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1458 items found
Water-free manufacturing approach could advance 2D electronics integration
Published: October 17, 2024
A team of academic and enterprise researchers at Penn State has developed a synthesis process to produce a “rust-resistant” coating with additional properties ideal for creating faster, more durable electronics.
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There’s two sides to this semiconductor, and many simultaneous functions
Published: October 17, 2024
Cornell University researchers, Ithaca, N.Y., in collaboration with a team at the Polish Academy of Sciences, have developed the first dual-sided – or “dualtronic” – chip that combines photonic and electronic functions simultaneously, an innovation that could shrink the size of functional devices, make them more energy efficient and reduce manufacturing costs.
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Ordered defects may be key for solution-deposited semiconductors
Published: October 17, 2024
Researchers at the University of Illinois Urbana-Champaign discovered that ordered defect pairs in solution-deposited semiconductors lead to record-high transistor performance, challenging conventional wisdom in semiconductor manufacturing.
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$5 million awarded to small businesses to bring new CHIPS metrology technologies to the commercial market
Published: September 20, 2024
Nearly $5 million has been awarded to 17 small businesses across nine states under the Small Business Innovation Research Program to fund projects exploring innovative metrology, measurement services, tools, and instrumentation, marking the first award for the CHIPS Research and Development Office in support of the U.S. semiconductor ecosystem.
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Bruker introduces next generation benchtop stylus profilometer
Published: September 19, 2024
Bruker Corporation, Billerica, Mass., released the Dektak Pro stylus profilometer, the next-generation profiler in the industry-leading Dektak product line, expanding measurement area and accuracy for critical analyses.
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Scientists uncover detailed structure of the aluminum oxide surface
Published: September 19, 2024
Researchers from TU Wien, Austria, and the University of Vienna have recently unraveled the complex structure of the Al2O3 surface, a puzzle that had eluded precise determination for over half a century.
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Newly discovered role of phase separation: a game changer for AI memory tech
Published: September 19, 2024
Researchers on a team led by University of Michigan unveiled that phase separation, alongside oxygen diffusion, crucially supports the long-term retention of information in memristors, specifically in resistive random access memory.
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A quantum leap for motion sensing
Published: September 19, 2024
For the first time, researchers at Sandia National Laboratories, Albuquerque, N. M., have used silicon photonic microchip components to perform a quantum sensing technique called atom interferometry, an ultra-precise way of measuring acceleration and the latest milestone toward developing a kind of quantum compass for navigation when GPS signals are unavailable.
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New chip may lead to AI computing at light speed
Published: September 19, 2024
Engineers at the University of Pennsylvania, Philadelphia, developed a new chip that uses light waves rather than electricity to perform the complex math essential to training AI.
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Amkor signs preliminary memorandum of terms with US Department of Commerce for Arizona Advanced Packaging and Test Facility
Published: August 15, 2024
Amkor Technology Inc., Tempe, Ariz., signed a preliminary agreement with the U.S. Department of Commerce for up to $400 million in funding under the CHIPS and Science Act to create a new $2 billion semiconductor packaging facility in Peoria, Arizona, the largest outsourced advanced packaging and test facility in the United States, generating approximately 2,000 jobs.
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