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1458 items found
TSMC, Bosch, Infineon, and NXP establish joint venture to bring advanced semiconductor manufacturing to Europe
Published: August 18, 2023
TSMC, Robert Bosch GmbH, Infineon Technologies AG, and NXP Semiconductors N.V. announced a plan to jointly invest in European Semiconductor Manufacturing Company GmbH, in Dresden, Germany to construct a fab there and provide advanced semiconductor manufacturing services.
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ASU engineering team works to advance solid-state battery technology
Published: August 18, 2023
Candace Chan, an associate professor of materials science and engineering in the Ira A. Fulton Schools of Engineering at Arizona State University, Tempe, Ariz., is working on two projects to help alleviate problems in applications that use lithium-ion batteries, such as electric vehicles.
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Flaky compound to prevent computer chips from getting fried
Published: August 18, 2023
A research team from Skoltech, Russia, has improved the properties of a polymer used in 3D printing by adding boron nitride “flakes” to the photopolymer, doubling the material's thermal conductivity.
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Oxford Instruments Asylum Research releases Cypher ES Atomic Force Microscope package for battery research
Published: August 11, 2023
Oxford Instruments Asylum Research released its new atomic force microscope package developed for battery research, the Cypher ES Battery Edition.
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Thermo Fisher Scientific’s new-generation fully automated (S)TEM metrology solution for high volume semiconductor manufacturing
Published: July 21, 2023
Thermo Fisher Scientific, Hillsboro, Ore., introduced the Thermo Scientific Metrios 6 Scanning Transmission Electron Microscope ((S)TEM) — a new-generation, fully automated (S)TEM metrology solution to help enhance productivity and deliver data quality assurance for high-volume semiconductor manufacturing.
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Researchers develop approach that can enable inexpensive mass manufacturing of micro-LED displays
Published: July 20, 2023
Researchers at the University of Strathclyde, Scotland, demonstrated a continuous roller printing process that can pick up and transfer over 75,000 micrometer-scale semiconductor devices in a single roll with very high accuracy, paving the way to creating large-scale arrays of optical components that could be used to rapidly manufacture micro-LED displays.
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Arizona State University and Applied Materials to create ‘materials-to-fab’ center
Published: July 20, 2023
Arizona State University, Tempe, AZ, and Applied Materials, Inc., Santa Clara, CA, announced an alliance, aided by the Arizona Commerce Authority, that brings more than $270 million to create a world-class shared research, development and prototyping facility, the Materials-to-Fab Center, in the university's MacroTechnology Works building at ASU Research Park.
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Spirit Electronics to provide device analysis with acquisition of Insight Analytical Labs
Published: July 20, 2023
Spirit Electronics, Phoenix, AZ, acquired Insight Analytical Labs, Colorado Springs, CO, to add device analysis services including destructive physical analysis, to its existing full-turnkey semiconductor supply chain services.
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New approach reduces EV battery testing time by 75%
Published: July 20, 2023
Testing the longevity of new electric vehicle battery designs could be four times faster with a streamlined approach, researchers at the University of Michigan have shown.
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New material shows promise for next-generation memory technology
Published: July 20, 2023
Researchers from Tohoku University, Japan, used sputtering to fabricate large-area 2D vdW tetra-chalcogenides and identified an exceptionally promising material ー niobium telluride ーthat exhibits an ultra-low melting point, opening up new possibilities for developing high-performance phase change memories.
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