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1458 items found
TSMC certifies Mentor Graphics tools for TSMC 10nm FinFET Technology
Published: April 20, 2015
Mentor Graphics Corp., Wilsonville, Ore., announces that TSMC and Mentor Graphics have reached the first milestone of their collaboration on 10nm EDA certification.
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Multi-sensor microscope optical head enables multiple FA techniques
Published: April 20, 2015
Quantum Focus Instrument Corp., Vista, Calif., introduces QuantumScope, a multi-sensor microscope optical head in which mid-wavelength infrared hot-spot detection, photoemission, and laser signal injection microscopy techniques are integrated into the same optical inspection platform.
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Eutectic gallium-indium nanoparticles developed for inkjet printing of electronic circuits
Published: April 20, 2015
Purdue University, West Lafayette, Ind., reports that researchers have developed eutectic gallium-indium nanoparticles coated with Ga2O3 or thiol and suspended in ethanol for inkjet printing of electronic circuits.
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Flir Systems launches three science-grade cooled thermal cameras
Published: April 19, 2015
Flir Systems, Freeport, Pa., has launched three science-grade thermal cameras: the A6200sc NIR, A8300sc HD MWIR, and A6700sc LWIR. Designed for applications such as electronics development, these cooled cameras deliver high image quality, standardized interfaces, and Matlab integration. The image shows a photo of a cooled InSb pcb from the A6700sc.
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Sandia, Purdue University establish strategic alliance to speed adoption of technology
Published: April 19, 2015
Sandia National Laboratories, Albuquerque, N.M., and Purdue University, West Lafayette, Ind., have signed an extensive, five-year memorandum of understanding (MOU) to establish a strategic alliance that seeks to solve large national problems, sustain and engage human capital, and accelerate adoption of technology.
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Fifty years of Moore’s Law results in 1.3 transistors on a single integrated circuit
Published: April 19, 2015
Semi, San Jose, Calif., reports that April 2015 marks the 50th anniversary of Moore's Law.
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Duke researchers develop probes for bond testing of 3D integrated circuits
Published: April 19, 2015
Duke University, Durham, N.C., announces that its researchers have introduced probing solutions that may enable pre-bond and post-bond testing of through-silicon vias and logic dies used in manufacturing semiconductor components.
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Thin porous copper sheets transfer five times more heat from electronic devices
Published: April 19, 2015
Fujitsu Laboratories, Japan, has reportedly developed the world's first thin heat pipe designed for small electronic devices.
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Head of Mars Curiosity Rover Mission to speak at ASM’s Megashow
Published: March 26, 2015
SM International, Materials Park, Ohio, announced that Dr. John Grotzinger, chief scientist and head of strategic science planning for NASA's $2.5 billion Curiosity rover mission to Mars, was selected as the plenary speaker for their co-located show which takes place on May 11-14.
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Cypress and Spansion complete $5 billion merger
Published: March 19, 2015
Cypress Semiconductor Corp., San Jose, Calif., and Spansion Inc., Sunnyvale, Calif., have closed the merger of the two companies in an all-stock, tax-free transaction valued at approximately $5 billion.
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