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1458 items found
Indium SACm solder paste increases device drop-shock resistance by 800%
Published: May 19, 2014
Indium Corp., Utica, N.Y., has developed SACm, a high-reliability solder paste that increases the drop-shock performance in portable electronics by 800%, without compromising on thermal cycling.
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Applied Materials tool encapsulates copper interconnects in cobalt films
Published: May 19, 2014
Applied Materials Inc., has developed its Applied Endura Volta CVD Cobalt system, the only tool capable of encapsulating copper interconnects in logic chips beyond the 28nm node by depositing precise, thin cobalt films.
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Georgia Tech PRC and Finetech demonstrate copper Interconnects without solder
Published: May 19, 2014
Finetech, Gilbert, Ariz., has been selected by the Georgia Tech Packaging Research Center (PRC), Atlanta, to provide its semi-automatic Matrix bonder to demonstrate the first manufacturable, low-temperature, ultra-fine-pitch copper interconnect and assembly technology.
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Sematech achieves zero defects per mask at 100 nm sensitivity in deposited EUV multilayers
Published: May 19, 2014
Sematech, Albany, N.Y., announces that its researchers have reached a significant milestone in reducing to zero the defects generated by tools from the multi-layer deposition of mask blanks for extreme ultraviolet lithography.
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Wafer probe system measures device electrical functioning over wide temperature range
Published: May 19, 2014
Cascade Microtech Inc., Beaverton, Ore., has developed the CM300 Probe System, which automates on-wafer device measurements and enhances device and process characterization and modeling by capturing the true electrical performance of devices, thus enabling hands-off productivity.
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Bruker’s Vertex FTIR spectrometer covers complete mid and far infrared/THz ranges in one step
Published: May 19, 2014
Bruker Corp., Madison, Wis., announces the world's first FTIR spectrometer that covers the complete mid and far Infrared/THz spectral ranges in one step with no gaps.
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Coater/Developer system designed for fan-out wafer-level packaging
Published: May 19, 2014
Suss MicroTec, Germany, recently introduced a coater/developer tool especially developed to process wafers for fan-out wafer-level packaging applications.
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DCG nProber II system can isolate electrical faults to the sub-transistor level
Published: April 23, 2014
DCG Systems, Fremont, Calif., announces that three of its nProber II nanoprobing systems have been purchased by a major IC manufacturer who is developing technology beyond the 14nm node.
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Oxford Asylum’s MFP-3D Infinity AFM reduces XY sensor noise by 70%, Z-sensor noise by 85%
Published: April 21, 2014
Oxford Instruments Asylum Research, Goleta, Calif., announces the new MFP-3D Infinity Atomic Force Microscope (AFM).
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Global Foundries and Samsung form joint program for 14nm FinFETs
Published: April 21, 2014
Global Foundries, Austin, Texas, and Samsung, Japan, announce a joint program for fabless companies to skip the 20nm node and move straight to 14nm FinFETs.
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