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1458 items found
The “soft side” of chips: NIST advances polymer science for semiconductor packaging
Published: September 18, 2025
A new perspective article from NIST and collaborators highlights a critical but often underrated piece of the semiconductor revolution: the “soft” polymer-based packaging materials that hold advanced chips together that are emerging as important factors for reliability, performance, and cost.
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Exosens expands technology portfolio
Published: September 18, 2025
Exosens, France, extends its technology portfolio by signing an agreement to acquire Phasics, France, leader in high performance cameras based solutions for optical metrology.
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World’s first hybrid chip combines electronics, photonics, and quantum power
Published: August 22, 2025
Researchers from Boston University, UC Berkeley, and Northwestern University have developed the first chip that integrates electronic, photonic, and quantum components, fabricated using a standard 45-nanometer semiconductor process.
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Texas Tech to earn $14M for advanced semiconductor power devices program
Published: August 22, 2025
Texas Tech University’s Edward E. Whitacre Jr. College of Engineering, Lubbock, Texas, will earn $14 million from the U.S. Department of Defense Army Research Laboratory for an Advanced Semiconductor Power Devices Program that will develop reliable, high-performance and power electronic devices with wide and ultrawide bandgap semiconductors.
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High-resolution 3D x-ray inspection for advanced packaging: insights from HBM micro-bump analysis
Published: August 22, 2025
Dragonfly, a brand of Comet Group, Switzerland, applied high-resolution 3D X-ray imaging to inspect 20 µm micro-bumps in HBM stacks, where sub-micron voids and cracks can critically affect performance and yield.
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Gatan launches the EDAX Orbis II Micro-XRF system
Published: August 22, 2025
Gatan, Inc., Pleasanton, Calif., launched the EDAX Orbis II System, designed to support a wide range of non-destructive elemental analysis that use micro x-ray fluorescence.
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Counterfeit electronics reports reach nine-year high amid expanding target base
Published: August 22, 2025
A sharp uptick in reported counterfeit and nonconforming electronic components in 2024 has underscored a widening threat to component authenticity, according to the latest ERAI Annual Report.
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Unlocking SPAD technology for advanced imaging applications in microscopy and beyond
Published: August 22, 2025
Carl Zeiss Microscopy GmbH, Germany, has acquired all equity shares of the Swiss company Pi Imaging Technology SA, developer of single-photon avalanche diode arrays and image sensors.
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Binghamton electronics research center gets $1M annual boost from N.Y.
Published: July 17, 2025
The Integrated Electronics Engineering Center at Binghamton University research that partners with industry to advance electronics manufacturing has been re-designated by New York state as a Center for Advanced Technology, receiving $1 million in annual funding for the next decade.
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Siemens turbocharges semiconductor and PCB design portfolio with generative and agentic AI
Published: July 17, 2025
Siemens, Germany, is equipping its EDA tools with secure, advanced generative and agentic AI—including integration with NVIDIA NIM microservices and Nemotron models—to boost productivity, accelerate chip and PCB design innovation, and transform development workflows from concept to verification.
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