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1458 items found
Imec, Coventor collaborate to optimize 7 nm semiconductor manufacturing
Published: December 14, 2015
Imec, Belgium, and Coventor, Cary, N.C., announce the expansion of a joint development project to explore process variation issues in 7 nm semiconductor technology.
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Cardiff University and IQE partner to build center for compound semiconductor research
Published: December 13, 2015
Cardiff University and IQE plc, both of Wales, announce a joint venture to build the Compound Semiconductor Centre, which has the goal of developing and commercializing next-generation compound semiconductor technologies.
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On Semiconductor to acquire Fairchild Semiconductor for $2.4 billion
Published: December 13, 2015
On Semiconductor Corp., Phoenix, Ariz., and Fairchild Semiconductor Intl. Inc., South Portland, Maine, announce plans for On Semiconductor to acquire Fairchild for $20.00 per share in an all cash transaction valued at approximately $2.4 billion.
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Copper oxide coated microporous foam heat sinks enable higher emissivity
Published: December 13, 2015
Goodfellow Corp., Coraopolis, Pa., reports that its microporous copper foam coated with a thin, hard layer of copper oxide provides outstanding performance as a low-profile heat sink in passive cooling environments.
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Helios G4 HX designed for high-throughput failure analysis of semiconductors
Published: December 13, 2015
FEI Co., Hillsboro, Ore., introduces the Helios G4 HX as the industry's highest throughput, dedicated TEM lamella preparation platform, designed to meet the challenges of advanced semiconductor failure analysis labs.
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Bruker D8 Gen 2 crystallography platform optimized for X-ray diffraction
Published: December 12, 2015
Bruker AXS, Madison, Wis., introduces the D8 Gen 2, which features the latest version of the Incoatec Microfocus Source, the IµS 3.0, the first microfocus source specifically designed and optimized for X-ray diffraction.
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Brewer Science to develop nanotechnology applications for military
Published: December 12, 2015
Brewer Science, Rolla, Mo., has signed a new cooperative agreement at Missouri State University's Jordan Valley Innovation Center (JVIC) for developing nanotechnology applications to protect the U.S. military.
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Mentor Graphics Veloce emulation platform supports Andes Processors
Published: December 12, 2015
Mentor Graphics Corp., Wilsonville, Ore., announces that its Veloce emulation platform, specifically the Codelink offering, now supports the debug of designs built with AndesCore processors such as N10 and N13.
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Lasertec wafer edge inspection enables higher chip production
Published: December 12, 2015
Lasertec Corp., Japan, announces that it has launched its EZ300, a wafer edge inspection system based on a new concept that contributes to higher yields at wafer edges in the production of semiconductor chips.
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Nanodiamond-containing polymers conduct heat, resist wear
Published: December 12, 2015
Carbodeon, Finland, has been granted a U.S. patent for detonation-synthesized diamond particles (nanodiamonds) that are combined with polymers to produce wear-resistant materials with good thermal conductivity.
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