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1458 items found
Graphene coated copper wire could boost chip speeds by up to 30%
Published: June 19, 2015
Researchers from Stanford University, Stanford, Calif., report that they have developed graphene sheathing material for the copper wires in computer chips.
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Transparent stretchable conductors based on nano-accordion structure
Published: June 19, 2015
Researchers from North Carolina State University, Raleigh, report that they have fabricated stretchable transparent conductors that work because of their "nano-accordion" design.
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Flexible polymer electrodes printed with improved electrical properties
Published: June 19, 2015
The Technical University of Munich (TUM) announces that its researchers have printed razor-thin polymer electrodes with improved electrical properties.
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Conferences convene for successful Mega Show event
Published: May 28, 2015
Aerospace and thermal spray professionals gathered for aerospace coating and materials information.
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Winners of Materials Genome Toolkit competition announced
Published: May 27, 2015
ASM International's CMD Network is pleased to announce the winners of the 2015 ASM Materials Genome Toolkit competition.
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Helios NanoLab combines high-resolution SEM and FIB with precision deposition
Published: May 26, 2015
FEI Co., Hillsboro, Ore., offers the Helios NanoLab 460F1, which combines the highest resolution scanning electron microscope (Elstar+UC SEM) and focused ion beam (Tomahawk FIB) columns on the market today with the most advanced sample manipulation capabilities.
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Jeol e-beam lithography system to write high-resolution circuitry patterns for nanofab
Published: May 26, 2015
Jeol USA, Peabody, Mass., announces that a state-of-the-art Jeol e-beam lithography system will soon be installed at the University of Waterloo Quantum NanoFab in Waterloo, Ontario.
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High-vacuum SSRM AFM system designed for semiconductor failure analysis
Published: May 26, 2015
Park Systems, Santa Clara, Calif., introduces the NX-Hivac AFM system for semiconductor failure analysis.
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Silver sinter paste for power semiconductors has strong adhesion to copper
Published: May 26, 2015
Kyocera America Inc., San Diego, announces the U.S. introduction of its XT2773R7 Silver Sinter Paste, a proprietary formulation specifically developed to deliver higher performance than high-lead solders.
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Titanium nitride hardmask system enables patterning copper interconnects at 10 nm
Published: May 25, 2015
Applied Materials Inc., Santa Clara, Calif., introduces the Applied Endura Cirrus HTX PVD titanium nitride hardmask system with advanced technology for patterning copper interconnects at 10 nm and beyond.
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