SEMI forecasts strong fab equipment spending in 2015

Published: March 18, 2015

SEMI, San Jose, Calif., has updated its SEMI World Fab Forecast outlooks for 2015 and 2016.

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Jeol’s fourth-gen AccuTOF-GCx offers higher resolution, accuracy, and sensitivity

Published: March 18, 2015

Jeol USA, Peabody, Mass., introduces the AccuTOF-GCx, the fourth generation of Jeol's successful gas chromatography/time-of-flight mass spectrometer systems.

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Craic adds circular polarization spectroscopy capabilities to its microspectrophotometers

Published: March 18, 2015

Craic Technologies, San Dimas, Calif., has added circular polarization spectroscopy capabilities to its microspectrophotometers.

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Bruker M2 Blizzard XRF is designed for NDT of printed circuit boards

Published: March 18, 2015

Bruker AXS Inc., Madison, Wis., introduces the M2 Blizzard, a small-spot X-ray fluorescence spectrometer specifically designed for the nondestructive analysis of printed circuit boards.

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Laser-based illumination module offers up to four times tilt alignment accuracy

Published: March 16, 2015

Ultra Tec Mfg. Inc., Santa Ana, Calif., introduces its Ultracollimator module for the Ultrapol Advance Precision lapping and polishing machine.

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Applied Materials and Tokyo Electron unveil new company name

Published: March 14, 2015

Applied Materials Inc., Santa Clara, Calif., and Tokyo Electron Ltd., announce that the name of their combined company is Eteris (ETERnal Innovation for Society).

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System-on-a-chip design reduces failure rate by a factor of nine

Published: March 14, 2015

Chalmers University of Technology, Sweden, announces that the European Union's DeSyRe project has resulted in a system-on-a-chip (SOC) that uses 48% less chip area and has a nine times lower failure rate.

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Off-axis silicon carbide substrate layering builds better semiconductors

Published: March 14, 2015

Kansas State University, Manhattan, reports that its researchers have developed a better way to build semiconductors and layer them to minimize potential defects.

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Applied Materials VeritySEM 5i 3D metrology system enables 6 nm measurement

Published: March 14, 2015

Applied Materials, Santa Clara, Calif., introduces the new VeritySEM 5i 3D metrology system, which provides imaging innovations in advanced e-beam technology and image processing.

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Three-year U.S.-Ireland R&D initiative to develop advanced semiconductor materials

Published: March 13, 2015

Tyndall National institute, Ireland, reports that a three-year U.S.-Ireland collaborative scientific project aims to reduce power consumption and increase battery life in mobile devices.

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