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1458 items found
‘Soft-touch’ approach advances nondestructive testing for micro-LED wafers
Published: July 17, 2025
Scientists at Tianjin University, China, have developed a pioneering nondestructive testing technology for micro-LED wafers, offering a much-needed solution to a long-standing industry challenge through a novel “soft-touch” approach.
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SkyWater completes acquisition of Fab 25, expanding U.S. pure-play foundry capacity for critical semiconductor technologies
Published: July 17, 2025
SkyWater Technology, Blooington, Minn., completed its acquisition of Infineon Technologies AG’s 200 mm semiconductor fab in Austin, Texas (“Fab 25”), adding approximately 400,000 wafer starts per year in foundry capacity, to enhance its advanced technology services.
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Researchers outline innovative ways to track heat in advanced semiconductors
Published: July 17, 2025
Researchers from UConn and the U.S. Naval Research Laboratory have outlined new ways to accurately track and manage heat in ultrawide bandgap semiconductors, a challenge that has become increasingly important as these materials drive the future of high-performance electronics.
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Data transfer speeds increase significantly through new optical chip design
Published: July 17, 2025
A team from the Center for Optics, Photonics and Lasers at Laval University, Quebec, Canada, has come up with an optical chip that can transfer massive amounts of data at ultra-high speed, offering unrivaled energy efficiency.
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Applied Materials and CEA-Leti expand joint lab to drive innovation in specialty chips
Published: June 19, 2025
Applied Materials, Inc., Santa Clara, Calif., and CEA-Leti, France, announced the next phase of their longstanding collaboration to accelerate innovation in specialty semiconductors, expanding their joint lab and developing materials engineering solutions to address emerging infrastructure challenges in AI data centers.
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Instron launches new AVE3 Advanced Video Extensometer
Published: June 19, 2025
Instron, Norwood, Mass., released the AVE3, an advanced non-contacting video extensometer that delivers precise strain measurement with unparalleled, micron-level accuracy for tensile, compression, and bend testing.
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TESCAN expands its presence in Asia
Published: June 19, 2025
Czech-based electron microscope manufacturer TESCAN plans to establish a local subsidiary in Taiwan in 2025 to meet rising demand from semiconductor clients across the Asia-Pacific region. Founded in Brno, the Czech Republic’s second-largest city, TESCAN built its reputation over three decades in fields like materials science and geoscience. In recent years, however, the company has... View Article
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Nine innovation projects in materials science for sustainability receive proof-of-concept Grants
Published: June 19, 2025
Knut and Alice Wallenberg Foundation and the WISE research program, Sweden, have launched a Proof-of-Concept Grant program with the purpose to bridge the gap from academic research to innovations in materials science for sustainability.
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Mechanical engineering student brings fresh perspective to National Renewable Energy Laboratory
Published: June 19, 2025
University of Cincinnati co-op student Addie Salvador is quietly reshaping the future of materials science, bringing autonomy to a transmission electron microscope in the cutting-edge laboratories of the National Renewable Energy Laboratory in Golden, Colorado.
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Seeing inside next-generation microelectronics using X-rays
Published: June 19, 2025
Scientists at the U.S. Department of Energy found two competing mechanisms that contribute to the deformation of nanosheet materials used in cutting-edge computer components.
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