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1458 items found
Compact noncontact surface profiler integrates three functions into sensor head
Published: February 11, 2016
Sensofar Metrology, Spain, introduces the S Lynx, a compact high-resolution noncontact 3D surface profiler that is said to integrate confocal, interferometry, and focus-variation functions into the same sensor head.
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Rare earth elements extracted from coal byproducts via ion exchange
Published: February 11, 2016
Pennsylvania State University, State College, reports that its researchers have teamed with U.S. DOE scientists to develop a cost-effective ion-exchange process to extract rare earth elements from coal byproducts.
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Lasers enable secure joining of metal and plastic
Published: February 04, 2016
The Technical University of Munich reports that its engineers are optimizing processes to securely fuse metals and thermoplastics by first texturing the metal surface with a laser beam, producing tiny hollows, then applying heat.
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Zeiss Versa X-ray microscope with FPX flat panel extension enables faster sample scanning
Published: February 01, 2016
Carl Zeiss X-ray Microscopy Inc., Germany, introduces the Xradia Versa X-ray 500-series of 3D X-ray microscopes with FPX flat panel extension, which enhances imaging flexibility and creates workflow efficiencies.
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Microchip Technology acquires Amtel to combine product portfolios
Published: January 22, 2016
Microchip Technology Incorporated, Chandler, Ariz., and Atmel Corp., San Jose, Calif., announce that Microchip has signed a definitive agreement to acquire Atmel for $8.15 per share in a combination of cash and Microchip common stock.
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Amkor Technology announces acquisition of remaining shares of J-Devices
Published: January 22, 2016
Amkor Technology Inc., Tempe, Ariz., has increased its ownership interest in J-Devices Corp., Japan, from 65.7% to 100% through the exercise of previously disclosed options.
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Lasertec laser microscope achieves high-resolution of wafer surfaces
Published: January 22, 2016
Lasertec, Japan, offers the WASAVI series BIM300 laser microscope, which achieves high-resolution observation on wafer surfaces, as well as high precision measurement of via reveal and bump dimensions and shapes.
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Library of nanoporous gold structures produced on single chip via tunable lasers
Published: January 22, 2016
Lawrence Livermore National Laboratory. Livermore, Calif., reports that its researchers have created a library of nanoporous gold structures on a single chip that has direct applications for high-capacity lithium ion batteries as well as neural interfaces.
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SEMI Awards honor process and technology integration achievements
Published: January 22, 2016
SEMI, San Jose, Calif., announces the recipients of the 2015 SEMI Awards for innovations that have become such an integral part of the semiconductor manufacturing industry's infrastructure that the technology itself has become fundamental.
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Cadence and Arrow Electronics collaborate to develop integrated PCB design tools
Published: January 22, 2016
Cadence Design Systems Inc., San Jose, Calif., and Arrow Electronics, Centennial, Colo., announce a collaboration that will bring integrated design tools to engineers, helping them accelerate the pace of new product development and get products to market faster and cheaper.
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