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1458 items found
Picosun’s ALD technology enables 3D silicon-integrated microcapacitors
Published: January 18, 2020
Picosun Group, Espoo, Finland, reports record performance of silicon-integrated, three-dimensional deep trench microcapacitors manufactured by its ALD equipment, which deposited film stacks of conductive TiN and insulating dielectric Al2O3 and HfAlO3 layers into high aspect-ratio (up to 100) trenches etched into silicon.
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Witec wins innovation award for Particle Scout, a software tool for microparticle analysis
Published: January 18, 2020
Witec, Germany, announces that it has won The Analytical Scientist Innovation Award as one of the most inventive scientific products of 2019 for Particle Scout, a software tool that enables researchers to find, classify, quantify, and identify particles with unprecedented speed and ease of use.
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Semiconductor materials market to grow to nearly $50 billion in 2020 after 2019 downturn
Published: January 18, 2020
Techcet CA LLC, San Diego, predicts that global revenues for semiconductor manufacturing and packaging materials will grow 5.7% year-over-year in 2020 to $49.5B, of which 65% represents semiconductor fab materials.
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IBM and Hamamatsu develop prototype of a scanning time-resolved emission system
Published: January 18, 2020
Researchers from IBM and Hamamatsu presented a discussion at the ASM International ISTFA 2019 Conference about the first prototype of a Scanning Time-Resolved Emission system for detecting single photons.
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Imec measures optical-beam induced resistance change to localize pinhole breakdown sites
Published: January 14, 2020
Researchers from Imec and KU Leuven University, Belgium, reported on and demonstrated a new methodology for the localization of dielectric breakdown sites in through-silicon via structures at the ASM International ISTFA 2019 conference in Portland, Ore.
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Johns Hopkins scientists develop process for 3D printing gallium nitride semiconductors
Published: January 12, 2020
Researchers at the Johns Hopkins Applied Physics Laboratory (APL) in Laurel, Md., have demonstrated a novel and groundbreaking way to additively print gallium nitride based on a combination of liquid and gas.
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Leica Microsystems LIBS enables visual and chemical inspection in one step
Published: January 10, 2020
Leica Microsystems, Morrisville, N.C., offers an additional function to optical analysis for determination of cleanliness in materials: laser induced breakdown spectroscopy (LIBS), a chemical analysis tool based on laser technology.
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Allied High Tech Products develops sample preparation method for TEM analysis
Published: January 08, 2020
Materials engineer Pablo Mendoza of Allied High Tech Products Inc., Rancho Dominguez, Calif., presented an effective method of sample preparation for transmission electron microscopy at the ASM International MS&T 2019 Exposition in Portland, Ore.
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Bruker PeakForce Tapping atomic force microscope celebrates ten years of research
Published: December 17, 2019
Bruker, Billerica, Mass., announces the ten-year anniversary of PeakForce Tapping, its proprietary atomic force microscopy mode that has been widely adopted in materials and semiconductor research.
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Hitachi CD Measurement SEM enables EUV lithography production of 5nm devices
Published: December 17, 2019
Hitachi High-Technologies Corp., Tokyo, announces that it has developed an advanced CD Measurement SEM (CD-SEM), the CG7300, which provides enhanced high-precision measurement and improved throughput performance.
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