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1458 items found
Materion to partner with AristoCast for AlBeCast investment castings
Published: April 21, 2014
Materion Brush Beryllium & Composites, a Materion Corporation business, Elmore, Ohio, announces that it has qualified and entered into a strategic manufacturing and marketing partnership with Aristo Cast Inc.
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Silver-filled adhesive film enables high-temperature operation
Published: April 21, 2014
The Advanced Circuit Materials Division of Rogers Corp., Rogers, Conn., launches Coolspan thermally and electrically conductive adhesive (TECA) film.
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Altera and Intel to collaborate on multi-die devices
Published: April 21, 2014
Altera Corp., San Jose, Calif., and Intel Corp., Santa Barbara, Calif., announce their collaboration on the development of multi-die devices that leverage Intel's world-class package and assembly capabilities and Altera's leading-edge programmable logic technology.
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Erbium-antimony nanostructures manipulate light in the infrared range
Published: April 21, 2014
Researchers at the University of California at Santa Barbara have developed an erbium-antimony semiconductor of nearly perfect quality that can manipulate light energy in the mid-infrared range.
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Scalable CVD process enables one atom-thick layers of molybdenum diselenide semiconductor
Published: April 21, 2014
Researchers at Rice University in Houston and Nanyang Technological University in Singapore have developed a potentially scalable CVD method for making one-atom-thick layers of molybdenum diselenide.
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Bruker introduces online XRF coating analyzer
Published: April 21, 2014
Bruker Corp., Santa Barbara, Calif., presents an online coating analyzer, the S2 Kodiak, which is based on X-ray fluorescence spectrometry.
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FEI Helios NanloLab 600i enables ultrathin samples for TEM
Published: April 21, 2014
FEI Corp., Hillsboro, Oregon, has developed the Helios NanoLab 600i, which offers advances in the ion beam, electron beam, patterning, and a range of other for advanced nanoscale materials research.
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Lockheed Martin opens materials and thermal sciences R&D lab in Palo Alto
Published: March 26, 2014
The Lockheed Martin Space Systems Advanced Technology Center, Palo Alto, has opened an Advanced Materials & Thermal Sciences Center for research and development.
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High-resolution array ICP-OES enables flexibility and high-precision measurement of trace elements
Published: March 24, 2014
Analytik Jena AG, Germany, introduces the PlasmaQuant PQ 9000, its first High-Resolution Array ICP OES (optical emission spectrometry using inductively coupled plasma) for multiple element analysis.
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Ultrasonic phased array produces high-resolution 3D images
Published: March 24, 2014
Researchers at the Fraunhofer Institute for Nondestructive Testing IZFP, Germany, have developed an ultrasonic phased-array instrument that enables them to produce high-resolution 3D images.
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