500 million EUV program
Published: February 21, 2016
Suny Polytechnic Institute, Utica, N.Y., and Global Foundries, Milpitas, Calif., have established a new Advanced Patterning and Productivity Center, a $500 million, five-year program to accelerate the introduction of extreme ultraviolet lithography technologies into manufacturing.
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Light industrial heat treating furnaces designed for testing facilities and labs
Published: February 16, 2016
Lindberg/MPH, Riverside, Mich., offers a light industrial furnace line that is ideal for smaller-scale operations such as testing facilities, laboratories, and small industrial plants.
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