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1458 items found
NIST hosts first app challenge to improve data access
Published: July 30, 2015
Researchers looking for information on the properties of methane at high temperatures or the isotopic composition of an element know they can rely on standard reference data from NIST.
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3D white graphene could keep electronics cool
Published: July 22, 2015
3D structures of boron nitride might be the right stuff to keep small electronics cool.
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Jeol FE SEM features super hybrid lens design for high resolution imaging
Published: July 10, 2015
Jeol USA, Peabody, Mass., introduces the 7000 series of Field Emission Scanning Electron Microscopes with ultrahigh resolution and low-kV/low-vacuum operation for imaging and nano-analysis of structures, surface details, and magnetic samples.
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Cadence and Applied Materials collaborate to optimize planarization process
Published: July 09, 2015
Cadence Design Systems Inc., San Jose, Calif., and Applied Materials Inc., Santa Clara, Calif., are collaborating on a development program to optimize the chemical-mechanical planarization (CMP) process through silicon characterization and modeling for advanced-node designs at 14 nm and below.
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Oxford Instruments launches EBSD detector with speed of 1580 points per second
Published: July 09, 2015
Oxford Instruments, U.K., has launched NordlysMax3, an EBSD detector that acquires indexes and displays results at 1580 points per second.
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National Instruments Semiconductor Test Systems feature PXI modular instrumentation
Published: July 09, 2015
National Instruments, Austin, Texas, introduces its Semiconductor Test Systems (STS), which feature PXI modular instrumentation and open system design software for semiconductor test environments.
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Micro-reactor produces silver nanoparticles at room temperature for printed circuits
Published: July 09, 2015
Engineers at Oregon State University, Corvallis, report that they have invented a way to fabricate silver nanoparticles that are produced at room temperature for printed electronics.
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SPP Technologies to acquire Orbotech’s SPTS Technologies Thermal Products business
Published: July 09, 2015
Orbotech Ltd., Israel, announces that SPTS Technologies Group (SPTS), U.K., an Orbotech company and supplier of advanced wafer processing solutions, has sold its Thermal Products business to SPP Technologies Co. (SPT), a subsidiary of Sumitomo Precision Products Co.
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Nordson March plasma treatment systems designed for packaging applications
Published: July 09, 2015
Nordson March, Concord, Calif., announces its new Sphere Series plasma treatment systems for wafer-level and 3D packaging applications.
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Photo-doping of semiconductor enables formation of new material phases
Published: July 09, 2015
Researchers at Michigan State University, East Lansing, report that by shooting an ultrafast laser pulse into a semiconductor, its properties change as if it had been chemically doped.
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