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1458 items found
Picosun plasma-enhanced ALD coating process replaces ions with low-energy radicals
Published: September 02, 2019
Picosun Group, Finland, reports excellent results obtained with its next generation PEALD (plasma-enhanced ALD) technology, which enables deposition at low temperatures and of several materials that could not be deposited with thermal processes only.
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Shimadzu Vickers micro-hardness testers feature high data reliability and expandability
Published: August 19, 2019
Shimadzu, Japan, has released the HMV-G30 / HMV-G31 series Vickers micro hardness testers, which are equipped with new functions to improve data reliability, to accommodate ISO standards, and to provide high expandability.
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Bruker Hysitron TS 77 test system designed to measure nanometers to micrometers
Published: August 19, 2019
Bruker, Billerica, Mass., introduces the Hysitron TS 77 Select automated benchtop nanomechanical and nanotribological test system, which is built around Bruker’s TriboScope capacitive transducer technology.
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Scanning acoustic microscopy plus Tof-SIMS/AFM enables wafer-level failure analysis
Published: August 19, 2019
Researchers from Imec, Belgium, and the Fraunhofer Institute for Microstructure of Materials and Systems, Germany, will present “GHz-Scanning Acoustic Microscopy Combined with ToF-SIMS/AFM for Wafer-Level Failure Analysis of Bonding Interfaces,” at the 2019 ISTFA Conference in November.
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Tescan Clara ultrahigh-resolution SEM achieves excellent resolution at low beam energies
Published: August 18, 2019
Tescan, Czech Republic, introduces the Tescan Clara ultra-high-resolution scanning electron microscope (UHR-SEM), based on Tescan’s BrightBeam technology, which enables variable, filtered BSE detection.
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Toppan Photomasks to supply GlobalFoundries with photomasks and related services
Published: August 15, 2019
Toppan Photomasks Inc., Round Rock, Texas, and GlobalFoundries, Santa Clara, Calif., announce that they have entered into a multi-year supply agreement in which Toppan will provide GF with photomasks and related services currently supported by GF’s photomask manufacturing operation in Burlington, Vermont.
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Ametek Edax OIM Matrix software enables EBSD simulations and dictionary indexing
Published: August 15, 2019
Ametek Edax Inc., Mahwah, N.J., introduces the OIM Matrix software package, which brings dynamic diffraction-based electron backscatter diffraction (EBSD) pattern simulations and dictionary indexing capabilities to the EBSD market.
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Rigaku X-ray microscope with rotating anode enables 3D images of semiconductors
Published: August 15, 2019
Rigaku Corp., Japan, introduces the Nano3DX, a true X-ray microscope with the ability to deliver 3D computed tomography images of relatively large samples at high resolution.
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Cree to invest $1 billion to grow its Wolfspeed silicon carbide and GaN-on-SiC business
Published: August 14, 2019
Cree Inc., Durham, N.C., announces plans for a $1 billion investment to its headquarters in Durham to expand the company’s silicon carbide materials capabilities and wafer fabrication capacity.
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Thermo Scientific Meridian S enables isolation of electrical faults in semiconductors
Published: August 14, 2019
Thermo Scientific, Hillsboro, Oregon, announces that with the new Thermo Scientific Meridian S inverted static Optical Fault Isolation (OFI) solution, semiconductor failure analysis labs can future-proof their operations with a fully scalable solution.
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