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1458 items found
Oxford Instruments partners with Direct Electron for its TEM direct detection cameras
Published: April 17, 2020
Oxford Instruments plc, England, announces that its NanoAnalysis division has recently partnered with U.S.-based Direct Electron, which produces next-generation direct detection cameras for transmission electron microscopes
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Bruker HighSense enables EDXRF spectrometers to detect elements in ppm concentrations
Published: April 17, 2020
Bruker, Billerica, Mass., introduces the S2 PUMA Series 2 spectrometer with HighSense Technology, the high-end Energy-Dispersive X-ray Fluorescence (EDXRF) spectrometer for elemental analysis.
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Thermo Fisher Scientific diagnostic test for COVID-19 receives emergency approval
Published: April 03, 2020
Thermo Fisher Scientific Inc., Waltham, Mass., announces that on March 13 the U.S. Food and Drug Administration issued an emergency use authorization (EUA) for its diagnostic test that can be used immediately by CLIA high-complexity laboratories in the United States to detect nucleic acid from SARS-CoV-2, the virus that causes COVID-19, and not for any other viruses or pathogens.
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Connect with ASM colleagues to share resources, post events, discuss ideas and issues
Published: March 27, 2020
ASM CONNECT launched for all ASM members on January 15; since then, over 100 posts/replies have been discussed.
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Samsung begins production at its fabrication line for EUV lithography semiconductor chips
Published: March 18, 2020
Samsung Electronics, Korea, announces that mass production has begun at its new cutting-edge semiconductor fabrication line in Hwaseong, Korea, to produce chips using a process node of 7 nanometers and below.
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Nikon Metrology develops x-ray techniques for chip testing and failure analysis
Published: March 18, 2020
Engineers from Nikon Metrology Inc. discussed x-ray technologies and techniques that can provide visualization and metrology analysis of semiconductor chips, at the ASM International ISTFA 2019 conference in Portland, Oregon.
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SEMI World Fab Forecast predicts modest growth in 2020, record investments in 2021
Published: March 18, 2020
SEMI, Milpitas, Calif., reports in its World Fab Forecast that global fab equipment spending promises to rebound from its 2019 downturn and see a modest recovery this year before a sharp uptick drives record investments in 2021.
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Park Systems and Imec join to increase nano-metrology solutions for semiconductors
Published: March 18, 2020
Park Systems, Santa Clara, Calif., and Imec, Belgium, have signed the second Joint Development Project (JDP) within four years to increase the development efforts for future generation in-line AFM metrology solutions.
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Multi-beam SEM enables imaging larger areas of semiconductor layers in less time
Published: March 18, 2020
Engineers from Carl Zeiss Microscopy, Germany, presented a discussion of multi-beam scanning electron microscopes as tools for imaging semiconductor layers in less time at the ASM International ISTFA 2019 conference in Portland, Oregon.
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Nondestructive method developed for short-fault localization in advanced IC packages
Published: March 18, 2020
Researchers from Advanced Micro Devices and TeraView Ltd. presented a discussion of an electro optical terahertz pulse reflectometry method for short fault localization in advanced IC packages at the ASM International ISTFA 2019 conference in Portland, Oregon.
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