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1458 items found
Shimadzu high-speed video camera allows ten million frames per second
Published: October 19, 2015
Shimadzu Scientific Instruments, Japan, announces the release of its new Hyper Vision HPV-X2 high-speed video camera.
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Silicon drift detectors with silicon nitride entry window enable 35% higher sensitivity
Published: October 19, 2015
Edax Inc., Mahwah, N.J., introduces a new series of Octane Elite silicon drift detectors with silicon nitride entry windows that offer up to 35% better light-element sensitivity and outstanding low-energy performance.
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Silicon drift detectors with silicon nitride entry window enable fast energy dispersive spectroscopy
Published: October 19, 2015
Edax Inc., Mahwah, N.J., introduces a new series of Octane Elite silicon drift detectors, which offer up to 35% better light-element sensitivity and outstanding low-energy performance due to silicon nitride entry windows.
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Jeol introduces third-generation Neoscope SEM with upgraded functionality
Published: October 19, 2015
Jeol USA, Peabody, Mass., introduces the JSM-6000Plus, the third generation of the popular NeoScope benchtop SEM, which delivers fast, high magnification electron microscopy with more functionality than typical benchtop SEMs.
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Hitachi TEM is now compatible with imaging software from Advanced Microscopy Techniques
Published: October 19, 2015
Hitachi High Technologies America Inc., Clarksburg, Md., announces that Hitachi, the University of Colorado at Boulder, and the TEM camera manufacturer Advanced Microscopy Techniques (AMT) of Woburn, Mass., have collaborated to develop a convenient software package for state-of-the-art, single or dual-axis tomography acquisition and extended image montaging for the Hitachi HT7700 TEM.
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Rudolph acquires semiconductor inspection technology of Stella Alliance
Published: October 19, 2015
Rudolph Technologies Inc., Flanders, N.J., has purchased Stella Alliance LLC for its patented illumination, auto-focus, and image acquisition technology, which significantly enhances the ability to identify certain critical defects not visible with current techniques.
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Aehr receives first order for Fox-XP test and burn-in system
Published: October 17, 2015
Aehr Test Systems, Fremont, Calif., has received its first order for its Fox-XP wafer level test and burn-in system, including multiple Fox-XP WaferPak contactors and application development services.
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Bruker to acquire Jordan Valley Semiconductors Ltd. for X-ray metrology
Published: October 17, 2015
Bruker Corp., Billerica, Mass., announces that it is to acquire the shares of Jordan Valley Semiconductors Ltd. for its innovative in-line X-ray metrology products, which complement Bruker's leading position in analytical X-ray technologies.
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1366 Technologies to build Direct Wafer manufacturing plant in New York
Published: October 17, 2015
1366 Technologies, Bedford, Mass., announces plans to build a state-of-the-art, commercial solar wafer manufacturing facility in Genesee County, New York, strategically located between Buffalo and Rochester.
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DCG Systems’ Meridian M designed for static optical failure analysis of wafers
Published: October 17, 2015
DCG Systems, Fremont, Calif., has released the Meridian M system for isolation of both routine and challenging electrical faults at the wafer level.
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