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1458 items found
Jeol compact Field Emission SEM offers ultrahigh resolution, analytical versatility
Published: August 20, 2020
Jeol, Peabody, Mass., introduces a compact, versatile Field Emission SEM that offers ultrahigh resolution and versatile analytical capabilities at a great value.
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Oxford Instruments Plasma Tech to further develop materials for quantum-based electronics
Published: August 20, 2020
Oxford Instruments Plasma Technology, Concord, Mass., has joined the Quantum Foundry at the University of California Santa Barbara to further develop quantum technology materials.
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SEMI and GlobalFoundries partner to create apprentice program for technicians
Published: August 19, 2020
SEMI, Milpitas, Calif., has launched a new collaborative apprenticeship program in partnership with GlobalFoundries to make it easier for companies to offer training, and for more workers to pursue careers in electronics.
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SIA reports June global semiconductor sales show 5.1 percent growth vs. June 2019
Published: August 19, 2020
The Semiconductor Industry Association (SIA), Washington, reports that worldwide sales of semiconductors were $34.5 billion in June 2020, an increase of 5.1 percent from the June 2019 total of $32.9 billion.
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Rigaku tube-below WDXRF spectrometer provides smaller footprint, improved efficiency
Published: August 18, 2020
Rigaku, Tokyo, introduces the ZSX Primus IVi tube-below sequential wavelength dispersive X-ray fluorescence spectrometer, which is designed for X-ray analysis of liquids, alloys, and plated metals.
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Velo3D and Lam agree to jointly develop new AM alloys and parts for semiconductor industry
Published: August 17, 2020
Velo3D, Campbell, Calif., and Lam Research Corp., Fremont, Calif., announce that they will collaborate on novel materials and designs for metal additive manufacturing of applications in the semiconductor industry, as part of a joint development agreement.
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Picosun ALD-organic-bilayer encapsulation of implants prevents corrosive ion diffusion
Published: August 10, 2020
Picosun Group, Finland, reports excellent results in ALD-organic bilayer encapsulation of metal electrodes for neuroprosthetics and bioelectronic medicine.
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Lindberg MPH mesh-belt conveyor furnace designed for microelectronics processing
Published: August 04, 2020
Lindberg MPH, Riverside, Mich., has shipped an electric mesh-belt conveyor furnace with a nitrogen/hydrogen blend atmosphere to a microelectronics manufacturer in the United States.
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Advantest IC memory tester integrates burn-in, core testing for 5G product development
Published: July 19, 2020
Advantest Corp., Tokyo, has added to its H5600 family of memory testers by introducing the new, highly versatile H5620ES engineering test system, designed for both high-speed burn-in and core testing of today's DDR4, next-generation DDR5, and low-power, double-data-rate (LPDDR) devices in laboratory environments.
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Fischione designs techniques to prepare specimens of semiconductor solder joints
Published: July 19, 2020
Engineers from Fischione Instruments, Export, Pa., described and compared different sample preparation techniques for solder joints in a presentation from the ASM International ISTFA 2019 conference in Portland, Oregon.
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