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1458 items found
IBM and Hamamatsu develop prototype of scanning time-resolved emission system
Published: February 22, 2020
Researchers from IBM Research and Hamamatsu Photonics discussed the first prototype of a scanning time-resolved emission (STRE) system at the ASM International ISTFA 2019 conference in Portland, Oregon.
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Chip Targets acquires first US MIP decapsulation tool for chip failure analysis
Published: February 22, 2020
Chip Targets, Richardson, Texas, announces that it has increased its range of failure analysis service capabilities to include an atmospheric microwave induced plasma (MIP) decapsulation instrument from Jiaco Instruments of Delft, the Netherlands.
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IC Insights report covers semiconductor wafer capacity of five major manufacturers
Published: February 21, 2020
IC Insights, Scottsdale, Ariz., recently released its “Global Wafer Capacity 2020-2024” report that features detailed profiles of the five companies with the greatest fab capacity, and includes a ranking of the 25 largest wafer-capacity leaders in terms of monthly installed capacity.
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Lock-In Thermography enables failure analysis of resistive opens and electrical shorts
Published: February 20, 2020
Researchers from Advanced Micro Devices, Thermo Fisher Scientific, and the Fraunhofer Institute for Microstructure of Materials and Systems IMWS, presented a discussion of “Lock-In Thermography” (LIT) at the ASM International ISTFA 2019 conference in Portland, Oregon.
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Argonne molecular layer etching tool enables precise control of thin film materials
Published: February 20, 2020
Researchers at the U.S. Department of Energy's Argonne National Laboratory, Chicago, have developed a new etching technique that could potentially help make small but complex semiconductors.
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Markforged releases pure copper for printing complex components on its Metal X 3D printer
Published: February 20, 2020
Markforged, Watertown, Mass., announces the release of pure copper for its Metal X 3D system, making it easy to consistently create complex parts with high electrical and thermal conductivity.
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Grupo Mess becomes exclusive Buehler distributor for metallographic and hardness equipment in Mexico
Published: January 22, 2020
Buehler, an ITW Company, Lake Bluff, Ill., announces a partnership with Grupo Mess, Queretaro City, Mexico, a leading Mexico supplier of scientific equipment and services specializing in metrology. The partnership provides local support to Buehler customers and other manufacturers for all their metallographic product and service needs.
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Women In Engineering Profile: Janet Gbur
Published: January 21, 2020
This profile series introduces leading materials scientists from around the world who happen to be females. Here we speak with Janet Gbur, research associate at Case Western Reserve University, Cleveland, investigator at the Louis Stokes VA Medical Center, Cleveland, and adjunct faculty at Youngstown State University, Youngstown, Ohio.
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Suss MicroTec and BRIDG join to enable semiconductor process and product innovations
Published: January 19, 2020
Suss MicroTec, Corona, Calif., and BRIDG, a public-private partnership in Kissimmee, Fla., have agreed to establish a production-level Applications Center in Kissimmee to enable process and product innovations for Suss customers and BRIDG partners.
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Global semiconductor sales decrease slightly month-to-month in November
Published: January 19, 2020
The Semiconductor Industry Association (SIA), Washington, announces that worldwide sales of semiconductors reached $36.7 billion for the month of November 2019, a decrease of 0.3 percent from the previous month’s total, and 10.8 percent lower than the November 2018 total of $41.1 billion.
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