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1458 items found
Saki introduces ultra-fast 2D bottom-side automated optical inspection for PCBs
Published: May 13, 2019
Saki Corp., Japan, announces the release of its new 2Di-LU1 inline bottom-side automated optical inspection system, which automates the bottom-side inspection process, eliminates board flipping and handling, and ensures quality after the potting, dip, wave, and selective soldering processes.
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ON Semiconductor to acquire 300 mm fab from GlobalFoundries for $100 million
Published: May 13, 2019
ON Semiconductor Corp., Phoenix, and GlobalFoundries, Santa Clara, Calif., have entered into a definitive agreement for ON Semiconductor to acquire a 300 mm fab located in East Fishkill, New York.
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Leco metallographic mounting press offers simple operation, touchscreen interface
Published: May 13, 2019
Leco, Saint Joseph, Mich., introduces the MX400 mounting press, which offers dual mount capability, a slim eight-inch design, a simple steel closure, low thermal mass, and energy-efficient heating with substantially faster cooling than previous generations of mounting presses.
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Oxford Instruments NanoAnalysis division wins Queen’s award for X-ray detection system
Published: May 13, 2019
Oxford Instruments, England, announces that its NanoAnalysis division has won the Enterprise 2019 Queen’s Award for the Ultim Extreme detector system which, when used in an electron microscope, enables very low-energy x-rays to be detected in semiconductor samples.
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Thermo Scientific ColorSEM integrates elemental analysis with color imaging
Published: May 13, 2019
Thermo Scientific, Hillsboro, Ore., introduces the ColorSEM, with the first commercial solution that includes elemental analysis integrated with unique color imaging.
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Optotherm thermal imaging microscope designed for semiconductor failure analysis
Published: May 13, 2019
Optotherm, Sewickley, Pa., offers the Sentris thermal imaging microscope, which pinpoints the low-level infrared thermal emissions by IC faults such as short circuits and leakage current.
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Hitachi High-Technologies launches scanning electron microscopes for large specimens
Published: April 22, 2019
Hitachi High-Technologies Corp., Tokyo, announces that it will commence sales of the SU3800 and the oversized SU3900 scanning electron microscopes featuring the ability to accommodate large, heavy specimens, along with advanced functionalities for automated measurement and wide-angle camera navigation.
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Copper nanoparticle pastes bond copper plates into possible future electrodes
Published: April 20, 2019
Scientists at Tohoku University in Japan report that they fabricated an electrode by printing copper nanoparticle-based nanopastes onto a glass substrate using a metal screen mask and pressureless sintering under a nitrogen atmosphere at 200°C for 30?minutes.
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2018 global semiconductor equipment sales jump to record $64.5 billion
Published: April 19, 2019
SEMI, Milpitas, Calif., the industry association representing the worldwide electronics product design and manufacturing supply chain, reports that worldwide sales of semiconductor manufacturing equipment surged 14 percent from $56.62 billion in 2017 to an all-time high of $64.5 billion in 2018
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Siemens Mentor Graphics software selected by Boeing to enable next-gen design
Published: April 19, 2019
Siemens, Plano, Texas, announces that Boeing has entered into an agreement to expand its use of Siemens’ Mentor Graphics software as part of its Second Century Enterprise Systems (2CES) initiative to transform itself, and the aerospace industry, to meet the challenges of the twenty-first century.
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