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1458 items found
Imec first to demonstrate conductor films on 300 mm wafers with lower resistivity than Cu and Ru
Published: June 16, 2023
Imec, Belgium, a world-leading research and innovation hub in nanoelectronics and digital technologies, provided the first experimental evidence that the resistivity of a thin conductor film on a 300mm Si wafer can be lower than that of Cu and Ru, which are currently used in interconnect metallization schemes, marking a milestone towards enabling low-resistive interconnect with line widths below 10nm.
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New invention for more efficient atomic force microscopes
Published: June 16, 2023
Researchers at Vienna University of Technology, Austria, developed an atomic force microscope sensor element of with a customized electronic circuit built directly into the tip whose signal directly provides information about the state of the tip, producing a more compact, simpler to process, cheaper technology with precision just as good as with previous devices.
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RoodMicrotec and SGA enter into cooperation for ASIC testing
Published: June 16, 2023
RoodMicrotec, Netherlands, a leading independent company for semiconductors supply and quality services, and Svenska Grindmatriser AB, Sweden, a well-established fabless IDM for the development and supply of customized mixed-signal ASICs, started a cooperation for high-volume production testing of SGA’s ASIC products.
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Stanford University sends semiconductor investigation to the International Space Station
Published: June 16, 2023
Researchers from Stanford University, Palo Alto, Calif., sent an investigation to the space station to leverage microgravity to improve the synthesis of materials for photovoltaic devices designed to convert sunlight into electricity for solar energy applications.
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With PowerVia, Intel achieves a chipmaking breakthrough
Published: June 15, 2023
Intel Corporation, Santa Clara, Calif., devised a process to manufacture, test, and demonstrate positive performance results with its new backside power solution called PowerVia, enabling chipmaking to go two-sided for the first time.
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AI-based rare event detection harnesses the capabilities of autonomous confocal microscopy
Published: June 15, 2023
Leica Microsystems, Germany, a leader in microscopy and scientific instrumentation, has launched Autonomous Microscopy powered by Aivia, a new AI-based detection workflow for confocal microscopy that automates the detection of rare events by extracting the most relevant data from their experiments.
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Researchers use nanoparticles to increase light frequency and resolution of imaging systems
Published: May 18, 2023
Physicists at the Australian National University are using nanoparticles to develop new sources of light that increase the frequency of light that cameras and other technologies see by up to seven times.
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New surface coating technology increases materials’ electron emission seven-fold
Published: May 18, 2023
An international research group with researchers from China, Japan, and the Los Alamos National Laboratory, Los Alamos, NM, developed a new surface coating technology that is capable of significantly increasing electron emission in materials.
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Rigaku opens its first semiconductor metrology technology center in Silicon Valley
Published: May 17, 2023
Rigaku, Japan, leading provider of X-ray metrology solutions for semiconductor in-line processes, research and development, and high-volume manufacturing, has opened its first Semiconductor Metrology Technology Center in Sunnyvale, CA.
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USI develops advanced failure analysis technology to meet high-level demands of SiP miniaturization products
Published: May 17, 2023
Universal Scientific Industrial (Shanghai) Co., Ltd., China, developed an advanced electronic component failure analysis technology to meet the increasingly complex and diverse needs of system-in-package miniaturized products.
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