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1458 items found
Dense yttrium oxide coats electronic devices via suspension plasma spray
Published: July 09, 2015
Progressive Surface, Grand Rapids, Mich., recently installed three 100HE plasma spray systems in a semiconductor manufacturing facility.
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Picosun ALD technology enables uniform gold films on silicon wafers
Published: July 09, 2015
Picosun Oy, Finland, and Carleton University, Ottawa, have collaborated to develop a process in which atomic layer deposition (ALD) technology deposits thin uniform gold films on complete silicon wafers.
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Ultra 76 Plus tantalum alloy resists corrosion in hot concentrated acids
Published: July 08, 2015
H.C. Starck, Newton, Mass., introduces the Ultra 76 Plus tantalum alloy, which is designed to combat aggressive hazardous-chemical corrosion in hot concentrated acids.
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SEMI reports fabs are expected to grow spending
Published: June 22, 2015
SEMI, San Jose, Calif., has published its May update to the World Fab Forecast, reporting on more than 200 facilities with equipment spending in 2015, and more than 175 facilities projected to spend in 2016.
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New process enables quick separation of neodymium and dysprosium
Published: June 20, 2015
Researchers at the University of Pennsylvania, Philadelphia, have reportedly developed a process that could enable the efficient recycling of two rare earth metals, neodymium and dysprosium.
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Calibre PERC platform chosen for reliability verification by Intel Custom Foundry
Published: June 19, 2015
Mentor Graphics Corp., Wilsonville, Ore., announces that Intel Custom Foundry is expanding its 14nm platform offering to include reliability verification based on the Calibre PERC platform for its customers.
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New hybrid techniques for backside thinning and polishing improve device uniformity
Published: June 19, 2015
Ultra Tec Manufacturing, Santa Ana, Calif., has developed new hybrid 3D backside thinning and polishing techniques for the achievement of extremely uniform remaining silicon thickness.
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Bruker microscope integrates imaging with 3D optical metrology
Published: June 19, 2015
Bruker Corp., Billerica, Mass., has released its new Contour Elite 3D Optical Microscopes, which for the first time fully integrate high-definition microscopy imaging with industry-leading three-dimensional optical metrology functionality.
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DualBeam PFIB enables failure analysis on semiconductors smaller than 20 nm
Published: June 19, 2015
FEI, Hillsboro, Ore., introduces the DualBeam plasma-focused ion beam (PFIB) for sample preparation, electrical fault isolation, and electrical failure analysis on sub-20nm semiconductor devices.
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DCG Systems acquires MultiProbe for its atomic force probe technology
Published: June 19, 2015
DCG Systems, Fremont, Calif., has acquired the assets of MultiProbe, the leading provider of atomic force-based nanoprobe solutions for the semiconductor industry.
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