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1458 items found
Journal of Thermal Spray Technology Announces Editorial Transition
Published: December 04, 2015
After 12 years as Editor-in-Chief of the Journal of Thermal Spray Technology, Dr. Christian Moreau has transferred his responsibilities to Dr. Armelle Vardelle, who has been Lead Editor since 2013; she will be succeeded as Lead Editor by Dr. André McDonald.
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Acxys tool enables precise deposition of SiOx thin films in open air
Published: December 04, 2015
Acxys Technologies, France, has introduced its UL-Coat (ULC) module, which injects a precursor into plasma generated by its ULS plasma spot module, thus enabling deposition of thin films of SiOx in open air.
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Oxygen-free copper strip produced in continuous casting, rolling, and coiling process
Published: November 30, 2015
Mansfelder, Kupfer, und Messing GmbH (MKM), Germany, has begun the production of high-purity, oxygen-free copper strip via Conti-M technology, which makes it possible to cast, hot-roll, mill, and coil copper strip in a continuous process.
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ISTFA 2015 breaks attendance records
Published: November 18, 2015
The International Symposium for Testing & Failure Analysis (ISTFA) 2015 took Portland, Ore., by storm last week with record attendance and fun new events.
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Micron donates $25 million to Boise State for materials research
Published: November 17, 2015
Boise State University, Idaho, announces a $25 million gift from the Micron Foundation that will have a transformational impact on its engineering materials research programs.
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Arm Ltd. joins global research collaboration for continued scaling of semiconductors
Published: November 16, 2015
Semiconductor Research Corp., Research Triangle Park, N.C., announces that Arm Ltd., San Jose, Calif., has joined its Global Research Collaboration program.
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Jeol SEM features expanded EDS analysis, hi-rez imaging, and ports for multiple detectors
Published: November 16, 2015
Jeol USA, Peabody, Mass., introduces the JSM-IT100 scanning electron microscope, which features expanded EDS analysis capabilities and ports for multiple detectors.
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Global Foundries introduces FX-14 application-specific integrated circuit
Published: November 15, 2015
Global Foundries, Santa Clara, Calif., announces the availability of FX-14, an application-specific integrated circuit development built on the company's next-generation 14-nm FinFET process technology.
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Akhan Semiconductor opens global headquarters in Illinois
Published: November 15, 2015
Akhan Semiconductor, Gurnee, Ill., has opened its global headquarters and production facility to develop and manufacture next-generation diamond-based semiconductors.
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Suss wafer bonder supports substrates with wafer size up to 200 mm
Published: November 15, 2015
Suss MicroTec, Germany, has launched XB8, a wafer bonder designed to support substrates with a wafer size up to 200 mm.
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