Wafer surface measurement based on capacitance technology generates 3D images

Published: September 20, 2019

MTi Instruments, Albany, N.Y., has developed the Proforma 300i SA, a benchtop/desktop, semi-automated wafer measurement system for semi-conducting and semi-insulating materials.

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Bruker D8 Discover Plus X-ray diffraction instrument features highly parallel X-ray beam

Published: September 20, 2019

Bruker Corp., Billerica, Mass., has released the D8 Discover Plus x-ray diffraction (XRD) solutions, featuring the new non-coplanar arm and the Montel Plus x-ray optics.

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Zeiss Xradia RepScan measures submicron dimensions of buried features in packages

Published: September 20, 2019

Zeiss, Pleasanton, Calif., introduces the Zeiss Xradia 620 Versa RepScan, a submicron-resolution, 3D nondestructive imaging solution for inspection and measurement that accelerates time to market for advanced IC packages.

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Imec develops improved test vehicle for localization of dielectric breakdown sites

Published: September 18, 2019

Imec, Belgium, has developed a dual-damascene 21nm-pitch test vehicle relevant for manufacturing the 3nm logic technology node.

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Picosun plasma-enhanced ALD enables materials deposition at lower temperatures

Published: September 18, 2019

Picosun Group, Finland, reports excellent results with its next generation R&D PEALD (plasma-enhanced ALD) technology, which enables deposition at low temperatures and of several materials that could not be deposited with thermal processes only.

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SEMI World Fab Forecast predicts new fab projects will reach nearly $50 billion in 2020

Published: September 18, 2019

Semi, Milpitas. Calif., reports in its World Fab Forecast that investments in new fab projects starting construction in 2020 are expected to reach nearly $50 billion, up about $12 billion from 2019.

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Cerebras Systems develops wafer scale engine chip with 1.2 trillion transistors

Published: September 18, 2019

Cerebras Systems, Los Altos, Calif., a startup dedicated to accelerating artificial intelligence computing, announces that it has developed the largest chip ever built: a WSE chip with 71.6 square inches of area.

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Binghamton University to acquire $1.75M HAXPES x-ray system for materials research

Published: September 12, 2019

Binghamton University, New York, announces that the school will acquire a HArd x-ray Photoelectron Spectroscopy system (or HAXPES), which allows researchers to get detailed information about a device or material without taking it apart.

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Zeiss ion beam microscopes feature advances in analytics, tomography, data integrity

Published: September 12, 2019

Zeiss, Germany, announces that its ion beam microscopes now have new capabilities that cover advancements in analytics, tomography, sample preparation, and data integrity.

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Oxford Instruments Ergo software for AFM includes smart algorithms for optimal settings

Published: September 11, 2019

Oxford Instruments, Concord, Mass., announces the launch of the new Ergo software platform for its Asylum Research atomic force microscopes.

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