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1458 items found
Transistors cooled by water flowing through microfluidic passages in chips
Published: October 17, 2015
Georgia Institute of Technology, Atlanta, reports that its researchers have developed a technology for cooling transistors that is based on de-ionized water flowing through microfluidic passages.
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ASM International elects new president, vice president, treasurer, and trustees
Published: October 15, 2015
ASM International, Materials Park, Ohio, elected Jon D. Tirpak, PE, FASM, as ASM's 2015-2016 Board of Trustees President.
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New machining capability is efficient and cost-effective
Published: October 08, 2015
Norman Noble Inc., Cleveland, Ohio, introduces SynchroFlash, a new machining capability that synchronizes Swiss turning and milling and laser machining into one, highly efficient and cost- effective operation.
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RIT chosen to lead university-industry consortium to advance additive manufacturing
Published: October 02, 2015
Rochester Institute of Technology, Rochester, N.Y., announces that it has been chosen to lead a consortium of universities and corporations in establishing a New York State Center for advanced technology in additive manufacturing and functional printing.
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Advancing development of thermal manufacturing technologies
Published: September 24, 2015
Cross-industry Consortium Leads the Way to Advanced Thermal Manufacturing
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Suss MicroTec launches semi-automated high-force wafer bonder
Published: September 18, 2015
Suss MicroTec, Germany, introduces the XB8 semi-automated wafer bonding platform, which supports substrates with a wafer size of up to 200 mm.
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Macom announces milestone in the commercialization of GaN on silicon technology
Published: September 18, 2015
Macom Technology Solutions Inc., Lowell, Mass., reports that it has shipped more than one million GaN-on-Silicon (GaN on Si) RF power devices to date for communications, military, and other RF applications.
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JEOL introduces entry level Field Emission SEM with ultrahigh spatial resolution
Published: September 18, 2015
Jeol USA, Peabody, Mass., introduces the new JSM-7200F FE SEM with ultrahigh spatial resolution of 1.6 nm at 1.0 kV, and high probe current of 300 nA.
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Global Foundries launches 22FDX semiconductor technology for ultralow-power devices
Published: September 17, 2015
Global Foundries, Santa Clara, Calif., has launched a new semiconductor technology developed specifically to meet the ultralow-power requirements of the next generation of connected devices.
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XFlash FlatQuad SDD enables high vacuum and low beam-current EDS analysis
Published: September 17, 2015
Bruker Nano Analytics, Madison, Wis., has developed XFlash FlatQuad, a side-entry silicon drift detector positioned between the SEM pole piece and sample.
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