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1458 items found
Intel Custom Foundry to collaborate with USC for integrated circuit design and fabrication
Published: June 09, 2019
The University of Southern California’s Viterbi Information Sciences Institute (ISI) and Intel Custom Foundry announce a collaboration to design, fabricate, and package integrated circuits through its MOSIS unit.
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Thermo Scientific Meridian 7 system provides visible laser voltage imaging and probing
Published: June 09, 2019
Thermo Scientific, Waltham, Mass., has developed the Meridian 7 system, which provides visible laser voltage imaging and probing, as well as dynamic laser stimulation on sub-10nm devices.
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Materion QMet 300 copper-chromium-silver strip alloy designed for high current
Published: June 07, 2019
Materion Corp.,. Mayfield Heights, Ohio, introduces QMet 300 alloy, a high-performance strip alloy that offers a combination of high conductivity, strength, and formability to meet needs in the consumer electronics and automotive markets.
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Sandvik 3D prints diamond composite with high hardness and high heat conductivity
Published: May 23, 2019
Sandvik Additive Manufacturing, Sweden, announces that it has developed a technology for producing a 3D-printed diamond composite part with a complex shape, extremely high hardness, and exceptional heat conductivity.
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Rigaku Smart Sample Loading System enables vacuum chuck to load 50-gram specimens
Published: May 20, 2019
Rigaku, Japan, introduces its new Smart Sample Loading System (SSLS), in which a vacuum chuck can be used to load samples into pre-loaded sample holders, saving time and increasing the number of samples that can be held on the sample deck
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Nanotronics patented Super Resolution imaging system identifies defects in less time
Published: May 17, 2019
Nanotronics, Brooklyn, N.Y., has expanded its Super Resolution imaging system portfolio with a new patented system that identifies and classifies defects at lower resolutions than traditional inspection microscopy, providing faster scan times and enhanced throughput.
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SkyWater selects Veeco’s Waferstorm for 3D monolithic system-on-a-chip development
Published: May 17, 2019
Veeco Instruments Inc., Plainview, N.Y., announces that SkyWater Technology Foundry has taken delivery of the WaferStorm single wafer wet process system to support advanced development work for the design and fabrication of next-generation 3D monolithic System-on-a-Chip (3DSoC) technology.
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U.S. semiconductor industry calls for federal policies to advance chip technology
Published: May 17, 2019
The Semiconductor Industry Association, Washington, has released a set of government policy recommendations for sustaining and strengthening America’s global leadership in semiconductor technology and ensuring that the United States wins the race to harness the transformative semiconductor-enabled technologies of the future.
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Axial Suspension Plasma Sprayed Ceramic Coatings for Semiconductor Applications
Published: May 17, 2019
This ITSC 2019 presentation discusses the plasma treatment of large-scale substrates, because the size of semiconductor and flat-panel-display (FPD) production equipment for dry etching and sputtering has been increasing due to the increased size of both silicon wafers and displays.
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U.S. semiconductor industry calls for federal policies to promote advanced chip technology
Published: May 14, 2019
The Semiconductor Industry Association, Washington, has released a set of government policy recommendations for sustaining and strengthening America’s global leadership in semiconductor technology and ensuring that the United States wins the race to harness the transformative semiconductor-enabled technologies of the future.
News, Magazine & Media / Industry News
